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The influence of BaO content (up to 15 mol%) on the crystallization behaviour, structure, thermal properties and microwave dielectric properties of the BaO-CaO-B 2 O 3 -SiO 2 glasses and glass-ceramics system was investigated. The glasses were produced by melting at 1400 °C and quenching into water, and the glass-ceramics were produced via heat treatment at temperatures between 750 and 800 °C. The results of X-ray diffraction analysis showed that increasing the BaO content raised the resistance of the glass against crystallization and favoured the transformation of β-CaSiO 3 and α-CaSiO 3 phases, which crystallized in the Ba-free and in low BaO content compositions, into SiO 2 and Ba 4 Si 6 O 16 , which crystallized in compositions with higher concentrations of BaO. The BaO content had little influence on the glass transition temperature ( T g ) and the linear coefficient of thermal expansion (CTE), but strongly reduced the softening point ( T s ). Even the addition of BaO as minor additives resulted in a dramatic reduction of the T s ; for example, the T s decreased from 902 °C for the Ba-free composition to 682 °C for the BaO-containing one (5%). Low values of the dielectric constant (5.9 ≤  ε r ≤ 6.63) and dielectric loss (1.12 × 10 −3 ≤ tan δ  ≤ 3.15 × 10 −3 ) were measured. [ABSTRACT FROM AUTHOR]

Abstract: The oxygen content is usually difficult to control in direct bonding copper process. In this study a new method for preparation of direct bonding copper on alumina ceramic substrates was realized. 96% Al2O3 ceramic substrates were first oxidized by pasting a thin layer of Cu2O and firing at 1150 °C in air. Then copper foil was bonded to the substrate by heating to 1070 °C in pure N2 atmosphere. Microstructure and composition of the interface between the copper and Al2O3 ceramic were analyzed. The XRD and EDS results show that an interphase of CuAlO2 was formed and a eutectic transformation between oxygen and copper took place at the interface of the copper and the ceramic substrate. The interface was much thicker than the traditionally bonded substrates, which resulted in a better bonding strength. The directly bonded copper alumina substrate samples showed no evidence of de-bonding after 50 thermal cycles comprising quenching from 220 °C to room temperature. [Copyright &y& Elsevier]

Dense AlN ceramics with a thermal conductivity of 180W/m·K were obtained at the sintering temperature of 1750 °C using CaF2 and YF3 as additives. At temperatures below 1650 °C, the shrinkage of AlN ceramics is promoted by liquid (Ca,Y)F2 and Ca12Al14O32F2. Liquid CaYAlO4 mainly improves the densification of the sample when the sintering temperature increases to 1750 °C. The formation of liquid (Ca,Y)F2 at a relatively low temperature results in homogeneous YF3 distribution around the AlN particles, which benefits the removal of oxygen impurity in the AlN lattice, and thus a higher thermal conductivity. [Copyright &y& Elsevier]