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Mg-doped, graded AlGaN films showed the formation of an impurity band and high, temperature-invariant p-conductivity even for doping levels well below the Mott transition. However, compensating point defects disrupted the impurity band, resulting in an Anderson transition from the impurity band to valence band conduction and a more than tenfold reduction in room-temperature conductivity. This is the first demonstration of Anderson-like localization in AlGaN films. [ABSTRACT FROM AUTHOR]

High room temperature n-type mobility, exceeding 300 cm2/Vs, was demonstrated in Si-doped AlN. Dislocations and CN−1 were identified as the main compensators for AlN grown on sapphire and AlN single crystalline substrates, respectively, limiting the lower doping limit and mobility. Once the dislocation density was reduced by the growth on AlN wafers, C-related compensation could be reduced by controlling the process supersaturation and Fermi level during growth. While the growth on sapphire substrates supported only high doping ([Si] > 5 × 1018 cm−3) and low mobility (∼20 cm2/Vs), growth on AlN with proper compensation management enabled controlled doping at two orders of magnitude lower dopant concentrations. This work is of crucial technological importance because it enables the growth of drift layers for AlN-based power devices. [ABSTRACT FROM AUTHOR]

We demonstrate a pathway employing crystal polarity controlled asymmetric impurity incorporation in the wide bandgap nitride material system to enable 3D doping control during the crystal growth process. The pathway involves polarity specific supersaturation modulated growth of lateral polar structures of alternating Ga- and N-polar GaN domains. A STEM technique of integrated differential phase contrast is used to image the atomic structure of the different polar domains and their single atomic plane boundaries. As a demonstration, 1 μm wide alternating Ga- and N-polar GaN domains exhibiting charge balanced and periodic domains for superjunction technology were grown. The challenges in characterizing the resulting 3D doping profile were addressed with atom probe tomography with atomic scale compositional resolution corroborating capacitance measurements and secondary-ion mass spectroscopy analysis. [ABSTRACT FROM AUTHOR]

Ge doping in AlGaN was studied over a wide dopant concentration range. For high Ge concentrations, the formation of VIII–nGeIII was determined to be the main point defect limiting the conductivity. It was shown that the complex formation could be suppressed by controlling chemical potentials during growth, leading to a higher maximum achievable carrier concentration and selective stabilization of a certain complex type. Chemical potential of the growth species was varied by changing the V/III ratio and growth temperature. Free carrier concentrations as high as 4 × 1019 cm−3 were achieved in Al0.4Ga0.6N:Ge grown on sapphire substrates under "metal-rich" conditions. The ability to control the onset of self-compensation and to stabilize a certain charge state of the compensating defect is of great technological importance for application of AlGaN in various devices. [ABSTRACT FROM AUTHOR]

Contrary to the arsenides where donors undergo stable DX transition, we find that Ge in AlGaN does not suffer from the DX transition; instead, it undergoes a shallow donor (30 meV) to deep donor (150 meV) transition at ∼50% Al content in the alloy. This finding is of profound technological importance as it removes fundamental doping limitations in AlGaN and AlN imposed by the presumed DX−1 acceptor state. The charge state of Ge below and above the transition was determined by co-doping with Si, which remains a shallow donor in AlGaN for up to 80% Al. It was found that Ge occupied a donor state with a (0/+) thermodynamic transition for AlGaN alloys below and above the transition. Ge as a shallow donor was completely ionized at room temperature; however, the ionization of the deep donor required elevated temperatures, commensurate with its higher ionization energy. This behavior is not unique to Ge; preliminary findings show that Si and O in AlGaN may behave similarly. [ABSTRACT FROM AUTHOR]

Reduction in compensation in Si-doped Al-rich AlGaN is demonstrated via chemical potential control (CPC). The chemical potentials and the resulting formation energies of carbon on the nitrogen site (CN) and cation vacancy complex with Si (VIII + nSiIII) were related to growth variables through a thermodynamic supersaturation model, which quantitatively predicted the incorporation of CN and the generation of the VIII + nSiIII complex. The compensation "knee" behavior, i.e., decreasing conductivity with increasing Si incorporation beyond a certain concentration, was successfully controlled. The maximum free carrier concentration was improved by impeding the formation of VIII + nSiIII complexes under III-richer conditions, while the impurity compensation by CN was reduced by making the growth environment N-richer. The results of Hall effect measurement and photoluminescence agreed well with quantitative theoretical predictions of the CPC model. Based on the developed model, the highest conductivity of 160 Ω−1 cm−1 with free carrier concentration of 3 × 1019 cm−3 in Al0.7Ga0.3N ever reported was achieved on single crystal AlN substrates. The demonstrated predictive power of the CPC model should greatly reduce the empirical analysis or iterative experimentation that would otherwise be necessary. [ABSTRACT FROM AUTHOR]

The influence of the polarization field on the emission properties of the AlGaN-based quantum structures grown on AlN substrates was investigated as a function of well width, barrier width, and barrier height. A thin AlGaN well and a thin AlN barrier design reduced the polarization field to ∼0.5 MV/cm, resulting in an ultralow laser threshold of 3 kW/cm2 in an optically pumped configuration. These experimental results were used to validate the simulation. In the next step, a structure with Al0.7Ga0.3N barriers was designed to support carrier injection with a minimal loss in optical performance. This structure showed a threshold of 7 kW/cm2 under optical pumping and an estimated threshold current of 8 kA/cm2 for the electric injection. [ABSTRACT FROM AUTHOR]

