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Tensor algebra operations such as contractions in computational chemistry consume a significant fraction of the computing time on large-scale computing platforms. The widespread use of tensor contractions between large multi-dimensional tensors in describing electronic structure theory has motivated the development of multiple tensor algebra frameworks targeting heterogeneous computing platforms. In this paper, we present Tensor Algebra for Many-body Methods (TAMM), a framework for productive and performance-portable development of scalable computational chemistry methods. TAMM decouples the specification of the computation from the execution of these operations on available high-performance computing systems. With this design choice, the scientific application developers (domain scientists) can focus on the algorithmic requirements using the tensor algebra interface provided by TAMM, whereas high-performance computing developers can direct their attention to various optimizations on the underlying constructs, such as efficient data distribution, optimized scheduling algorithms, and efficient use of intra-node resources (e.g., graphics processing units). The modular structure of TAMM allows it to support different hardware architectures and incorporate new algorithmic advances. We describe the TAMM framework and our approach to the sustainable development of scalable ground- and excited-state electronic structure methods. We present case studies highlighting the ease of use, including the performance and productivity gains compared to other frameworks. [ABSTRACT FROM AUTHOR]

Diffusion of native defects such as vacancies and their interactions with impurities are fundamental to semiconductor crystal growth, device processing, and design. However, the transient equilibration of native defects is difficult to directly measure. We used (AlxGa1−x)2O3/Ga2O3 superlattices (SLs) to detect and analyze transient diffusion of cation vacancies during annealing in O2 at 1000–1100 °C. Using a novel finite difference scheme for diffusion with time- and space-varying diffusion constants, we determined diffusion constants for Al, Fe, and cation vacancies, including the vacancy concentration dependence for Al. In the case of SLs grown on Sn-doped β-Ga2O3 (010) substrates, gradients observed in the extent of Al diffusion indicate a supersaturation of vacancies in the substrates that transiently diffuse through the SLs coupled strongly to Sn and thus slowed compared to undoped cases. In the case of SLs grown on (010) Fe-doped substrates, the Al diffusion is uniform through the SLs, indicating a depth-uniform concentration of vacancies. We find no evidence for the introduction of VGa from the free surface at rates sufficient to affect Al diffusion at at. % concentrations, establishing an upper bound on surface injection. In addition, we show that unintentional impurities in Sn-doped Ga2O3 such as Fe, Ni, Mn, Cu, and Li also diffuse toward the surface and accumulate. Many of these likely have fast interstitial diffusion modes capable of destabilizing devices, thus suggesting that impurities may require further reduction. This work provides a method to measure transients in diffusion-mediating native defects otherwise hidden in common processes such as ion implantation, etching, and film growth. [ABSTRACT FROM AUTHOR]

β-Ga2O3 is a promising ultra-wide bandgap semiconductor with melt-grown substrates that are scalable, particularly in the (001) orientation. In this study, we report on the heated-phosphoric acid etching of (001) β-Ga2O3. A wagon wheel pattern with spokes aligned to a range of specific crystallographic directions was fabricated on (001) β-Ga2O3. At 160 °C, the (001) etch rate was 1.47 μm/h, which is comparable to etch rates obtained via dry etch techniques. The etched (001) surface had a morphology that was smoother than an inductively coupled plasma etched surface. All spokes possessed relatively smooth sidewalls. Spokes oriented along the [100] direction exhibited minimal SiO2 mask undercut rates at lower etch temperatures and symmetric trapezoidal profiles with near vertical (010)-like sidewalls, which are ideal for device structures with a trench geometry. Spokes oriented along the [010] direction exhibited significant SiO2 mask undercut rates and asymmetric trapezoidal profiles with different sidewall angles. These spokes also possessed reduced sidewall angles, which is favorable for field management at device corners and edges. The etch process was used to realize a dense array of [100]-oriented trenches with a height of 1.5 μm, a base width of 2.0 μm, and a mask width of 0.8 μm. The work highlights the potential for ion damage-free, standalone heated-H3PO4 etching as a viable alternative to the dry etching of (001) β-Ga2O3 for high-performance device applications. [ABSTRACT FROM AUTHOR]

We report on the demonstration of β-Ga2O3 MOSFETs fabricated on 1-in. bulk substrates using metalorganic vapor phase epitaxy (MOVPE) with disilane (Si2H6) as the silicon precursor. Sheet charge uniformity of the as-grown films was measured via Hall and ranged from 5.9–6.7 × 1012 cm−2 with a uniform Hall mobility of 125–129 cm2/V s across the sample. MOSFET devices with a source-drain length of 5.1 μm were measured across the wafer and had a minimum on-resistance (RON) of 47.87 Ω mm with a maximum on-current (ION) of 165 mA/mm. For these same devices, the on-current (ION) and pinch-off voltage (VP) uniformity across the wafer were 137 ± 12 mA/mm and −27.3 ± 7.3 V, respectively. Devices showed low reverse leakage current until catastrophic breakdown occurred, with measured breakdown voltages (VBR) of up to 2.15 kV. This work provides valuable insights into understanding the growth, fabrication, and characterization processes for β-Ga2O3 FETs on full wafer-scale substrates. It also projects the promise of developing lateral β-Ga2O3 FETs with high current-carrying capabilities and breakdown voltages, especially on substrates of 1 in. or larger. [ABSTRACT FROM AUTHOR]

This work reports high carrier mobilities and growth rates simultaneously in low unintentionally doped (UID) (1015 cm−3) metalorganic chemical vapor deposition (MOCVD)-grown thick β-Ga2O3 epitaxial drift layers, with thicknesses reaching up to 6.3 μm, using triethylgallium (TEGa) as a precursor. Record-high room temperature Hall mobilities of 187–190 cm2/V s were measured for background carrier density values of 2.4–3.5 × 1015 cm−3 grown at a rate of 2.2 μm/h. A controlled background carrier density scaling from 3.3 × 1016 to 2.4 × 1015 cm−3 is demonstrated, without the use of intentional dopant gases such as silane, by controlling the growth rate and O2/TEGa ratio. Films show smooth surface morphologies of 0.8–3.8 nm RMS roughness for film thicknesses of 1.24–6.3 μm. Vertical Ni Schottky barrier diodes (SBDs) fabricated on UID MOCVD material were compared with those fabricated on hydride vapor phase epitaxy material, revealing superior material and device characteristics. MOCVD SBDs on a 6.3 μm thick epitaxial layer show a uniform charge vs depth profile of ∼ 2.4 × 1015 cm−3, an estimated μdrift of 132 cm2/V s, breakdown voltage (VBR) close to 1.2 kV, and a surface parallel plane field of 2.05 MV/cm without any electric field management—setting record-high parameters for any MOCVD-grown β-Ga2O3 vertical diode to date. [ABSTRACT FROM AUTHOR]

