1. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
- Author
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Guoqi Zhang, V. Gonda, Kaspar M. B. Jansen, J.M.J. den Toonder, L.J. Ernst, Microsystems, Group Den Toonder, and Institute for Complex Molecular Systems
- Subjects
Materials science ,Linear elasticity ,Low-k dielectric ,Substrate (electronics) ,Dielectric ,Nanoindentation ,Condensed Matter Physics ,Curvature ,Atomic and Molecular Physics, and Optics ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Electrical and Electronic Engineering ,Composite material ,Thin film ,Safety, Risk, Reliability and Quality ,Material properties - Abstract
Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 μm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.
- Published
- 2007