High p-conductivity (0.7 Ω−1 cm−1) was achieved in high-Al content AlGaN via Mg doping and compositional grading. A clear transition between the valence band and impurity band conduction mechanisms was observed. The transition temperature depended strongly on the compositional gradient and to some degree on the Mg doping level. A model is proposed to explain the role of the polarization field in enhancing the conductivity in Mg-doped graded AlGaN films and the transition between the two conduction types. This study offers a viable path to technologically useful p-conductivity in AlGaN. [ABSTRACT FROM AUTHOR]

Highly conductive Ge-doped AlN with conductivity of 0.3 (Ω cm)−1 and electron concentration of 2 × 1018 cm−3 was realized via a non-equilibrium process comprising ion implantation and annealing at a moderate thermal budget. Similar to a previously demonstrated shallow donor state in Si-implanted AlN, Ge implantation also showed a shallow donor behavior in AlN with an ionization energy ∼80 meV. Ge showed a 3× higher conductivity than its Si counterpart for a similar doping level. Photoluminescence spectroscopy indicated that higher conductivity for Ge-doped AlN was achieved primarily due to lower compensation. This is the highest n-type conductivity reported for AlN doped with Ge to date and demonstration of technologically useful conductivity in Ge-doped AlN. [ABSTRACT FROM AUTHOR]

Record-low p-type resistivities of 9.7 and 37 Ω cm were achieved in Al0.7Ga0.3N and Al0.8Ga0.2N films, respectively, grown on single-crystal AlN substrate by metalorganic chemical vapor deposition. A two-band conduction model was introduced to explain the anomalous thermal behavior of resistivity and the Hall coefficient. Relatively heavy Mg doping (5 × 1019 cm−3), in conjunction with compensation control, enabled the formation of an impurity band exhibiting a shallow activation energy of ∼30 meV for a wide temperature range. Valence band conduction associated with a large Mg ionization energy was dominant above 500 K. The apparently anomalous results deviating from the classical semiconductor physics were attributed to fundamentally different Hall scattering factors for impurity and valence band conduction. This work demonstrates the utility of impurity band conduction to achieve technologically relevant p-type conductivity in Al-rich AlGaN. [ABSTRACT FROM AUTHOR]

A thermodynamic supersaturation model for growth of AlGaN by metalorganic chemical vapor deposition was developed for experimentally accessible growth parameters. The derived non-linear relationships enabled us to estimate Ga and Al supersaturation during AlGaN growth for given growth conditions. Calculations revealed that the GaN phase was close to chemical equilibrium, while the Al supersaturation was as high as 1010 for typical growth conditions. Such a disparity in the supersaturation of reaction species plays a significant role in the stability of the growth of the resulting ternary alloy. The agreement between experiment and simulation suggests that the parasitic gas phase reactions between trimethylaluminum and NH3 were not significant at low NH3 flow rates/partial pressures, indicating that, under these conditions, the AlGaN growth was thermodynamically limited. [ABSTRACT FROM AUTHOR]

The thermal conductivity of GaN crystals grown by different techniques is analyzed using the 3ω method in the temperature range of 30 K to 295 K. GaN wafers grown by the ammonothermal method show a significant variation in thermal conductivity at room temperature with values ranging between 164 W m−1 K−1 and 196 W m−1 K−1. GaN crystals produced with the sodium flux and hydride vapor phase epitaxy methods show results of 211 W m−1 K−1 and 224 W m−1 K−1, respectively, at room temperature. Analysis using secondary ion mass spectrometry indicates varying amounts of impurities between the respective crystals and explains the behavior of thermal conductivity trends in the samples. The observed difference between thermal conductivity curves suggests that scattering of phonons at point defects dominates the thermal conductivity of GaN within the investigated temperature range. Deviations of model curves from thermal conductivity measurements and disparities between modelled characteristic lengths and actual sample thicknesses indicate that phonon resonances are active in GaN. [ABSTRACT FROM AUTHOR]

The average bulk thermal conductivity of free-standing physical vapor transport and hydride vapor phase epitaxy single crystal AlN samples with different impurity concentrations is analyzed using the 3ω method in the temperature range of 30–325 K. AlN wafers grown by physical vapor transport show significant variation in thermal conductivity at room temperature with values ranging between 268 W/m K and 339 W/m K. AlN crystals grown by hydride vapor phase epitaxy yield values between 298 W/m K and 341 W/m K at room temperature, suggesting that the same fundamental mechanisms limit the thermal conductivity of AlN grown by both techniques. All samples in this work show phonon resonance behavior resulting from incorporated point defects. Samples shown by optical analysis to contain carbon-silicon complexes exhibit higher thermal conductivity above 100 K. Phonon scattering by point defects is determined to be the main limiting factor for thermal conductivity of AlN within the investigated temperature range. [ABSTRACT FROM AUTHOR]