This paper discusses the terahertz electromagnetic response of metallic gratings on anisotropic dielectric substrates. The metallic gratings consist of parallel gold stripes. Utilizing numerical simulations, we observe that it is possible to excite a series of resonant modes in these structures. These modes are affected differently by the different indices on the anisotropic substrate. An analytical model is discussed to show that modes associated with transmission peaks are due to the excitation of (a) Fabry–Pérot modes with polarization along the grating and/or (b) waveguide modes with polarization perpendicular to the grating. It is observed that the resonance associated with the TM1,1 mode is a narrow linewidth resonance which, in some particular circumstances, becomes nearly independent of substrate thickness. Therefore, from the spectral position of this resonance, it is possible to extract the out-of-plane component of the substrate refractive index with very small uncertainty. Based on this observation, we demonstrate the refractive index characterization of several lossless semiconductor substrates through frequency-domain polarized terahertz transmission measurements in the frequency range of 0.2–0.6 THz at normal incidence. The reliability of the technique is demonstrated on well-known materials, such as high-resistivity silicon and sapphire substrates. This technique is also applied for the characterization of a Fe-doped β-Ga2O3 single-crystal substrate. [ABSTRACT FROM AUTHOR]

In this work, bulk Czochralski-grown single crystals of 10 mol. % Al2O3 alloyed β-Ga2O3—monoclinic 10% AGO or β-(Al0.1Ga0.9)2O3—are obtained, which show +0.20 eV increase in the bandgap compared with unintentionally doped β-Ga2O3. Further, growths of 33% AGO—β-(Al0.33Ga0.67)2O3—and 50% AGO—β-(Al0.5Ga0.5)2O3 or β-AlGaO3—produce polycrystalline single-phase monoclinic material (β-AGO). All three compositions are investigated by x-ray diffraction, Raman spectroscopy, optical absorption, and 27Al nuclear magnetic resonance (NMR). By investigating single phase β-AGO over a large range of Al2O3 concentrations (10–50 mol. %), broad trends in the lattice parameter, vibrational modes, optical bandgap, and crystallographic site preference are determined. All lattice parameters show a linear trend with Al incorporation. According to NMR, aluminum incorporates on both crystallographic sites of β-Ga2O3, with a slight preference for the octahedral (GaII) site, which becomes more disordered with increasing Al. Single crystals of 10% AGO were also characterized by x-ray rocking curve, transmission electron microscopy, purity (glow discharge mass spectroscopy and x-ray fluorescence), optical transmission (200 nm–20 μm wavelengths), and resistivity. These measurements suggest that electrical compensation by impurity acceptor doping is not the likely explanation for high resistivity, but rather the shift of a hydrogen level from a shallow donor to a deep acceptor due to Al alloying. Bulk crystals of β-(Al0.1Ga0.9)2O3 have the potential to be ultra-wide bandgap substrates for thin film growth, with a lattice parameter that may even allow higher Al concentration β-Ga2O3 single crystal thin films to be grown. [ABSTRACT FROM AUTHOR]

In this work, we quantify electronic and ionic contributions to conductivity in the bulk and depletion widths of back-to-back sputtered Pt Schottky contacts on single crystals of β-Ga2O3. We also demonstrate asymmetric changes to these contacts induced by DC bias at temperatures as low as 200 °C, which has obvious bearing on the performance and reliability of devices. Crystals, which were unintentionally doped, doped with Zr donors, and doped with Mg acceptors, were characterized from room temperature to 900 °C. Electrochemical impedance spectroscopy, current–voltage (IV), capacitance–voltage, and the Wagner DC polarization method were employed to characterize changes in conductivity, doping, and built-in potentials with temperature and bias. This work demonstrates that ionic conductivity can be on-par with electronic conductivity in multiple circumstances in bulk crystal samples and leads to changes in Schottky contacts with an applied bias. While it has not been demonstrated that these phenomena are endemic to all melt-grown β-Ga2O3 crystals and epitaxially grown layers were not investigated, these results highlight the importance of understanding and controlling ionic conductivity and defect reactions involving impurities and native defects to enable reliable and long-lived β-Ga2O3 power devices. [ABSTRACT FROM AUTHOR]

We introduce vertical Schottky barrier diodes (SBDs) based on β-Ga2O3 with trench architecture, featuring a high-permittivity dielectric RESURF structure. These diodes are designed for application demanding high voltage and current capacities while maintaining ultra-low reverse leakage currents. The trench design plays a pivotal role in reducing the electric field at the metal–semiconductor junction, thereby yielding minimal reverse leakage attributed to field emission under high reverse bias conditions. Additionally, the incorporation of a high-k dielectric helps to suppress leakage through the trench bottom corner dielectric layer. The small area trench SBD (200 × 200 μ m 2 ) demonstrates a breakdown voltage exceeding 3 kV, accompanied by a reverse leakage current of less than 1 μA/cm2 at 3 kV. Moving on to larger area devices, the 1 × 1 and 2 × 2 mm2 devices exhibit breakdown voltages of 1.8 and 1.4 kV, while accommodating pulsed forward currents of 3.5 and 15 A, respectively. The capacitance, stored charge, and switching energy of the trench SBDs are also found to be less than the similarly rated commercial SiC SBDs, reinforcing their potential for enhanced switching efficiency. [ABSTRACT FROM AUTHOR]

We demonstrate Schottky barrier engineering using PtOx/thin Pt Schottky contacts combined with edge termination using a high permittivity dielectric (ZrO2) field-plate for high-voltage vertical β-Ga2O3 diodes. A systematic study of baseline bare Pt/β-Ga2O3, PtOx/thin Pt/β-Ga2O3, and PtOx/β-Ga2O3 Schottky diode characteristics was performed, which revealed that the PtOx/thin Pt/β-Ga2O3 contact can combine the advantages of both PtOx and Pt, allowing better reverse blocking performance than plain metal Pt/β-Ga2O3 Schottky diodes and lower turn-on voltage than plain oxidized metal PtOx/β-Ga2O3 ones. Moreover, the thin Pt interlayer in the PtOx/thin Pt/β-Ga2O3 anode contact configuration, deposited by e-beam deposition, also provides plasma-free interface at the Schottky junction as opposed to the direct sputter deposited PtOx contacts of the PtOx/β-Ga2O3 diodes. We further implemented a high permittivity dielectric (ZrO2) field plate in PtOx/thin Pt/β-Ga2O3 diodes that assisted in edge-field management and enabled a breakdown voltage to ∼2.34 kV. These results indicate that the PtOx/thin Pt/β-Ga2O3 Schottky contact, combined with a high permittivity field-plate, will be promising to enable Schottky barrier engineering for high-performance and efficient vertical β-Ga2O3 power switches. [ABSTRACT FROM AUTHOR]

