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We investigate the switching dynamics of a 75°-canted Spin–orbit torque (SOT) device with an in-plane easy axis using the micro-magnetic simulation. The switching time (τ) is evaluated from the time evolution of the magnetization. The device with a strong out-of-plane magnetic anisotropy (μ0Hkeff = −0.08 T) shows τ = 0.19 ns while a device with a strong in-plane magnetic anisotropy (μ0Hkeff = −0.9 T) shows τ = 0.32 ns. The increase of the damping constant (α) results in the increase of τ for both devices and the sub-nanosecond switching could be retained as α < 0.14 in the device with μ0Hkeff = −0.08 T, while this was achieved as α < 0.04 in the device with μ0Hkeff = −0.9 T. Furthermore when the field-like coefficient (β) is increased, it leads to a decrease in τ, which can be reduced to 0.03 ns by increasing β to 1 in the device with μ0Hkeff = −0.08 T. In order to achieve the same result in the device with μ0Hkeff = −0.9 T, β must be increased to 6. These results indicate a way to achieve ultrafast field-free SOT switching of a few tens of picoseconds in nanometer-sized magnetic tunnel junction (MTJ) devices. [ABSTRACT FROM AUTHOR]

We improve thermal tolerance of a Co/Pt based synthetic ferrimagnetic (SyF) reference layer in a CoFeB/MgO-based perpendicular anisotropy magnetic tunnel junction by employing a surface modification treatment (SMT) using Ar plasma on a Pt buffer layer underneath the SyF layer. A higher perpendicular anisotropy and more robustness against annealing for the SyF reference layer is observed by the employment of SMT. From the cross-sectional scanning transmission electron microscope of the magnetic tunnel junction and atomic force microscopy on the Pt buffer layer, SMT has no significant effect on the surface roughness of the Pt buffer layer. On the other hand, X-ray diffraction analysis reveals that SMT increases the lattice spacing of the Pt buffer layer and shrinks that of the Co/Pt multilayer, which are maintained after annealing at 400 °C. Those structural changes could lead to the improvement of perpendicular anisotropy and thermal tolerance against annealing. A high-resolution Rutherford backscattering analysis reveals that Ar ions used for SMT penetrate to the Pt buffer layer, resulting in variation of the lattice spacing for the Pt buffer layer and Co/Pt multilayer. In addition, suppression of Fe diffusion from the CoFeB reference layer to the bottom Co/Pt multilayer is observed by using energy dispersive X-ray spectrometry, which also contributes to the higher thermal tolerance against annealing. The present observation reveals that the employment of SMT enables one to obtain both high perpendicular magnetic anisotropy and high robustness against annealing through crystallographic change of the Co/Pt multilayer and suppression of Fe diffusion from CoFeB layer into the Co/Pt multilayer. [ABSTRACT FROM AUTHOR]

Dynamic magnetic properties of Ta-O/Co20Fe60B20 bilayer films are strongly influenced by the oxidation condition of the Ta-O layer. The oxidation of the Ta-O layer by a slight amount of oxygen with a pressure (POxygen) of 0.03 Pa decreases in-plane damping constant (αIP), and increases the effective magnetization (4πMs,eff). Then, both αIP and 4πMs,eff maintain their values by increasing POxygen up to 0.3 Pa. The out-of-plane damping constant (αOP) showed a similar tendency to that of αIP against POxygen, although αOP is much smaller than αIP in every POxygen. αOP reaches to 0.0033 for sample oxidized at 0.03 Pa. It was suggested that αIP consists of both the intrinsic damping and the extrinsic damping, while αOP is closer to the intrinsic damping. The control of αOP and αIP by the oxidation would be beneficial in designing the high frequency spintronic devices. [ABSTRACT FROM AUTHOR]