A two-band transport model is proposed to explain electrical conduction in graded aluminum gallium nitride layers, where the free hole conduction in the valence band is favored at high temperatures and hopping conduction in the impurity band dominates at low temperatures. The model simultaneously explains the significantly lowered activation energy for p-type conduction (∼10 meV), a nearly constant sheet conductivity at lower temperatures (200–330 K), and the anomalous reversal of the Hall coefficient caused by the negative sign of the Hall scattering factor in the hopping conduction process. A comparison between the uniform and graded samples suggests that compositional grading significantly enhances the probability of phonon-assisted hopping transitions between the Mg atoms. [ABSTRACT FROM AUTHOR]

A theoretical framework that provides a quantitative relationship between point defect formation energies and growth process parameters is presented. It enables systematic point defect reduction by chemical potential control in metalorganic chemical vapor deposition (MOCVD) of III-nitrides. Experimental corroboration is provided by a case study of C incorporation in GaN. The theoretical model is shown to be successful in providing quantitative predictions of CN defect incorporation in GaN as a function of growth parameters and provides valuable insights into boundary phases and other impurity chemical reactions. The metal supersaturation is found to be the primary factor in determining the chemical potential of III/N and consequently incorporation or formation of point defects which involves exchange of III or N atoms with the reservoir. The framework is general and may be extended to other defect systems in (Al)GaN. The utility of equilibrium formalism typically employed in density functional theory in predicting defect incorporation in non-equilibrium and high temperature MOCVD growth is confirmed. Furthermore, the proposed theoretical framework may be used to determine optimal growth conditions to achieve minimum compensation within any given constraints such as growth rate, crystal quality, and other practical system limitations. [ABSTRACT FROM AUTHOR]

We report on the absence of strain relaxation mechanism in Al0.6Ga0.4N epilayers grown on (0001) AlN substrates for thickness as large as 3.5 μm, three-orders of magnitude beyond the Matthews–Blakeslee critical thickness for the formation of misfit dislocations (MDs). A steady-state compressive stress of 3–4 GPa was observed throughout the AlGaN growth leading to a large lattice bow (a radius of curvature of 0.5 m−1) for the thickest sample. Despite the large lattice mismatch-induced strain energy, the epilayers exhibited a smooth and crack-free surface morphology. These results point to the presence of a large barrier for nucleation of MDs in Al-rich AlGaN epilayers. Compositionally graded AlGaN layers were investigated as potential strain relief layers by the intentional introduction of MDs. While the graded layers abetted MD formation, the inadequate length of these MDs correlated with insignificant strain relaxation. This study emphasizes the importance of developing strain management strategies for the implementation of the single-crystal AlN substrate platform for III-nitride deep-UV optoelectronics and power electronics. [ABSTRACT FROM AUTHOR]

The ultra-wide bandgap of Al-rich AlGaN is expected to support a significantly larger breakdown field compared to GaN, but the reported performance thus far has been limited by the use of foreign substrates. In this Letter, the material and electrical properties of Al0.85Ga0.15N/Al0.6Ga0.4N high electron mobility transistors (HEMT) grown on a 2-in. single crystal AlN substrate are investigated, and it is demonstrated that native AlN substrates unlock the potential for Al-rich AlGaN to sustain large fields in such devices. We further study how Ohmic contacts made directly to a Si-doped channel layer reduce the knee voltage and increase the output current density. High-quality AlGaN growth is confirmed via scanning transmission electron microscopy, which also reveals the absence of metal penetration at the Ohmic contact interface and is in contrast to established GaN HEMT technology. Two-terminal mesa breakdown characteristics with 1.3 μm separation possess a record-high breakdown field strength of ∼11.5 MV/cm for an undoped Al0.6Ga0.4N-channel layer. The breakdown voltages for three-terminal devices measured with gate-drain distances of 4 and 9 μm are 850 and 1500 V, respectively. [ABSTRACT FROM AUTHOR]

Record low resistivities of 10 and 30 Ω cm and room-temperature free hole concentrations as high as 3 × 1018 cm−3 were achieved in bulk doping of Mg in Al0.6Ga0.4N films grown on AlN single crystalline wafer and sapphire. The highly conductive films exhibited a low ionization energy of 50 meV and impurity band conduction. Both high Mg concentration (>2 × 1019 cm−3) and low compensation were required to achieve impurity band conduction and high p-type conductivity. The formation of VN-related compensators was actively suppressed by chemical potential control during the deposition process. This work overcomes previous limitations in p-type aluminum gallium nitride (p-AlGaN) and offers a technologically viable solution to high p-conductivity in AlGaN and AlN. [ABSTRACT FROM AUTHOR]

In this paper, facet formation of (0001) { 11 2 ¯ 0 } { 11 2 ¯ 2 } facets during epitaxial lateral overgrowth (ELO) of GaN is investigated for different Ga vapor supersaturations. The ELO was conducted via metalorganic chemical vapor deposition on patterned GaN/sapphire templates with SiO2 masks aligned along the ⟨ 1 1 ¯ 00 ⟩ direction of GaN. Scanning electron microscopy was used to characterize the cross section shapes of the ELO GaN islands. A correlation of supersaturation, facet formation, and the shape of the ELO GaN islands is found. It is shown that { 11 2 ¯ 2 } facets are favored under high Ga vapor supersaturation, while { 11 2 ¯ 0 } facets are favored under low Ga vapor supersaturation. A qualitative model based on Wulff construction and density functional theory calculation is proposed to illustrate the mechanism of the facet formation of the ELO GaN islands. [ABSTRACT FROM AUTHOR]