Homoepitaxial growth of β -Ga 2 O 3 using metalorganic vapor-phase epitaxy (MOVPE) on several different crystal orientations has previously been studied, but growth on the (2 ¯ 01) plane has remained comparatively unexplored. To investigate this, we grew Si-doped and unintentionally doped (UID) homoepitaxial layers simultaneously on Sn-doped (2 ¯ 01) and (010) substrates under conditions optimized for (010) growth. We report herein on results from current–voltage and capacitance–voltage (IV and CV) and deep level transient spectroscopy (DLTS) characterization of Schottky diodes fabricated on these samples. Devices on (010) display nearly ideal Schottky diode JV and CV behaviors while for (2 ¯ 01) evidence of complete depletion of > --> 2 μ m thickness, UID epilayers are observed. The (2 ¯ 01) UID diodes exhibited Mott–Gurney space charge-limited transport and were completely depleted even at zero bias. Doping (2 ¯ 01) samples heavily with Si was sufficient to overcome background compensation and reproduce near-ideal diode behavior. DLTS data from these doped devices show, in addition to typical negative majority-carrier transients, positive transients with a broad energy distribution, possibly indicating traps on structural defects or surface states. An etch pit analysis under SEM revealed intricate structures of the grown layers. Cross-sectional TEM characterization of a (2 ¯ 01) sample revealed a high density of structural defects within the epitaxial layer, likely stacking faults. Hypotheses for the origins of the compensation in (2 ¯ 01) β -Ga 2 O 3 homoepitaxial MOVPE growth under (010) growth conditions are discussed; the most likely explanation is the presence of defect states introduced by the stacking faults visible under TEM. [ABSTRACT FROM AUTHOR]

We provide theoretical consideration of intersubband transitions designed in the ultra-wide bandgap aluminum gallium oxide [(AlxGa1 − x)2O3]/gallium oxide (Ga2O3) quantum well system. Conventional material systems have matured into successful intersubband device applications such as large-area quantum well infrared photodetector (QWIP) focal plane arrays for reproducible imaging systems but are fundamentally limited via maximum conduction band offsets to mid- and long-wavelength infrared applications. Short- and near-infrared devices are technologically important to optical communication systems and biomedical imaging applications but are difficult to realize in intersubband designs for this reason. In this work, we use a first-principles approach to estimate the expansive design space of monoclinic β-(AlxGa1 − x)2O3/Ga2O3 material system, which reaches from short-wavelength infrared (1–3 μm) to far infrared (>30 μm) transition wavelengths. We estimate the performance metrics of two QWIPs operating in the long- and short-wavelength regimes, including an estimation of high room temperature detectivity (∼1011 Jones) at the optical communication wavelength λp = 1.55 μm. Our findings demonstrate the potential of the rapidly maturing (AlxGa1 − x)2O3/Ga2O3 material system to open the door for intersubband device applications. [ABSTRACT FROM AUTHOR]

Accurate description of the ionization process in DNA is crucial to the understanding of the DNA damage under exposure to ionizing radiation and the exploration of the potential application of DNA strands in nanoelectronics. In this work, by employing our recently developed Green's function coupled-cluster library on supercomputing facilities, we have studied the spectral functions of several guanine–cytosine (G–C) base pair structures ([G–C]n, n = 1–3) for the first time in a relatively broad near-valence regime ([−25.0, −5.0] eV) in the coupled-cluster with singles and doubles level. Our focus is to give a preliminary many-body coupled-cluster understanding and guideline of the vertical ionization energy (VIE), spectral profile, and ionization feature changes of these systems as the system size expands in this near-valence regime. The results show that, as the system size expands, even though the lowest VIEs keep decreasing, the changes of spectral function profile and the relative peak positions get unexpectedly smaller. Further analysis of the ionized states associated with the most intensive peak in the spectral functions reveals non-negligible |2h, 1p⟩'s in the ionized wave functions of the considered G–C base pair systems. The leading |2h, 1p⟩'s associated with the main ionizations from the cytosine part of the G–C base pairs feature a transition from the intra-base-pair cytosine π → π* excitation to the inter-base-pair electron excitation as the size of G–C base pairs expands, which also indicates the minimum quantum region in the many-body calculations of DNA systems. [ABSTRACT FROM AUTHOR]

We report a vertical β-Ga2O3 Schottky barrier diode (SBD) with BaTiO3 as field plate oxide on a low doped thick epitaxial layer exhibiting 2.1 kV breakdown voltage. A thick drift layer of 11 μm with a low effective doping concentration of 8 × 1015 cm–3 is used to achieve high breakdown voltage. Using the high-k dielectric with a dielectric constant of 248, the breakdown voltage increases from 816 V for the non-field-plated SBD to 2152 V (>2× improvement) for the field-plated SBD without compromising the on-state performance. The diode dimensions are varied to analyze the effect of edge high-field related leakage with reverse bias and also the effect of current spreading during forward operation. Very uniform distribution of breakdown voltages of 2152 ± 20 V are observed for the diode diameters from 50 to 300 μm for the field-plated SBDs. The on and off state power losses are also analyzed and compared with the non-field-plated devices and the switching losses are estimated analytically. [ABSTRACT FROM AUTHOR]

We demonstrate a new substrate cleaning and buffer growth scheme in β-Ga2O3 epitaxial thin films using metal–organic vapor phase epitaxy (MOVPE). For the channel structure, a low-temperature (LT, 600 °C) un-doped Ga2O3 buffer was grown, followed by a transition layer to a high-temperature (HT, 810 °C) Si-doped Ga2O3 channel layers without growth interruption. The (010) Ga2O3 Fe-doped substrate cleaning uses solvent cleaning, followed by additional hydrofluoric acid (49% in water) treatment for 30 min before the epilayer growth. This step is shown to compensate the parasitic Si channel at the epilayer–substrate interface that originates from the substrate polishing process or contamination from the ambient. From secondary ion mass spectroscopy (SIMS) analysis, the Si peak atomic density at the substrate interface is found to be several times lower than the Fe atomic density in the substrate—indicating full compensation. The elimination of the parasitic electron channel at the epi–substrate interface was also verified by electrical (capacitance–voltage profiling) measurements. In the LT-grown (600 °C) buffer layers, it is seen that the Fe forward decay tail from the substrate is very sharp, with a decay rate of ∼9 nm/dec. X-ray off-axis rocking curve ω-scans show very narrow full width at half maximum (FWHM) values, similar to the as-received substrates. These channels show record high electron mobility in the range of 196–85 cm2/V⋅s in unintentionally doped and Si-doped films in the doping range of 2 × 1016–1 × 1020 cm−3. Si delta-doped channels were also grown utilizing this substrate cleaning and the hybrid LT buffers. Record high electron Hall mobility of 110 cm2/V⋅s was measured for sheet charge density of 9.2 × 1012 cm−2. This substrate cleaning, combined with the LT buffer scheme, shows the potential of designing Si-doped β-Ga2O3 channels with exceptional transport properties for high-performance Ga2O3-based electron devices. [ABSTRACT FROM AUTHOR]

