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The heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liquid flow channel architecture are designed in this work. Heat transfer performance tests of different TFHPs are carried out for different thermal powers. The surface temperature distribution and thermal resistance of the TFHP under different operating conditions are investigated. The experimental results show that the design of the vapor–liquid flow channel significantly impacts the TFHP's heat transfer performance and that the wedge-shaped wick is better suited to the flow channel. The wedge-shaped wick has the lowest thermal resistance of 0.28 °C/W and the most elevated maximum thermal power of 22 W. The heat dispatch performance of the sintered wick TFHP is improved. [ABSTRACT FROM AUTHOR]

With the rapid spread of high-power density equipment, the vapor chamber must adapt to more applicable environments and exhibit a better heat transfer performance. The copper mesh and powder are sintered in this work to make a composite wick vapor chamber (CW-VC). Six sections of copper wire are cut and sintered together with the wick as the inner support column of the CW-VC. The effects of filling ratio and inclination on the heat transfer performance of the vapor chamber are investigated. The experimental results showed that the maximum thermal power of the CW-VC is 23.29 W at the optimal liquid filling ratio of 80% and the lowest thermal resistance is 0.33 °C/W. Below the liquid filling ratio of 60%, when the inclination angle of the CW-VC increases, its thermal resistance increases. At filling ratios of 70%, 80%, and 90%, the inclination angle of 30° can reduce the thermal resistance of the CW-VC. It implies that the inclination angle of the CW-VC can be increased appropriately to reduce the thermal resistance when the filling ratio is high. However, when the liquid filling ratio is low, increasing the inclination angle of the CW-VC will make the liquid film of the evaporator thinner and dry out earlier and its thermal resistance will increase. [ABSTRACT FROM AUTHOR]