We demonstrate that theoretical breakdown fields can be realized in practically dislocation free Al-rich AlGaN p-n junctions grown on AlN single crystal substrates. Furthermore, we also demonstrate a leakage current density in AlGaN that is independent of the device area, indicating a bulk leakage phenomenon and not surface or mesa-edge related. Accordingly, we identified the Poole–Frenkel emission from two types of point-defect traps in AlGaN as the primary source of reverse leakage before breakdown. Mg-doped AlGaN exhibited leakage currents due to a shallow trap at ∼0.16 eV in contrast with leakage currents observed in Si-doped AlGaN due to a deep trap at ∼1.8 eV. [ABSTRACT FROM AUTHOR]

In the low doping range below 1 ×1017cm-3, carbon was identified as the main defect attributing to the sudden reduction of the electron mobility, the electron mobility collapse, in n-type GaN grown by low pressure metalorganic chemical vapor deposition. Secondary ion mass spectroscopy has been performed in conjunction with C concentration and the thermodynamic Ga supersaturation model. By controlling the ammonia flow rate, the input partial pressure of Ga precursor, and the diluent gas within the Ga supersaturation model, the C concentration in Si-doped GaN was controllable from 6 ×1019cm-3 to values as low as 2 ×1015cm-3. It was found that the electron mobility collapsed as a function of free carrier concentration, once the Si concentration closely approached the C concentration. Lowering the C concentration to the order of 1015cm-3 by optimizing Ga supersaturation achieved controllable free carrier concentrations down to 5 × 1015cm-3 with a peak electron mobility of 820 cm²/V s without observing the mobility collapse. The highest electron mobility of 1170 cm²/V s was obtained even in metalorganic vapor deposition-grown GaN on sapphire substrates by optimizing growth parameters in terms of Ga supersaturation to reduce the C concentration. [ABSTRACT FROM AUTHOR]

We show experimentally that deep point defect levels in GaN, AlN, and AlGaN are constant with respect to the vacuum level and can be used as invariant internal energy references. This offered a convenient and quick way to assess band shifts and impurity levels as a function of temperature via photoluminescence. For AlGaN, we determined that the band shift in the temperature range of 3–600 K occurred primarily in the valence band and that the lowering of the conduction band edge was comparatively small. The valence band shift (as a fraction of the Varshni bandgap shift) in AlGaN varies from ∼70% in AlN to ∼90% in GaN. [ABSTRACT FROM AUTHOR]

Enhanced light extraction efficiency was demonstrated on nanostructure patterned GaN and AlGaN/AlN Multiple-Quantum-Well (MQW) structures using mass production techniques including natural lithography and interference lithography with feature size as small as 100 nm. Periodic nanostructures showed higher light extraction efficiency and modified emission profile compared to non-periodic structures based on integral reflection and angular-resolved transmission measurement. Light extraction mechanism of macroscopic and microscopic nanopatterning is discussed, and the advantage of using periodic nanostructure patterning is provided. An enhanced photoluminescence emission intensity was observed on nanostructure patterned AlGaN/AlN MQW compared to as-grown structure, demonstrating a large-scale and mass-producible pathway to higher light extraction efficiency in deep-ultra-violet light-emitting diodes. [ABSTRACT FROM AUTHOR]

The interfaces of m- and c-plane AlN with metals of different work functions and electro-negativities were characterized and the Schottky barrier heights were measured. The Schottky barrier height was determined by measuring the valence band maximum (VBM) with respect to the Fermi level at the surface (interface) before (after) metallization. VBM determination included accurate modeling and curve fitting of density of states at the valence band edge with the XPS data. The experimental behavior of the barrier heights could not be explained by the Schottky-Mott model and was modeled using InterFace-Induced Gap States (IFIGS). A slope parameter (SX) was used to incorporate the density of surface states and is a measure of Fermi level pinning. The experimental barriers followed theoretical predictions with a barrier height at the surface Fermi level (Charge neutrality level (CNL)) of ∼2.1 eV (∼2.7 eV) on m-plane (c-plane) and SX∼0.36 eV/Miedema unit. Slope parameter much lower than 0.86 implied a surface/interface states dominated behavior with significant Fermi level pinning and the measured barrier heights were close to the CNL. Titanium and zirconium provided the lowest barriers (1.6 eV) with gold providing the highest (2.3 eV) among the metals analyzed on m-plane. It was consistently found that barrier heights decreased from metal polar to non-polar surfaces, in general, due to an increasing CNL. The data indicated that charged IFIGS compensate spontaneous polarization charge. These barrier height and slope parameter measurements provided essential information for designing Schottky diodes and other contact-based devices on AlN. [ABSTRACT FROM AUTHOR]