We report a new type of structural defect in β-Ga2O3 homoepitaxial thin films grown by metalorganic vapor phase epitaxy, which we have dubbed as "sympetalous defects." These consist of a line defect (for example, a nanotube defect) in the underlying substrate combined with a multi-faceted inverted polycrystalline pyramid in the epitaxial film, which may also be decorated with twinned polycrystalline grains. In plan-view atomic force, scanning electron, or optical microscopies, the sympetalous defects appear similar in shape to polygonal etch pits observed for single crystals. Photoluminescence microscopy exposed spots of polarization-dependent luminescence at these defects, different from the single crystal films' luminescence. Furthermore, some of the defects exhibited circular dichroism in their luminescence that we correlated with partial helices formed within the pits by the arrangement of linearly dichroic polycrystalline grains. Finally, the density of sympetalous defects agrees with the etch pit densities of the substrates. Understanding and controlling these defects will be of importance as they modify the local properties of films, affect fabricated device yields, and influence characterization experiments. [ABSTRACT FROM AUTHOR]

In this paper, we discuss the extension of the recently introduced subsystem embedding subalgebra coupled cluster (SES-CC) formalism to unitary CC formalisms. In analogy to the standard single-reference SES-CC formalism, its unitary CC extension allows one to include the dynamical (outside the active space) correlation effects in an SES induced complete active space (CAS) effective Hamiltonian. In contrast to the standard single-reference SES-CC theory, the unitary CC approach results in a Hermitian form of the effective Hamiltonian. Additionally, for the double unitary CC (DUCC) formalism, the corresponding CAS eigenvalue problem provides a rigorous separation of external cluster amplitudes that describe dynamical correlation effects—used to define the effective Hamiltonian—from those corresponding to the internal (inside the active space) excitations that define the components of eigenvectors associated with the energy of the entire system. The proposed formalism can be viewed as an efficient way of downfolding many-electron Hamiltonian to the low-energy model represented by a particular choice of CAS. In principle, this technique can be extended to any type of CAS representing an arbitrary energy window of a quantum system. The Hermitian character of low-dimensional effective Hamiltonians makes them an ideal target for several types of full configuration interaction type eigensolvers. As an example, we also discuss the algebraic form of the perturbative expansions of the effective DUCC Hamiltonians corresponding to composite unitary CC theories and discuss possible algorithms for hybrid classical and quantum computing. Given growing interest in quantum computing, we provide energies for H2 and Be systems obtained with the quantum phase estimator algorithm available in the Quantum Development Kit for the approximate DUCC Hamiltonians. [ABSTRACT FROM AUTHOR]

We report on vertical β-Ga2O3 power diodes with oxidized-metal Schottky contact (PtOx) and high permittivity (high-κ) dielectric (ZrO2) field plate to improve reverse blocking at both Schottky contact surfaces and edges. The PtOx diodes showed excellent forward transport with near unity ideality factor and similar minimum specific on-resistance as Pt. Moreover, the PtOx contacts facilitated higher breakdown voltage and lower leakage current due to their higher Schottky barrier height (SBH) by more than 0.5 eV compared to that of Pt. Most importantly, the reduced off-state leakage of PtOx diodes enabled orders of magnitude less power dissipation than Pt ones for all duty cycles ≤0.5, indicating their great potential to realize low-loss and efficient, high-power β-Ga2O3 switches. The ZrO2 field-oxide further reduced edge leakage with a consistent increase in breakdown voltage. Device simulation demonstrated that the high permittivity of ZrO2 also led to the peak electric field occurring in β-Ga2O3 instead of the dielectric. These results indicate that the combined integration of oxidized-metal contacts to increase SBH and high-κ dielectric field plate to assist edge termination can be promising to enhance the performance of vertical β-Ga2O3 Schottky diodes. [ABSTRACT FROM AUTHOR]

Large area epitaxy of two-dimensional (2D) layered materials with high material quality is a crucial step in realizing novel device applications based on 2D materials. In this work, we report highquality, crystalline, large-area gallium selenide (GaSe) films grown on bulk substrates such as c-plane sapphire and gallium nitride (GaN) using a valved cracker source for Se. (002)-Oriented GaSe with random in-plane orientation of domains was grown on sapphire and GaN substrates at a substrate temperature of 350-450 °C with complete surface coverage. Higher growth temperature (575 °C) resulted in the formation of single-crystalline ε-GaSe triangular domains with six-fold symmetry confirmed by in-situ reflection high electron energy diffraction and off-axis x-ray diffraction. A two-step growth method involving high temperature nucleation of single crystalline domains and low temperature growth to enhance coalescence was adopted to obtain continuous (002)-oriented GaSe with an epitaxial relationship with the substrate. While six-fold symmetry was maintained in the two step growth, β-GaSe phase was observed in addition to the dominant ε-GaSe in cross-sectional scanning transmission electron microscopy images. This work demonstrates the potential of growing high quality 2D-layered materials using molecular beam epitaxy and can be extended to the growth of other transition metal chalcogenides. [ABSTRACT FROM AUTHOR]

Gallium Oxide has undergone rapid technological maturation over the last decade, pushing it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the potential for a new semiconductor system requires a concerted effort by the community to address technical barriers which limit performance. Due to the favorable intrinsic material properties of gallium oxide, namely, critical field strength, widely tunable conductivity, mobility, and melt-based bulk growth, the major targeted application space is power electronics where high performance is expected at low cost. This Roadmap presents the current state-of-the-art and future challenges in 15 different topics identified by a large number of people active within the gallium oxide research community. Addressing these challenges will enhance the state-of-the-art device performance and allow us to design efficient, high-power, commercially scalable microelectronic systems using the newest semiconductor platform. [ABSTRACT FROM AUTHOR]

