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The magnetostructural phase transition in Fe50Al50 alloy with chemically ordered paramagnetic B2 and disordered ferromagnetic (FM) A2 phase has applications in spintronics such as phase-change magnetic memory and magnonic devices. We first conducted a systematic first-principles density functional theory study of the A2 and B2 phases in the Fe50Al50 alloy. A theoretical understanding of this equiatomic alloy's electronic and spin-dynamical properties leads us to the experimental exploration of the FM A2 phase. Therefore, we deposit the 50 nm Fe50Al50 alloy thin film using sputtering and investigate the influence of the Ta buffer layer on its structural and magnetic properties. Our results reveal that the film with a buffer layer exhibits the A2 phase with appreciably higher saturation magnetization (848 emu/cc) than the film without a buffer layer (576 emu/cc). However, the surface roughness and Gilbert damping (α) slightly increase with the presence of the buffer layer from 0.41 to 0.56 nm and 4.35 × 10−3–4.94 × 10−3, respectively. The enhancement in α is due to extrinsic contributions induced by surface inhomogeneities. [ABSTRACT FROM AUTHOR]

This review discusses critical aspects of patterning phase change materials (PCMs), including dry etching, wet clean, and encapsulation, as they dictate the reliability and functionality of the phase change random access memory devices. Specifically, alloys of germanium–antimony–tellurium are used as a model system, and the importance of PCM composition control, critical dimension control, high fidelity pattern transfer, and a system level of ambient control to avoid oxidation that can alter the materials' functionality are highlighted. The research findings motivate the development of a state-of-the-art integrated system that combines dry etch, wet clean, and encapsulation into one platform to realize consistent and successful patterning of PCMs for future generations of the memory devices. [ABSTRACT FROM AUTHOR]

ZnxSbyTez thin films are deposited on quartz or glass substrates by the electron beam evaporation technique in an ultra-high vacuum. A prototype phase change memory device using the ZST (ZnxSbyTez) thin film is fabricated. The current-voltage test results of the device show the threshold voltage of ZST531 (Zn5.18Sb3.75Te1.10 at.%) is 2.4 V, which is similar to that of the device based on pure Ge2Sb2Te5. It is shown that the phase-change device with the ZST film is able to perform several reading and writing cycles and the off/on resistance ratio is nearly 10 under pulse voltage. The switching performance of the device is also investigated. Most importantly, the results of the in situ resistance measurements show that the increase of crystallization temperature and the higher 10-year data retention temperature are as high as 300 °C and 191 °C, respectively. This indicates that the ZnxSbyTez material is quite stable, and thus appropriate for use in phase-change memory. [ABSTRACT FROM AUTHOR]