AlN homoepitaxial films were grown by metalorganic chemical vapor deposition on chemomechanically polished (1100)-oriented single crystalline AlN substrates. The dependence of the surface morphology, structural quality, and unintentional impurity concentrations on the growth temperature was studied in order to determine the most appropriate growth conditions for high quality (1100) AlN epitaxial layers. Optically smooth surfaces (RMS roughness of 0.4 nm) and high crystalline quality, as demonstrated by the presence of FWHM values for (1010) rocking curves along [0001] of less than 25 arc-sec, were achieved for films grown above 1350 °C. Furthermore, sharp and intense near band edge luminescence was observed in these high quality films. A reduction in unintentional oxygen impurity levels was seen with an increase in growth temperature. These high crystalline quality films are suitable for device applications and hold great potential for providing an ideal platform for deep UV emitters with high Al content AlGaN without polarization related effects. [ABSTRACT FROM AUTHOR]

We demonstrate Si-implanted AlN with high conductivity (>1 Ω−1 cm−1) and high carrier concentration (5 × 1018 cm−3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) (<103 cm−2), a non-equilibrium damage recovery and dopant activation annealing process, and in situ suppression of self-compensation during the annealing. Low TDD and active suppression of VAl-nSiAl complexes via defect quasi Fermi level control enabled low compensation, while low-temperature, non-equilibrium annealing maintained the desired shallow donor state with an ionization energy of ∼70 meV. The realized n-type conductivity and carrier concentration are over one order of magnitude higher than that reported thus far and present a major technological breakthrough in doping of AlN. [ABSTRACT FROM AUTHOR]

Self-compensation in Ge- and Si-doped Al0.3Ga0.7N has been investigated in terms of the formation of III vacancy and donor-vacancy complexes. Both Ge- and Si-doped AlGaN layers showed a compensation knee behavior with impurity compensation (low doping regime), compensation plateau (medium doping regime), and self-compensation (high doping regime). A maximum free carrier concentration of 4–5 × 1019 cm−3 was obtained by Ge doping, whereas Si doping resulted in only half of that value, ∼2 × 1019 cm−3. A DFT calculation with the grand canonical thermodynamics model was developed to support the hypothesis that the difference in self-compensation arises from the difference in the formation energies of the VIII-n•donor complexes relative to their onsite configurations. The model suggested that the VIII-2•donor and VIII-3•donor complexes were responsible for self-compensation for both Ge- and Si-doped AlGaN. However, a lower free carrier concentration in Si-doped samples was due to a high VIII-3•Si concentration, resulting from a lower energy of formation of VIII-3•Si. [ABSTRACT FROM AUTHOR]

High-resolution photoluminescence studies on m-plane (1-100) homoepitaxial films grown by metalorganic chemical vapor deposition on AlN revealed several sharp donor-bound exciton (DBX) peaks with a full width at half maximum as narrow as 550 μeV. Power dependent hotoluminescence distinguished DBXs tied to the Γ5 free exciton (FX) from those tied to the 1Γ FX. Both the n=2 and n=1 excited states of the Γ5 and Γ1 were resolved, giving binding energies of 52meV and 55 meV, respectively. The DBX transition at 6.006 eV was identified as originating from the neutral-donor-oxygen (O0X). This assignment was based on secondary ion mass spectroscopy measurements, peak position with respect to the Si0X, and deep defect luminescence peaks located at 3.25 eV and 3.58 eV.VC 2014 AIP Publishing LLC. [http://dx.doi.org/10.1063/1.4870284] [ABSTRACT FROM AUTHOR]

Optical gain spectra for ~250 nm stimulated emission were compared in three different AlGaN-based structures grown on single crystalline AlN substrates: a single AlGaN film, a double heterostructure (DH), and a Multiple Quantum Well (MQW) structure; respective threshold pumping power densities of 700, 250, and 150 kW/cm2 were observed. Above threshold, the emission was transverse-electric polarized and as narrow as 1.8 nm without a cavity. The DH and MQW structures showed gain values of 50–60 cm–1 when pumped at 1MW/cm2. The results demonstrated the excellent optical quality of the AlGaN-based heterostructures grown on AlN substrates and their potential for realizing electrically pumped sub-280 nm laser diodes. [ABSTRACT FROM AUTHOR]

The development of terahertz (THz) spintronics has created a paradigm shift in the generation of THz radiation through the combination of ultrafast magnetism and spin-based electronics. However, research in this area has primarily focused on all-metallic devices comprising a ferromagnetic thin film adjacent to a non-magnetic heavy metal. Here, we report the experimental observation of spintronic THz emission from an n-doped wide bandgap semiconductor, n-GaN. We found that the amplitude of THz emission strongly depends on the carrier concentration of the semiconductor layer, which could be attributed to the tunable Rashba state occurring at the n-GaN/ferromagnet interface. Our work offers exciting prospects for pursuing wide bandgap semiconductor-based spintronic THz devices and demonstrating their intriguing spin Hall physics at the ultrafast timescale. [ABSTRACT FROM AUTHOR]