β-Ga2O3 is a promising ultra-wide bandgap semiconductor with melt-grown substrates that are scalable, particularly in the (001) orientation. In this study, we report on the heated-phosphoric acid etching of (001) β-Ga2O3. A wagon wheel pattern with spokes aligned to a range of specific crystallographic directions was fabricated on (001) β-Ga2O3. At 160 °C, the (001) etch rate was 1.47 μm/h, which is comparable to etch rates obtained via dry etch techniques. The etched (001) surface had a morphology that was smoother than an inductively coupled plasma etched surface. All spokes possessed relatively smooth sidewalls. Spokes oriented along the [100] direction exhibited minimal SiO2 mask undercut rates at lower etch temperatures and symmetric trapezoidal profiles with near vertical (010)-like sidewalls, which are ideal for device structures with a trench geometry. Spokes oriented along the [010] direction exhibited significant SiO2 mask undercut rates and asymmetric trapezoidal profiles with different sidewall angles. These spokes also possessed reduced sidewall angles, which is favorable for field management at device corners and edges. The etch process was used to realize a dense array of [100]-oriented trenches with a height of 1.5 μm, a base width of 2.0 μm, and a mask width of 0.8 μm. The work highlights the potential for ion damage-free, standalone heated-H3PO4 etching as a viable alternative to the dry etching of (001) β-Ga2O3 for high-performance device applications. [ABSTRACT FROM AUTHOR]

We report on the growth and characterization of Ge-doped β-Ga2O3 thin films using a solid germanium source. β-Ga2O3 thin films were grown using a low-pressure chemical vapor deposition reactor with either an oxygen or a gallium delivery tube. Films were grown on 6° offcut sapphire and (010) β-Ga2O3 substrates with growth rates between 0.5 and 22 μm/h. By controlling the germanium vapor pressure, a wide range of Hall carrier concentrations between 1017 and 1019 cm−3 were achieved. Low-temperature Hall data revealed a difference in donor incorporation depending on the reactor configuration. At low growth rates, germanium occupied a single donor energy level between 8 and 10 meV. At higher growth rates, germanium doping predominantly results in a deeper donor energy level at 85 meV. This work shows the effect of reactor design and growth regime on the kinetics of impurity incorporation. Studying donor incorporation in β-Ga2O3 is important for the design of high-power electronic devices. [ABSTRACT FROM AUTHOR]

The original article contains errors in the values of Von for the high-k dielectric RESURF SBDs in Fig. 6(a).[1] The corrected Fig. 6(a) is shown below.No other result, discussion, or conclusion of the article is affected due to the error.Graph: FIG. 6. Benchmark plot showing (a) leakage at the breakdown voltage vs the turn-on voltage and (b) R o n − s p vs VBR for the state-of-the-art β-Ga2O3 based diodes.By Saurav Roy; Benjamin Kostroun; Jacqueline Cooke; Yizheng Liu; Arkka Bhattacharyya; Carl Peterson; Berardi Sensale-Rodriguez and Sriram KrishnamoorthyReported by Author; Author; Author; Author; Author; Author; Author; Author [Extracted from the article]

By combining temperature-dependent resistivity and Hall effect measurements, we investigate donor state energy in Si-doped β-Ga2O3 films grown using metal-organic vapor phase epitaxy. High-magnetic field (H) Hall effect measurements (–90 kOe ≤ H ≤ +90 kOe) showed non-linear Hall resistance for T < 150 K, revealing two-band conduction. Further analyses revealed carrier freeze out characteristics in both bands yielding donor state energies of ∼33.7 and ∼45.6 meV. The former is consistent with the donor energy of Si in β-Ga2O3, whereas the latter suggests a residual donor state. This study provides critical insight into the impurity band conduction and the defect energy states in β-Ga2O3 using high-field magnetotransport measurements. [ABSTRACT FROM AUTHOR]

The quasi-static anisotropic permittivity parameters of electrically insulating beta gallium oxide (β-Ga2O3) were determined by terahertz spectroscopy. Polarization-resolved frequency domain spectroscopy in the spectral range from 200 GHz to 1 THz was carried out on bulk crystals along different orientations. Principal directions for permittivity were determined along crystallographic axes c and b and reciprocal lattice direction a * . No significant frequency dispersion in the real part of dielectric permittivity was observed in the measured spectral range. Our results are in excellent agreement with recent radio frequency capacitance measurements as well as with extrapolations from recent infrared measurements of phonon mode and high-frequency contributions and close the knowledge gap for these parameters in the terahertz spectral range. Our results are important for applications of β-Ga2O3 in high-frequency electronic devices. [ABSTRACT FROM AUTHOR]

Performing deep level transient spectroscopy (DLTS) on Schottky diodes, we investigated defect levels below the conduction band minima (Ec) in Czochralski-grown unintentionally doped (UID) and vertical gradient freeze-grown Zr-doped β-Ga2O3 crystals. In UID crystals with an electron concentration of 1017 cm−3, we observe levels at 0.18 eV and 0.46 eV in addition to the previously reported 0.86 (E2) and 1.03 eV (E3) levels. For 1018 cm−3 Zr-doped Ga2O3, signatures at 0.30 eV (E15) and 0.71 eV (E16) are present. For the highest Zr doping of 5 × 1018 cm−3, we observe only one signature at 0.59 eV. Electric field-enhanced emission rates are demonstrated via increasing the reverse bias during measurement. The 0.86 eV signature in the UID sample displays phonon-assisted tunneling enhanced thermal emission and is consistent with the widely reported E2 (FeGa) defect. The 0.71 eV (E16) signature in the lower-Zr-doped crystal also exhibits phonon-assisted tunneling emission enhancement. Taking into account that the high doping in the Zr-doped diodes also increases the electric field, we propose that the 0.59 eV signature in the highest Zr-doped sample likely corresponds to the 0.71 eV signature in lower-doped samples. Our analysis highlights the importance of testing for and reporting on field-enhanced emission, especially the electric field present during DLTS and other characterization experiments on β-Ga2O3 along with the standard emission energy, cross section, and lambda-corrected trap density. This is important because of the intended use of β-Ga2O3 in high-field devices and the many orders of magnitude of possible doping. [ABSTRACT FROM AUTHOR]

We report on the low-temperature metalorganic vapor-phase epitaxy (MOVPE) growth of silicon delta-doped β-Ga2O3 films with a low full width at half maximum (FWHM). The as-grown films are characterized using secondary-ion mass spectroscopy, capacitance–voltage, and Hall techniques. Secondary ion mass spectroscopy measurements show that surface segregation is the chief cause of a large FWHM in MOVPE-grown films. The surface segregation coefficient (R) is observed to reduce with reduction in the growth temperature. Films grown at 600 °C show an electron concentration of 9.7 × 1012 cm−2 and a FWHM of 3.2 nm. High resolution scanning/transmission electron microscopy of the epitaxial film did not reveal any observable degradation in the crystal quality of the delta sheet and surrounding regions. Hall measurements of the delta-doped film on the Fe-doped substrate showed a sheet charge density of 6.1 × 1012 cm−2 and a carrier mobility of 83 cm2/V s. Realization of sharp delta doping profiles in MOVPE-grown β-Ga2O3 is promising for high performance device applications. [ABSTRACT FROM AUTHOR]

