1. Optimizing the Data Movement in Quantum Transport Simulations via Data-Centric Parallel Programming
- Author
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Torsten Hoefler, Mathieu Luisier, Guillermo Indalecio Fernández, Alexandros Nikolaos Ziogas, Timo Schneider, and Tal Ben-Nun
- Subjects
FOS: Computer and information sciences ,020203 distributed computing ,Phonon ,Computer science ,Transistor ,02 engineering and technology ,Parallel computing ,Integrated circuit ,Solver ,01 natural sciences ,Database-centric architecture ,law.invention ,Computational Engineering, Finance, and Science (cs.CE) ,Quantum transport ,Computer Science - Distributed, Parallel, and Cluster Computing ,law ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,Distributed, Parallel, and Cluster Computing (cs.DC) ,Computer Science - Computational Engineering, Finance, and Science ,010306 general physics ,Transport phenomena ,Quantum ,Massively parallel and high-performance simulations ,Parallel computing methodologies ,Quantum mechanic simulation - Abstract
Designing efficient cooling systems for integrated circuits (ICs) relies on a deep understanding of the electro-thermal properties of transistors. To shed light on this issue in currently fabricated FinFETs, a quantum mechanical solver capable of revealing atomically-resolved electron and phonon transport phenomena from first-principles is required. In this paper, we consider a global, data-centric view of a state-of-the-art quantum transport simulator to optimize its execution on supercomputers. The approach yields coarse- and fine-grained data-movement characteristics, which are used for performance and communication modeling, communication-avoidance, and data-layout transformations. The transformations are tuned for the Piz Daint and Summit supercomputers, where each platform requires different caching and fusion strategies to perform optimally. The presented results make ab initio device simulation enter a new era, where nanostructures composed of over 10,000 atoms can be investigated at an unprecedented level of accuracy, paving the way for better heat management in next-generation ICs., Comment: 12 pages, 18 figures, SC19
- Published
- 2019
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