1. Comparison of the sputter rates of oxide films relative to the sputter rate of SiO2
- Author
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Timothy C. Droubay, Robert L. Opila, William F. Stickle, Alan S. Lea, C. Mathews, B. Wright, Laxmikant V. Saraf, Robert M. Wallace, Jiyoung Kim, Ponnusamy Nachimuthu, Bong-Ki Lee, Donald R. Baer, and Mark H. Engelhard
- Subjects
Materials science ,Argon ,Analytical chemistry ,Oxide ,chemistry.chemical_element ,Surfaces and Interfaces ,Sputter deposition ,Condensed Matter Physics ,Electrochemistry ,Surfaces, Coatings and Films ,Pulsed laser deposition ,chemistry.chemical_compound ,Atomic layer deposition ,chemistry ,Sputtering ,Molecular beam epitaxy - Abstract
There is a growing interest in knowing the sputter rates for a wide variety of oxides because of their increasing technological importance in many different applications. To support the needs of users of the Environmental Molecular Sciences Laboratory, a national scientific user facility, as well as our research programs, the authors made a series of measurements of the sputter rates from oxide films that have been grown by oxygen plasma-assisted molecular beam epitaxy, pulsed laser deposition, atomic layer deposition, electrochemical oxidation, or sputter deposition. The sputter rates for these oxide films were determined in comparison with those from thermally grown SiO2, a common reference material for sputter rate determination. The film thicknesses and densities for most of these oxide films were measured using x-ray reflectivity. These oxide films were mounted in an x-ray photoelectron or Auger electron spectrometer for sputter rate measurements using argon ion sputtering. Although the primary objec...
- Published
- 2010
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