Ultra-wide bandgap β-gallium oxide (Ga2O3) devices are of considerable interest with potential applications in both power electronics and radio frequency devices. However, current Ga2O3 device technologies are limited by the material's low intrinsic electron mobility and thermal conductivity. The former problem can be addressed by employing modulation-doped β-(AlxGa1−x)2O3/Ga2O3 heterostructures in the device architecture. In this work, (AlxGa1−x)2O3/Ga2O3 modulation-doped field effect transistors (MODFETs) have been investigated from a thermal perspective. Thermoreflectance thermal imaging was used to characterize the self-heating of the MODFETs. The (Al0.18Ga0.82)2O3 thermal conductivity (3.1–3.6 W/mK) was determined using a frequency domain thermoreflectance technique. Electro-thermal modeling was used to discern the effect of design parameters such as substrate orientation and channel length on the device self-heating behavior. Various thermal management schemes were evaluated using the electro-thermal device model. From an electro-thermal co-design perspective, the improvement in electrical performance followed by the mitigation of self-heating was also studied. For example, by employing a Ga2O3-on-SiC composite wafer, which was fabricated in this work, a 50% increase in power handling capability can be achieved as compared to a homoepitaxial device. Furthermore, flip-chip heterointegration and double-sided cooling approaches can lead to more than 2× improvement in the power handling capability. Using an augmented double-sided cooling design that includes nanocrystalline diamond passivation, a 5× improvement in the power handling capability can be accomplished, indicating the potential of the technology upon implementation of a suitable thermal management scheme. [ABSTRACT FROM AUTHOR]

In this work, we report on the growth of high-mobility β-Ga2O3 homoepitaxial thin films grown at a temperature much lower than the conventional growth temperature window for metalorganic vapor phase epitaxy. Low-temperature β-Ga2O3 thin films grown at 600 °C on Fe-doped (010) bulk substrates exhibit remarkable crystalline quality, which is evident from the measured room temperature Hall mobility of 186 cm2/V s for the unintentionally doped films. N-type doping is achieved by using Si as a dopant, and a controllable doping in the range of 2 × 1016–2 × 1019 cm−3 is studied. Si incorporation and activation is studied by comparing the silicon concentration from secondary ion mass spectroscopy and the electron concentration from temperature-dependent Hall measurements. The films exhibit high purity (low C and H concentrations) with a very low concentration of compensating acceptors (2 × 1015 cm−3) even at this growth temperature. Additionally, an abrupt doping profile with a forward decay of ∼ 5 nm/dec (10 times improvement compared to what is observed for thin films grown at 810 °C) is demonstrated by growing at a lower temperature. [ABSTRACT FROM AUTHOR]

We report on the origin of high Si flux observed during the use of Si as a doping source in plasma assisted MBE growth of β -Ga2O3. We show on the basis of secondary ion mass spectroscopy analysis that Si flux is not limited by the vapor pressure of Si but by the formation of volatile SiO. The low sublimation energy of SiO leads to a weak dependence of the SiO flux of Si cell temperature and a strong dependence on the background oxygen pressure. Extended exposure to activated oxygen results in reduction of SiO flux due to the formation of SiO2 on the Si surface. The work reported provides key understanding for incorporating Si into future oxide-based semiconductor heterostructure and device MBE growth. [ABSTRACT FROM AUTHOR]

The completely renormalized equation-of-motion coupled-cluster approach with singles, doubles, and noniterative triples [CR-EOMCCSD(T)] has proven to be a reliable tool in describing vertical excitation energies in small and medium size molecules. In order to reduce the high numerical cost of the genuine CR-EOMCCSD(T) method and make noniterative CR-EOMCCSD(T) approaches applicable to large molecular systems, two active-space variants of this formalism [the CR-EOMCCSd(t)-II and CR-EOMCCSd(t)-III methods], based on two different choices of the subspace of triply excited configurations employed to construct noniterative correction, are introduced. In calculations for green fluorescent protein (GFP) and free-base porphyrin, where the CR-EOMCCSD(T) results are available, we show good agreement between the active-space CR-EOMCCSD(T) (variant II) and full CR-EOMCCSD(T) excitation energies. For the oligoporphyrin dimer (P2TA) active-space CR-EOMCCSD(T) results provide reasonable agreement with experimentally inferred data. For all systems considered we demonstrated that the active-space CR-EOMCCSD(T) corrections lower the EOMCCSD (iterative equation-of-motion coupled-cluster method with singles and doubles) excitation energies by 0.2 and 0.3 eV, which leads to a better agreement with experiment. We also discuss the quality of basis sets used and compare EOMCC excitation energies with excitation energies obtained with other methods. In particular, we demonstrate that for GFP and FBP Sadlej’s TZP and cc-pVTZ basis sets lead to a similar quality of the EOMCC results. The performance of the CR-EOMCCSD(T) implementation is discussed from the point of view of timings of iterative parts and scalability of the most expensive, N7, part of the calculation. In the latter case the scalability across 34 008 processors is reported. [ABSTRACT FROM AUTHOR]

We used depth-resolved cathodoluminescence spectroscopy and surface photovoltage spectroscopy to measure the effects of near-surface plasma processing and neutron irradiation on native point defects in β-Ga2O3. The near-surface sensitivity and depth resolution of these optical techniques enabled us to identify spectral changes associated with removing or creating these defects, leading to identification of one oxygen vacancy-related and two gallium vacancy-related energy levels in the β-Ga2O3 bandgap. The combined near-surface detection and processing of Ga2O3 suggests an avenue for identifying the physical nature and reducing the density of native point defects in this and other semiconductors. [ABSTRACT FROM AUTHOR]

We report on the synthesis and properties of wafer-scale two-dimensional/three-dimensional (2D/3D) n-SnSe2/n-GaN(0001) heterojunctions. The hexagonal crystal structure of crystalline SnSe2 grown by molecular beam epitaxy was confirmed via in-situ reflection high-energy electron diffraction and off-axis X-ray diffraction. Current-voltage (I-V) measurements of SnSe2/GaN diodes exhibited 9 orders of magnitude rectification, and the SnSe2/GaN heterojunction barrier height was estimated to be 1 eV using capacitance-voltage measurements and internal photoemission measurements. Vertical electronic transport analyzed using temperature-dependent I-V measurements indicates thermionic field emission transport across the junction. This work demonstrates the potential of epitaxial growth of large area high quality 2D crystals on 3D bulk semiconductors for device applications involving carrier injection across 2D/3D heterojunctions. [ABSTRACT FROM AUTHOR]