In order to recover the patterning damage and improve the electric and magnetic properties of the patterned magnetic tunnel junctions (MTJs), the novel post-treatment process using oxygen ions has been studied. Generally, the oxygen is known as an unsuitable gas for the MTJs patterning because it causes degradation of the patterned MTJs by over-oxidation of MgO. By the way, if the damaged layer could be oxidized selectively without over-oxidation of the damage-less area, oxygen can be the most effective gas to recover the patterning damage of the MTJs. In this study, for the selective oxidation, we proposed the non-reactive oxygen treatment scheme called the oxygen showering post-treatment process (OSP) using an ozone diffusion chamber. By the specific OSP conditions, 8 l/min of the flow rate, 250 °C of the temperature, and 30 s of the time, the magneto-resistance (MR) was increased from 103% to 110%, and the switching current was decreased from 41.1 μA to 31.6 μA when compared with reference data at the same resistance level. These results show that the electric and magnetic properties of the patterned MTJs by the OSP treatment have been improved compared to the reference sample. The improvement in electric and magnetic properties by the OSP treatment is assumed because the reference sample already contains slight patterning damages at the edge of the MTJs despite the optimized patterning process, and these damages have been oxidized by the OSP treatment. Moreover, by the OSP treatment, the proportion of the electric short fail was dramatically decreased from 1.51% to 0%, which is a remarkable improvement in terms of a successful commercialization of spintronic devices. [ABSTRACT FROM AUTHOR]

Magnetic coupling between two CoFeB layers through the W insertion layer is important in the conventional double CoFeB/MgO interface, magnetic tunneling junctions (MTJs) (double-MTJs) with MgO/CoFeB/W/CoFeB/MgO free layer stack because it increases the effective magnetic volume of the free layer. The magnetic coupling energy constant per unit area, Jcpl, between two CoFeB layers through the W layer and the effective perpendicular magnetic anisotropy (PMA) energy constant per unit area, Kefft*, were investigated for conventional double-MTJs with various W insertion layer thicknesses. As the W layer thickness increased, Kefft* increased and Jcpl decreased. There exists a trade-off relationship between Jcpl and Kefft*. In conventional double-MTJs with a single W insertion layer, large values for Jcpl and Kefft* were difficult to obtain simultaneously. To improve this tradeoff, we employed a free layer stack with a thin ferromagnetic layer (ferromagnetic bridge layer: FBL) located in the W insertion layer. In the double-MTJs with FBL annealed at 400 °C, a large Jcpl value of 0.37 mJ/m2 was achieved while maintaining the maximum values of Kefft*. Accordingly, the MTJ with FBL provides an MTJ stack structure for obtaining high thermal stability. [ABSTRACT FROM AUTHOR]

We investigated the effects of surface modification treatment (SMT) on the perpendicular magnetic anisotropy (PMA) and the thermal tolerance of top-pinned magnetic tunnel junctions (MTJs) with a Co/Pt synthetic ferrimagnetic coupling reference layer. Applying an SMT to the bottom Pt layer increased the PMA of the overlying Co/Pt multilayer. X-ray diffraction spectrum analysis revealed that the SMT resulted in a higher crystallinity and smaller lattice spacing in the Co/Pt multilayer in the thinner bottom Pt layer, which may have increased the PMA in the Co/Pt multilayer. The tunnel magnetoresistance (TMR) ratio of the MTJ with SMT increased as the annealing temperature was increased up to 400 °C; conversely, the TMR ratio of the MTJ without SMT decreased at an annealing temperature of 400 °C. Evaluation of the m-H loops revealed that, after annealing at 400 °C, the reference layers in the MTJs after SMT possessed better magnetic properties than those in the MTJs without an SMT; this is attributable to the higher PMA of the reference layers with SMT. EDX line analysis revealed that SMT suppressed Pt diffusion to the MgO barrier, resulting in a higher thermal tolerance and larger PMA of the reference layer. [ABSTRACT FROM AUTHOR]

We investigate the effect of the capping layer on the thermal tolerance of magnetic tunnel junctions (MTJs) with free layer of MgO/CoFeB/spacer layer/CoFeB/MgO/capping layers (CoFeB, Ru, or Ta). We observe the largest perpendicular magnetic anisotropy energy density for the free layer with CoFeB capping layer using Ta spacer after annealing at 400°C for 1 h. Energy-dispersive X-ray (EDX) line analysis along film normal direction reveals the absorption of oxygen in MgO by Ta in the stack with Ta capping layer and Ru diffusion into CoFeB free layer in the stack with Ru capping layer, which could cause the reduction of perpendicular magnetic anisotropy. We also evaluate annealing temperature dependence of magnetic properties for the MTJ stacks with different spacer layer. We again observe the largest perpendicular magnetic anisotropy energy density for the MTJ stack using the CoFeB capping layer. The present study reveals that CoFeB capping layer is effective for achieving improved robustness against annealing. [ABSTRACT FROM AUTHOR]

Presents information on a study which investigated the growth kinetics of ultrathin silicon dioxide films formed by oxidation in a nitrogen[sub2] oxygen ambient. Experimental procedure; Results and discussion; Conclusion.