The impact of impurities on the thermal conductivity of halide vapor phase epitaxy gallium nitride (GaN) was studied. Phonon resonances with impurities, modeled as Lorentz oscillators, were used to explain the much lower thermal conductivity than predicted by the Debye–Callaway model. The resonance energies for the oscillators were determined by Raman spectroscopy for Mn and by mass difference approximation for C and Fe. Employing the obtained resonance energies and proportionality factors extracted as fitting parameters, the modified model showed a good agreement with the experimental data. While the doping decreased thermal conductivity for all temperatures, the room temperature values started decreasing significantly once the doping levels approached ∼1019 cm−3. Consequently, required doping levels to achieve certain GaN-based devices may reduce the thermal conductivity of GaN by as much as 1/3. [ABSTRACT FROM AUTHOR]

Electrical conductivity in high Al-content AlGaN has been severely limited, presumably due to a DX transition forming an acceptor state and subsequent self-compensation, which imposed an upper limit on the achievable free carrier concentration. To elucidate this idea, this paper examines Ge doping as a function of Al-content in AlGaN and finds a different behavior: for Al compositions below 40%, Ge behaved as a shallow donor with an ionization energy below 20 meV, while for Al compositions above 40%, above DX transition, it emerged as a deep donor. The ionization energy of this deep state increased with increasing Al content and reached 150 meV for 60% AlGaN. Around the DX transition, a continuous change from the shallow to deep donor was observed. In contrast to the density functional theory predictions, acceptor-type states corresponding to a DX-type transition were not observed. This finding may have profound technological consequences for the development of AlGaN- and AlN-based devices as it offers a feasible pathway to high n-conductivity in these compounds. [ABSTRACT FROM AUTHOR]

We demonstrate Si as a shallow donor in aluminum nitride (AlN) with an ionization energy of ∼70 meV. The shallow state was achieved by ion implantation of Si into homoepitaxial AlN and a low thermal budget damage recovery and activation process. These results demonstrate that the DX formation may be a kinetically limited process, though being a non-equilibrium process, preventing the Si donor from relaxing to the deep donor state. The room temperature conductivity was measured to be ∼0.05 Ω−1 cm−1, which is one order of magnitude higher than what has been reported for the epitaxially doped or implanted AlN. [ABSTRACT FROM AUTHOR]

We demonstrate large area (25 000 μm2) Al-rich AlGaN-based avalanche photodiodes (APDs) grown on single crystal AlN substrates operating with differential (the difference in photocurrent and dark current) signal gain of 100 000 at 90 pW (<1 μW cm−2) illumination with very low dark currents <0.1 pA at room temperature under ambient light. The high gain in large area AlGaN APDs is attributed to a high breakdown voltage at 340 V, corresponding to very high breakdown fields ∼9 MV cm−1 as a consequence of low threading and screw dislocation densities < 103 cm−2. The maximum charge collection efficiency of 30% was determined at 255 nm, corresponding to the bandgap of Al0.65Ga0.35N, with a response of 0.06 A/W. No response was detected for λ > 280 nm, establishing solar blindness of the device. [ABSTRACT FROM AUTHOR]

In this work, we determine the dependence of the defect transition energies, electronic bands, and surface charge neutrality levels in AlGaN. With Vacuum level as reference, we show that energy transitions of localized defects and the surface Fermi level are independent of the alloy composition as electronic bands diverge with the increase in the bandgap as a function of alloy composition. The invariance of localized states on the alloy composition creates a convenient internal reference energy with respect to which other energy states may be measured. We demonstrate a higher generality to the universality rule with the independence of deep transition states of otherwise shallow donor type defects [(+1/+3) transition for VN] and defect complexes (CN+SiIII) in addition to the earlier predicted independent nature of mid-gap states when they are either the antibonding state between cationic impurities and host anion or acceptors at anion sites. [ABSTRACT FROM AUTHOR]

The existence of anti-phase domains in cubic GaN grown on 3C-SiC/Si (001) substrates by plasma-assisted molecular beam epitaxy is reported. The influence of the 3C-SiC/Si (001) substrate morphology is studied with emphasis on the anti-phase domains (APDs). The GaN nucleation is governed by the APDs of the substrate, resulting in equal plane orientation and the same anti-phase boundaries. The presence of the APDs is independent of the GaN layer thickness. Atomic force microscopy surface analysis indicates lateral growth anisotropy of GaN facets in dependence of the APD orientation. This anisotropy can be linked to Ga and N face types of the {111} planes, similar to observations of anisotropic growth in 3C-SiC. In contrast to 3C-SiC, however, a difference in GaN phase composition for the two types of APDs can be measured by electron backscatter diffraction, μ-Raman and cathodoluminescence spectroscopy. [ABSTRACT FROM AUTHOR]

We report on fundamental structural and optical properties of lateral polarity junctions in GaN. GaN with Ga- to N-polar junctions was grown on sapphire using an AlN buffer layer. Results from scanning electron microscopy and Raman spectroscopy measurements indicate a superior quality of the Ga-polar GaN. An extremely strong luminescence signal is observed at the inversion domain boundary (IDB). Temperature dependent micro photoluminescence measurements are used to reveal the recombination processes underlying this strong emission. At 5 K the emission mainly arises from a stripe along the inversion domain boundary with a thickness of 4-5 μm. An increase of the temperature initially leads to a narrowing to below 2 μm emission area width followed by a broadening at temperatures above 70 K. The relatively broad emission area at low temperatures is explained by a diagonal IDB. It is shown that all further changes in the emission area width are related to thermalization effects of carriers and defects attracted to the IDB. The results are successfully used to confirm a theoretical model for GaN based lateral polarity junctions. Due to the strong and pronounced emission of IDBs even at elevated temperatures, it is demonstrated that lateral polarity junctions exhibit a strong potential for future high efficiency devices. [ABSTRACT FROM AUTHOR]

