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Surface sulfur (S) passivation on InP substrate was performed using a dry process – rapid thermal annealing under H 2 S atmosphere for III–V compound-semiconductor-based devices. The electrical properties of metal-oxide-semiconductor capacitor fabricated with atomic-layer-deposited HfO 2 film as a gate insulator were examined, and were compared with the similar devices with S passivation using a wet process – (NH 4 ) 2 S solution treatment. The H 2 S annealing provided solid S passivation with the strong resistance against oxidation compared with the (NH 4 ) 2 S solution treatment, although S profiles at the interface of HfO 2 /InP were similar. The decrease in electrical thickness of the gate insulator by S passivation was similar for both methods. However, the H 2 S annealing was more effective to suppress interface state density near the valence band edge, because thermal energy during the annealing resulted in stronger S bonding and InP surface reconstruction. Moreover, the flatband voltage shift by constant voltage stress was lower for the device with H 2 S annealing. [ABSTRACT FROM AUTHOR]

Atomic-layer-deposited Al 2 O 3 films were grown on ultrathin-body In 0.53 Ga 0.47 As substrates for III-V compound-semiconductor-based devices. Interface sulfur (S) passivation was performed with wet processing using ammonium sulfide ((NH 4 ) 2 S) solution, and dry processing using post-deposition annealing (PDA) under a H 2 S atmosphere. The PDA under the H 2 S atmosphere resulted in a lower S concentration at the interface and a thicker interfacial layer than the case with (NH 4 ) 2 S wet-treatment. The electrical properties of the device, including the interface property estimated through frequency dispersion in capacitance, were better for (NH 4 ) 2 S wet-treatment than the PDA under a H 2 S atmosphere. They might be improved, however, by optimizing the process conditions of PDA. The PDA under a H 2 S atmosphere following (NH 4 ) 2 S wet-treatment resulted in an increased S concentration at the interface, which improved the electrical properties of the devices. [ABSTRACT FROM AUTHOR]

Abstract: Metal-insulator-semiconductor capacitors were fabricated with sputtered ZnO and atomic layer deposited HfO2 as the semiconductor and gate dielectric layers, respectively. From the capacitance–voltage measurements, it was confirmed that pre-deposition annealing of the sputtered ZnO layer at 300°C in air greatly decreased the interfacial trap density (∼2×1012 cm−2 eV−1). X-ray photoelectron spectroscopy showed a decrease in the OH bonds adsorbed on the ZnO surface after pre-deposition annealing, which improved the interface property. A very small capacitance equivalent thickness of 1.3nm was achieved, which decreased the operation voltage (<5V) of the device significantly. [Copyright &y& Elsevier]