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The effectiveness of ZrSiN/Zr bilayered films to serve as diffusion barriers in Cu/Si contacts has been investigated. Annealing studies for Cu/ZrSiN/Zr/Si contact systems were carried out in N2/H2(10%) ambient. X-ray diffraction data suggest that Cu film has preferential (111) crystal orientation and Cu silicide cannot be observed up to 700 °C. Scanning electron microscopy micrographs show that the Cu film was integrated and free from agglomeration after annealing at 700 °C. Auger electron spectroscopy depth profiles of the Cu/ZrSiN(10 nm)/Zr(20 nm)/Si samples have no noticeable change except Zr silicide grows with annealing temperature up to 700 °C. The results indicate excellent barrier property for ZrSiN(10 nm)/Zr(20 nm) bilayer structure for Cu metallization. [ABSTRACT FROM AUTHOR]