As an alternative to electrically injected diodes, UV light emission can be obtained via second harmonic generation (SHG). In weakly birefringent materials such as aluminum nitride (AlN), the phase matching of the driving and second harmonic waves can be achieved by the quasi-phase-matching (QPM) technique, where the polarity of the material is periodically changed commensurate with the coherence wavelength. QPM also allows the use of the highest nonlinear susceptibility, and therefore, higher conversion efficiencies are possible. In this work, the QPM SHG of UV light in AlN lateral polar structure-based waveguides is demonstrated. The peak intensity of the frequency doubled laser light was measured at 344 nm and 472 nm wavelengths, in agreement with dispersion-based theoretical predictions. These results confirm the potential of III-nitride-based lateral polar structures for quasi-phase-matched nonlinear optics and for frequency doubling media for UV light generation. [ABSTRACT FROM AUTHOR]

The mechanisms governing "compositional pulling" during the growth of AlxGa1−xN wells are investigated. Gallium-rich AlxGa1−xN wells grown on high dislocation density AlN/sapphire templates exhibit asymmetric and diffuse composition profiles, while those grown on low dislocation density native AlN substrates do not. Furthermore, strain in all AlxGa1−xN wells is found to be pseudomorphic, ruling it out as the dominating driving force. Rather, the high threading dislocation density of the AlN template is considered to play the defining role. We propose that a transient surface morphology is introduced during dislocation mediated spiral growth, which, in conjunction with process supersaturation, determines the Ga incorporation. These findings provide insights into compositional pulling in high Ga content AlxGa1−xN grown on AlN and provide a route to grow thicker wells with very abrupt interfaces on native AlN substrates. [ABSTRACT FROM AUTHOR]

Compensating point defect reduction in wide bandgap semiconductors is possible by above bandgap illumination based defect quasi Fermi level (dQFL) control. The point defect control technique employs excess minority carriers that influence the dQFL of the compensator, increase the corresponding defect formation energy, and consequently are responsible for point defect reduction. Previous studies on various defects in GaN and AlGaN have shown good agreement with the theoretical model, but no direct evidence for the role of minority carriers was provided. In this work, we provide direct evidence for the role of minority carriers in reducing point defects by studying the predicted increase in work done against defect (CN-1) formation with the decrease in the Fermi level (free carrier concentration) in Si doped GaN at a constant illumination intensity. Comparative defect photoluminescence measurements on illuminated and dark regions of GaN show an excellent quantitative agreement with the theory by exhibiting a greater reduction in yellow luminescence attributed to CN-1 at lower doping, thereby providing conclusive evidence for the role of the minority carriers in Fermi level control-based point defect reduction. [ABSTRACT FROM AUTHOR]

A high free hole concentration in III-nitrides is important for next generation optoelectronic and high power electronic devices. The free hole concentration exceeding 1018 cm-3 and resistivity as low as 0.7 Ωcm are reported for p-GaN layers grown by metalorganic vapor phase epitaxy on single crystal AlN substrates. Temperature dependent Hall measurements confirmed a much lower activation energy, 60–80mV, for p-GaN grown on AlN as compared to sapphire substrates; the lowering of the activation energy was due to screening of Coulomb potential by free carriers. It is also shown that a higher doping density (more than 5×1019 cm-3) can be achieved in p-GaN/AlN without the onset of self-compensation. [ABSTRACT FROM AUTHOR]

This study examined the conductance sensitivity of AlGaN/GaN field effect transistors in response to varying Hg/HNO3 solutions. FET surfaces were covalently functionalized with phytochelatin-5 peptides in order to detect Hg in solution. Results showed a resilience of peptide-AlGaN/GaN bonds in the presence of strong HNO3 aliquots, with significant degradation in FET ID signal. However, devices showed strong and varied response to Hg concentrations of 1, 10, 100, and 1000 ppm. The gathered statistically significant results indicate that peptide terminated Al- GaN/GaN devices are capable of differentiating between Hg solutions and demonstrate device sensitivity. [ABSTRACT FROM AUTHOR]

In this work, the Fermi level and band alignment at c-plane surfaces and interfaces of AlGaN thin films grown on sapphire and native single crystalline AlN substrates were analyzed via x-ray photoelectron spectroscopy. The dependence of charge neutrality level (CNL) on Al composition is found to be linear with n-type Schottky barrier heights (Φbn) exhibiting an overall quadratic behavior due to bandgap bowing. A general theoretical expression for Schottky barrier height on AlGaN is determined as a function of Al composition and metal electronegativity utilizing the interface induced gap states (IFIGS) model and is corroborated with current-voltage (I-V) characterization on Ni-based Schottky diodes. The measured CNLs were used to determine the conduction and valence band offsets in AlGaN hetero-junctions according to the IFIGS and were found to be split approximately 2/3 and 1/3 of the bandgap, respectively, at interfaces with AlGaN having comparable Al and Ga concentrations. Nonlinearities in Φbn result in an increase (>2/3) and decrease (<2/3) of the conduction band split at AlN/AlGaN and GaN/AlGaN interfaces, respectively. Characterization of core level binding energies revealed a composition-independent surface work function. Consequently, electron affinity is found to be a linear function of the barrier height at the CNL and band offsets determined via IFIGS and Anderson's rule were found to be identical. The origin of the bandgap bowing arising in the conduction band is proposed. [ABSTRACT FROM AUTHOR]