In this work, we investigate the use of nanoscale polarization engineering to achieve efficient hole injection from metals to ultra-wide bandgap AlGaN, and we show that UV-reflective aluminum (Al) layers can be used for hole injection into p-AlGaN. The dependence of tunneling on the work function of the metal was investigated, and it was found that highly reflective Al metal layers can enable efficient hole injection into p-AlGaN, despite the relatively low work function of Al. Efficient tunneling hole injection was confirmed by light emission at 326 nm with an on-wafer peak external quantum efficiency and a wall-plug efficiency of 2.43% and 1.33%, respectively. A high power density of 79.0 W/cm² was measured at 1200 A/cm². The metal/semiconductor tunnel junction structure demonstrated here could provide significant advantages for efficient and manufacturable device topologies for high power UV emitters. [ABSTRACT FROM AUTHOR]

Modulation-doped heterostructures are a key enabler for realizing high mobility and better scaling properties for high performance transistors. We report the realization of a modulation-doped twodimensional electron gas (2DEG) at the β-(Al0.2Ga0.8)2O3/Ga2O3 heterojunction by silicon delta doping. The formation of a 2DEG was confirmed using capacitance voltage measurements. A modulation-doped 2DEG channel was used to realize a modulation-doped field-effect transistor. The demonstration of modulation doping in the β-(Al0.2Ga0.8)2O3/Ga2O3 material system could enable heterojunction devices for high performance electronics. [ABSTRACT FROM AUTHOR]

In this report, we demonstrate high spectral responsivity (SR) in MBE grown epitaxial β-Ga2O3- based solar blind metal-semiconductor-metal (MSM) photodetectors (PD). The (-201)-oriented β-Ga2O3 thin film was grown using plasma-assisted MBE on c-plane sapphire substrates. MSM devices fabricated with Ni/Au contacts in an interdigitated geometry were found to exhibit peak SR>1.5 A/W at 236–240 nm at a bias of 4V with a UV to visible rejection ratio>105. The devices exhibited very low dark current<10 nA at 20V and showed no persistent photoconductivity (PPC) as evident from the sharp transients with a photo-to-dark current ratio>103. These results represent the state-of-art performance for the MBE-grown β-Ga2O3 MSM solar blind detector. [ABSTRACT FROM AUTHOR]

We report on tunnel-injected deep ultraviolet light emitting diodes (UV LEDs) configured with a polarization engineered Al0.75Ga0.25 N/In0.2Ga0.8 N tunnel junction structure. Tunnel-injected UV LED structure enables n-type contacts for both bottom and top contact layers. However, achieving Ohmic contact to wide bandgap n-AlGaN layers is challenging and typically requires high temperature contact metal annealing. In this work, we adopted a compositionally graded top contact layer for non-alloyed metal contact and obtained a low contact resistance of ρc = 4.8 × 10−5 Ω cm2 on n-Al0.75Ga0.25 N. We also observed a significant reduction in the forward operation voltage from 30.9 V to 19.2 V at 1 kA/cm2 by increasing the Mg doping concentration from 6.2 × 1018 cm−3 to 1.5 × 1019 cm−3. Non-equilibrium hole injection into wide bandgap Al0.75Ga0.25 N with Eg>5.2 eV was confirmed by light emission at 257 nm. This work demonstrates the feasibility of tunneling hole injection into deep UV LEDs and provides a structural design towards high power deep-UV emitters. [ABSTRACT FROM AUTHOR]

We discuss the engineering of p-AlGaN cladding layers for achieving efficient tunnel-injected III-Nitride ultraviolet light emitting diodes (UV LEDs) in the UV-A spectral range. We show that the capacitance-voltage measurements can be used to estimate the compensation and doping in the p-AlGaN layers located between the multi-quantum well region and the tunnel junction layer. By increasing the p-type doping concentration to overcome the background compensation, on-wafer external quantum efficiency and wall-plug efficiency of 3.37% and 1.62%, respectively, were achieved for the tunnel-injected UV LEDs emitting at 325 nm. We also show that interband tunneling hole injection can be used to realize UV LEDs without any acceptor doping. The work discussed here provides new understanding of hole doping and transport in AlGaN-based UV LEDs and demonstrates the excellent performance of tunnel-injected LEDs for the UV-A wavelength range. [ABSTRACT FROM AUTHOR]

The integration of two-dimensional materials such as transition metal dichalcogenides with bulk semiconductors offer interesting opportunities for 2D/3D heterojunction-based device structures without any constraints of lattice matching. By exploiting the favorable band alignment at the GaN/MoS2 heterojunction, an Esaki interband tunnel diode is demonstrated by transferring large area Nb-doped, p-type MoS2 onto heavily n-doped GaN. A peak current density of 446 A/cm2 with repeatable room temperature negative differential resistance, peak to valley current ratio of 1.2, and minimal hysteresis was measured in the MoS2/GaN non-epitaxial tunnel diode. A high current density of 1 kA/cm2 was measured in the Zener mode (reverse bias) at -1V bias. The GaN/MoS2 tunnel junction was also modeled by treating MoS2 as a bulk semiconductor, and the electrostatics at the 2D/3D interface was found to be crucial in explaining the experimentally observed device characteristics. [ABSTRACT FROM AUTHOR]

We report on ultra-wide bandgap (UWBG) Al0.75Ga0.25N channel metal-insulator-semiconductor field-effect transistors (MISFETs) with heterostructure engineered low-resistance ohmic contacts. The low intrinsic electron affinity of AlN (0.6 eV) leads to large Schottky barriers at the metal-AlGaN interface, resulting in highly resistive ohmic contacts. In this work, we use a reverse compositional graded n++ AlGaN contact layer to achieve upward electron affinity grading, leading to a low specific contact resistance (ρsp) of 1.9×10-6 Ω cm² to n-Al0.75Ga0.25N channels (bandgap ∼5.3 eV) with non-alloyed contacts. We also demonstrate UWBG Al0.75Ga0.25N channel MISFET device operation employing the compositional graded n++ ohmic contact layer and 20 nm atomic layer deposited Al2O3 as the gate-dielectric. [ABSTRACT FROM AUTHOR]

Ultra violet light emitting diodes (UV LEDs) face critical limitations in both the injection efficiency and the light extraction efficiency due to the resistive and absorbing p-type contact layers. In this work, we investigate the design and application of polarization engineered tunnel junctions for ultra-wide bandgap AlGaN (Al mole fraction >50%) materials towards highly efficient UV LEDs. We demonstrate that polarization-induced three dimensional charge is beneficial in reducing tunneling barriers especially for high composition AlGaN tunnel junctions. The design of graded tunnel junction structures could lead to low tunneling resistance below 10-3 Ω cm² and low voltage consumption below 1 V (at 1 kA/cm²) for high composition AlGaN tunnel junctions. Experimental demonstration of 292 nm emission was achieved through non-equilibrium hole injection into wide bandgap materials with bandgap energy larger than 4.7 eV, and detailed modeling of tunnel junctions shows that they can be engineered to have low resistance and can enable efficient emitters in the UV-C wavelength range. [ABSTRACT FROM AUTHOR]