To identify the degradation mechanism in magnetic tunnel junctions (MTJs) using hydrogen, the properties of the MTJs were measured by applying an additional hydrogen etch process and a hydrogen plasma process to the patterned MTJs. In these studies, an additional 50 s hydrogen etch process caused the magnetoresistance (MR) to decrease from 103% to 14.7% and the resistance (R) to increase from 6.5 kX to 39 kX. Moreover, an additional 500 s hydrogen plasma process decreased the MR from 103% to 74% and increased R from 6.5 kX to 13.9 kX. These results show that MTJs can be damaged by the hydrogen plasma process as well as by the hydrogen etch process, as the atomic bonds in MgO may break and react with the exposed hydrogen gas. Compounds such as MgO hydrate very easily. We also calculated the damaged layer width (DLW) of the patterned MTJs after the hydrogen etching and plasma processes, to evaluate the downscaling limitations of spin-transfer-torque magnetic randomaccess memory (STT-MRAM) devices. With these calculations, the maximum DLWs at each side of the MTJ, generated by the etching and plasma processes, were 23.8 nm and 12.8 nm, respectively. This result validates that the hydrogen-based MTJ patterning processes cannot be used exclusively in STTMRAMs beyond 20 nm. [ABSTRACT FROM AUTHOR]

The robustness of data load of metal-oxide-semiconductor/magnetic tunnel junction (MOS/MTJ) hybrid latches at power-on is examined by using Monte Carlo simulation with the variations in magnetoresistances for MTJs and in threshold voltages for MOSFETs involved in 90 nm technology node. Three differential pair type spin-transfer-torque-magnetic random access memory cells (4T2MTJ, 6T2MTJ, and 8T2MTJ) are compared for their successful data load at power-on. It is found that the 4T2MTJ cell has the largest pass area in the shmoo plot in TMR ratio (tunnel magnetoresistance ratio) and Vdd in which a whole 256 kb cell array can be powered-on successfully. The minimum TMR ratio for the 4T2MTJ in 0.9Vdd<1.9V is 140%, while the 6T2MTJ and the 8T2MTJ cells require TMR ratio larger than 170%. [ABSTRACT FROM AUTHOR]

A compact nonvolatile programmable switch (NVPS) using 90 nm CMOS technology together with perpendicular magnetic tunnel junction (p-MTJ) devices is fabricated for zero-standby-power field-programmable gate array. Because routing information does not change once it is programmed into an NVPS, high-speed read and write accesses are not required and a write-control transistor can be shared among all the NVPSs, which greatly simplifies structure of the NVPS. In fact, the effective area of the proposed NVPS is reduced by 40% compared to that of a conventional MTJ-based NVPS. The instant on/off behavior without external nonvolatile memory access is also demonstrated using the fabricated test chip. [ABSTRACT FROM AUTHOR]

We investigated properties of perpendicular-anisotropy magnetic tunnel junctions (p-MTJs) with [Co/Pt]-multilayer based synthetic ferrimagnetic reference (SyF) layer at elevated annealing temperature Ta from 350°C to 400°C. Shift field HS defined as center field of minor resistance versus magnetic field curve of the MTJs increased with increase of Ta from 350°C to 400°C. The variation of HS is attributed to the variation of saturation magnetic moment in the SyF reference layer. Cross sectional energy dispersive X-ray spectroscopy analysis revealed that Fe element of CoFeB in the reference layer diffuses to Co/Pt multilayers in the SyF reference layer. [ABSTRACT FROM AUTHOR]

A compact 6-input lookup table (LUT) circuit using nonvolatile logic-in-memory (LIM) architecture with series/parallel-connected magnetic tunnel junction (MTJ) devices is proposed for a standby-power-free field-programmable gate array. Series/parallel connections of MTJ devices make it possible not only to reduce the effect of resistance variation, but also to enhance the programmability of resistance values, which achieves a sufficient sensing margin even when process variation is serious in the recent nanometer-scaled VLSI. Moreover, the additional MTJ devices do not increase the effective chip area because the configuration circuit using MTJ devices is simplified and these devices are stacked over the CMOS plane. As a result, the transistor counts of the proposed circuit are reduced by 62% in comparison with those of a conventional nonvolatile LUT circuit where CMOS-only-based volatile static random access memory cell circuits are replaced by MTJ-based nonvolatile ones. [ABSTRACT FROM AUTHOR]