A Fermi-level control scheme for point defect management using above-bandgap UV illumination during growth is presented. We propose an extension to the analogy between the Fermi level and the electrochemical potential such that the electrochemical potential of a charged defect in a material with steady-state populations of free charge carriers may be expressed in terms of the quasi-Fermi levels. A series of highly Si-doped Al065Ga035N films grown by metalorganic chemical vapor deposition with and without UV illumination showed that samples grown under UV illumination had increased free carrier concentration, free carrier mobility, and reduced midgap photoluminescence all indicating a reduction in compensating point defects. [ABSTRACT FROM AUTHOR]

Co-doping AlN crystals with Si is found to suppress the unwanted 4.7 eV (265 nm) deep ultraviolet absorption associated with isolated carbon acceptors common in materials grown by physical vapor transport. Density functional theory calculations with hybrid functionals demonstrate that silicon forms a stable nearest-neighbor defect complex with carbon. This complex is predicted to absorb at 5.5 eV and emit at or above 4.3 eV. Absorption and photoluminescence measurements of co-doped samples confirm the presence of the predicted CN-SiAl complex absorption and emission peaks and significant reduction of the 4.7 eV absorption. Other sources of deep ultraviolet absorption in AlN are also discussed. [ABSTRACT FROM AUTHOR]

Transmission electron microscopy (TEM) techniques and potassium hydroxide (KOH) etching confirmed that inversion domains in the N-polar AlN grown on c-plane sapphire were due to the decomposition of sapphire in the presence of hydrogen. The inversion domains were found to correspond to voids at the AlN and sapphire interface, and transmission electron microscopy results showed a V-shaped, columnar inversion domain with staggered domain boundary sidewalls. Voids were also observed in the simultaneously grown Al-polar AlN, however no inversion domains were present. The polarity of AlN grown above the decomposed regions of the sapphire substrate was confirmed to be Al-polar by KOH etching and TEM. [ABSTRACT FROM AUTHOR]

Controllable Ge doping in GaN is demonstrated for carrier concentrations of up to 2.4 × 1020 cm-3. Low temperature luminescence spectra from the highly doped samples reveal band gap renormalization and band filling (Burstein-Moss shift) in addition to a sharp transition. Infrared ellipsometry spectra demonstrate the existence of electron plasma with an energy around 3500 cm-1 and a surface plasma with an energy around 2000 cm-1. These findings open possibilities for the application of highly doped GaN for plasmonic devices. [ABSTRACT FROM AUTHOR]

The control of the polarity of metalorganic chemical vapor deposition grown AlN on sapphire is demonstrated. Al-polar and N-polar AlN is grown side-by-side yielding a lateral polarity structure. Scanning electron microscopy measurements reveal a smooth surface for the Al-polar and a relatively rough surface for the N-polar AlN domains. Transmission electron microscopy shows mixed edge-screw type dislocations with polarity-dependent dislocation bending. Raman spectroscopy reveals compressively strained Al-polar and relaxed N-polar domains. The near band edge luminescence consists of free and bound excitons which are broadened for the Al-polar AlN. Relaxation, better optical quality, and dislocation bending in the N-polar domains are explained by the columnar growth mode. [ABSTRACT FROM AUTHOR]

To unambiguously distinguish lasing from super luminescence, key elements of lasing such as longitudinal cavity modes with narrow line-width, polarized emission, and elliptically shaped far-field pattern, need to be demonstrated at the same time. Here, we show transverse electric polarized lasing at 280.8 nm and 263.9 nm for AlGaN based multi-quantum-wells and double heterojunction structures fabricated on single crystalline AlN substrates. An elliptically shaped far-field pattern was recorded when pumped above threshold. With cavities shorter than 200 μm, well-defined, equally spaced longitudinal modes with line widths as narrow as 0.014 nm were observed. The low threshold pumping density of 84 kW/cm2 suggests that the electrically pumped sub-300 nm ultraviolet laser diodes are imminent. [ABSTRACT FROM AUTHOR]

Single crystal AlN provides a native substrate for Al-rich AlGaN that is needed for the development of efficient deep ultraviolet light emitting and laser diodes. An absorption band centered around 4.7 eV (∼265 nm) with an absorption coefficient above 1000 cm-1 is observed in these substrates. Based on density functional theory calculations, substitutional carbon on the nitrogen site introduces absorption at this energy. A series of single crystalline wafers were used to demonstrate that this absorption band linearly increased with carbon, strongly supporting the model that CN- is the predominant state for carbon in AlN. [ABSTRACT FROM AUTHOR]