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Abstract: The plasma treatment of rapid heating was introduced for increasing fracture strength of free-standing diamond films. The effects of plasma high temperature annealing treatment on surface morphology, internal stress, vacancy defects, impurities and fracture strength of free-standing diamond films were investigated by scanning electron microscopy (SEM), Raman, positron annihilation technique (PAT) and mechanical property testing. It showed that the fracture strength of the diamond films increases up to 70% for lower fracture diamond films with treating temperature (1500–1600°C). The graphitization in surface and interior of diamond films would be produced by high temperature treatment more than 1700°C. Fracture strengths of diamond films could be enhanced after high temperature treatment and the main factor of that was compressive stress state in diamond films induced by graphitization. The impurity of N was segregated and integrated with vacancy cluster to become [N–V]0 and [N–V]−. [Copyright &y& Elsevier]

In this study, standard diamond bars were prepared using an ultra-thick diamond plate, and the bars had sizes consistent with the International Organization for Standardization (ISO) 14704:2016(E) three-point bending method for measuring the fracture strength. Ultra-thick diamond plate with dimensions of 125 mm (diameter) × 6.5 mm (thickness) were deposited using direct current arc plasma jet chemical vapour deposition. After cutting, grinding, and polishing, 12 diamond bars meeting the requirements of the ISO standard were prepared (36 mm × 4 mm × 3 mm) and tested for fracture strength using the cited ISO standard and elastic modulus using deflection measurements. The fracture strength of the ultra-thick diamond plate was found to be 580 ± 66 MPa. In addition, for comparison, the fracture strengths of standard ZnS, sapphire, and alumina were also analysed. Crucially, this is the first report of the fracture strength of standard-sized diamond plate. The effects of the defects and grain size on the crack formation and failure of the diamond film were analysed. The diamond's fracture strength was affected by the sample thickness, which caused the gradual accumulation of defects as this dimension increased, but not by its length and width. The elastic moduli of sapphire and alumina were compared. Overall, the measurement of the fracture strengths of ultra-thick diamond plate via the ISO standard is important for industrial applications. [ABSTRACT FROM AUTHOR]

Diamond is a highly attractive material for many applications in material science, engineering, chemistry, and biology because of its favorable properties. The preparation of large-area freestanding diamond plate can greatly reduce the production cost of diamond and promote the industrialization of diamond. In this study, the dual-magnetic field mode was introduced to optimize the magnetic field distribution in direct current arc plasma jet chemical vapor deposition (DC Jet CVD) system, and the arc plasma was effectively controlled under the coupling of electric field and magnetic field. The uniformity of the plasma distribution above the substrate surface is significantly improved, resulting in long-term stable and uniform growth of the 8-inch freestanding diamond plate. The influence of dual-magnetic field mode on magnetic field generation, arc feature, and reactive group distribution was studied. 8-inch freestanding diamond plates with an average thickness of 2.8 mm were prepared by dual-magnetic controlled DC Jet CVD. The results showed that the 8-inch diamond plate preferred a high (220) orientation, and the deviation of thickness of which was around 10 % of the averaged values. Raman spectroscopy of diamond revealed a 6.6 cm−1 of full width at half maximum (FWHM) and calculated 1.20 GPa compressive stress in the 8-inch diamond plate. By means of mechanical and thermal property measurements, the large area diamond plate shows a robust structure with the average values of three-point bending fracture strength of 987.2 MPa, and extremely high thermal conductivity of 1797.8 W/(m·k) as well. The deviation of three-point bending fracture strength and the thermal conductivity over the 8-inch diamond plate was around 7.9 % and 12.6 % of the respective averaged values. [Display omitted] • A uniform and robust 8-inch diamond plate was prepared using a dual-field DC arc CVD system. • The average three-point bending fracture strength of the 8-inch diamond plate was 987.23 MPa, and the average thermal conductivity was 1797.80 W/(m•K). • The effect of dual magnetic field mode on the distribution of arc morphology and arc plasma groups was analyzed using a high-speed camera and filter. [ABSTRACT FROM AUTHOR]

In the present study, two types of diamond films with a diameter of 123 mm were deposited by DC arc plasma jet chemical vapor deposition (CVD) operating in the gas recycling mode. These two diamond films were found to possess peculiar grain family morphologies. The fracture strengths of the samples were 182.65 and 995.58 MPa, respectively. To investigate the possible reason for the large difference in the fracture strength between the samples, the surface and fracture morphologies of the two types of diamond films as well as their grain size were characterized. The results revealed that the sample with low fracture strength suffered from a typical intergranular fracture. Weak grain boundary, impurities distributed in the boundary, and low strength of diamond grains led to a decrease in the fracture strength. However, the sample with high fracture strength mainly suffered from transgranular fracture and the columnar grain exhibited numerous voids. Owing to the impact of twinning, the voids could be occupied, thus increasing the contact area between the adjacent grains. Moreover, large grain family on the growth side contained numerous small grains and twins. These small grains, twins on growth side along with the difference of stress on surfaces inhibit fracture strength from decreasing rapidly. All these features benefitted fracture strength. Moreover, when the sample was loaded, the tips located in the voids probably resulted in increase of risk of stress concentration, which might have led to initiation of crack origin and eventual fracture. [ABSTRACT FROM AUTHOR]