We report GaN n++/p++ interband tunnel junctions with repeatable negative differential resistance and low resistance. Reverse and forward tunnelingcurrent densities were observed to increase as Si and Mg doping concentrations were increased. Hysteresis-free, bidirectional negative differential resistance was observed at room temperature from these junctions at a forward voltage ~1.6?V. Thermionic PN junctions with GaN homojunction tunnel contact to the p-layer exhibited forward current density of 150?kA/cm2 at 7.6?V, with a low series device resistance of 1?×?10-5 Ω cm2. [ABSTRACT FROM AUTHOR]

Transfer of epitaxial, two-dimensional (2D) MoS2 on sapphire grown via synthetic approaches is a prerequisite for practical device applications. We report centimeter-scale, single crystal, synthesized MoS2 field effect transistors (FETs) transferred onto SiO2/Si substrates, with a field-effect mobility of 4.5 cm² V-1 s-1, which is among the highest mobility values reported for the transferred large-area MoS2 transistors. We demonstrate simple and clean transfer of large-area MoS2 films using deionized water, which can effectively avoid chemical contamination. The transfer method reported here allows standard i-line stepper lithography process to realize multiple devices over the entire film area. [ABSTRACT FROM AUTHOR]

We report on the direct measurement of two-dimensional sheet charge density dependence of electron transport in AlGaN/GaN high electron mobility transistors (HEMTs). Pulsed IV measurements established increasing electron velocities with decreasing sheet charge densities, resulting in saturation velocity of 1.9 × 107 cm/s at a low sheet charge density of 7.8 × 1011 cm-2. An optical phonon emission-based electron velocity model for GaN is also presented. It accommodates stimulated longitudinal optical (LO) phonon emission which clamps the electron velocity with strong electron-phonon interaction and long LO phonon lifetime in GaN. A comparison with the measured density-dependent saturation velocity shows that it captures the dependence rather well. Finally, the experimental result is applied in TCAD-based device simulator to predict DC and small signal characteristics of a reported GaN HEMT. Good agreement between the simulated and reported experimental results validated the measurement presented in this report and established accurate modeling of GaN HEMTs. [ABSTRACT FROM AUTHOR]

Electrical and optical characterization of two-dimensional/three-dimensional (2D/3D) p-molybdenum disulfide/n-gallium nitride (p-MoS2/n-GaN) heterojunction diodes are reported. Devices were fabricated on high-quality, large-area p-MoS2 grown by chemical vapor deposition on sapphire substrates. The processed devices were transferred onto GaN/sapphire substrates, and the transferred films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM). On-axis XRD spectra and surface topology obtained from AFM scans were consistent with previously grown high-quality, continuous MoS2 films. Current-voltage measurements of these diodes exhibited excellent rectification, and capacitance-voltage measurements were used to extract a conduction band offset of 0.23 eV for the transferred MoS2/GaN heterojunction. This conduction band offset was confirmed by internal photoemission measurements. The energy band lineup of the MoS2/GaN heterojunction is proposed here. This work demonstrates the potential of 2D/3D heterojunctions for novel device applications. [ABSTRACT FROM AUTHOR]

Low p-type conductivity and high contact resistance remain a critical problem in wide band gap AlGaN-based ultraviolet light emitters due to the high acceptor ionization energy. In this work, interband tunneling is demonstrated for non-equilibrium injection of holes through the use of ultra-thin polarization-engineered layers that enhance tunneling probability by several orders of magnitude over a PN homojunction. Al0.3Ga0.7N interband tunnel junctions with a low resistance of 5.6×10-4 Ω cm² were obtained and integrated on ultraviolet light emitting diodes. Tunnel injection of holes was used to realize GaN-free ultraviolet light emitters with bottom and top n-type Al0.3Ga0.7N contacts. At an emission wavelength of 327nm, stable output power of 6 W/cm² at a current density of 120A/cm² with a forward voltage of 5.9V was achieved. This demonstration of efficient interband tunneling could enable device designs for higher efficiency ultraviolet emitters. [ABSTRACT FROM AUTHOR]

InGaN/GaN tunnel junction contacts were grown using plasma assisted molecular beam epitaxy (MBE) on top of a metal-organic chemical vapor deposition (MOCVD)-grown InGaN/GaN blue (450 nm) light emitting diode. A voltage drop of 5.3V at 100mA, forward resistance of 2 × 10-2 Ωcm², and a higher light output power compared to the reference light emitting diodes (LED) with semi-transparent p-contacts were measured in the tunnel junction LED (TJLED). A forward resistance of 5×10-4 Ωcm2 was measured in a GaN PN junction with the identical tunnel junction contact as the TJLED, grown completely by MBE. The depletion region due to the impurities at the regrowth interface between the MBE tunnel junction and the MOCVD-grown LED was hence found to limit the forward resistance measured in the TJLED. [ABSTRACT FROM AUTHOR]

Photoelectrochemical (PEC) etching is a rapid and inexpensive means of etching GaN, InGaN, and related materials for micro-electro-mechanical systems (MEMS) applications. In this work, we show that bandgap engineering of GaN/InGaN heterostructures can be used to exert substantial control over PEC etching and achieve strain-free cantilevers. A single, 200-nm thick layer InGaN was selectively etched using bandgap-selective PEC etch. We show that the use of highly doped guard layers to confine photogenerated holes uniformly across the InGaN layer enables a uniform, fast, and effective PEC etch. This approach enables complete uniform etching using PEC and could enable many optical and MEMS devices. [ABSTRACT FROM AUTHOR]

We investigate the energy levels of electron traps in AlGaN/GaN high electron mobility transistors by the use of electron tunneling spectroscopy. Detailed analysis of a typical spectrum, obtained in a wide gate bias range and with both bias polarities, suggests the existence of electron traps both in the bulk of AlGaN and at the AlGaN/GaN interface. The energy levels of the electron traps have been determined to lie within a 0.5 eV band below the conduction band minimum of AlGaN, and there is strong evidence suggesting that these traps contribute to Frenkel-Poole conduction through the AlGaN barrier. [ABSTRACT FROM AUTHOR]

In this work, we demonstrate visible wavelength transparent GaN/GdN/GaN tunnel junction interconnects to cascade multiple p-n junctions with low resistance (5.7 × 10-4 ࡎ × cm2). We model a device structure using cascaded light emitting diodes (LEDs) with tunnel junction-based carrier regeneration to create high-power LEDs operating at low current density. Experimental LED characteristics are used to model the use of these low resistance tunnel junctions in cascaded multiple active region LEDs that can effectively provide high power by operating under low current and high forward voltage. The adoption of cascaded LED structures can enable high power LEDs while maintaining high efficiency. [ABSTRACT FROM AUTHOR]