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Abstract: This paper presents the simulation of pressurized underfill encapsulation process for high I/O flip chip package. 3D model of flip chip packages is built using GAMBIT and simulated using FLUENT software. Injection methods such as central point, one line, L-type and U-type are studied. Cross-viscosity model and volume of fluid (VOF) technique are applied for melt front tracking of the encapsulant. The melt front profiles and pressure field for all injection types are analyzed and presented. The pressure distribution within the flip-chip, fill volume versus filling time and viscosity versus shear rate are also plotted. The U-type injection is found to be faster in filling. The numerical results are compared with the previous experimental results and found in good conformity. The strength of CFD software in handling underfill encapsulation problems is proved to be excellent. [Copyright &y& Elsevier]

Abstract: Piezoelectric fans can be manipulated to generate airflow for cooling microelectronic devices. Their outstanding features include noise-free operation, low power consumption and suitability for confined spaces. This paper presents experimental optimization of tip gap and orientation angle of three piezoelectric fans (multi-piezofan) to maximize the heat removal performance of finned heat sink for microelectronic cooling. Design of experiments (DOE) approach is used for the optimization, and a three dimensional simulation using FLUENT 6.3.2 is carried out to better understand the flow induced by the multi-piezofan and the resulting heat transfer from the heat sink surface. For the optimization, the Central Composite Design (CCD) of response surface methodology (RSM) is exploited from the Design Expert software. In the numerical model, the flow induced by the piezofan is treated as incompressible and turbulent; the turbulence is taken care by the shear stress transport (SST) k–ω model. The experimental results are found to be in good agreement with the predictions. Out of 13 experimental trials determined by CCD, the optimum tip gap and fan orientation are found to be δ =0.17 and 90° respectively. At this condition, an enhancement in convective heat transfer coefficient exceeding 88% is achieved, compared to natural convection. [Copyright &y& Elsevier]

Abstract: This paper presents the performance analysis of a finned U-shape heat pipe used for desktop PC-CPU cooling. The experiments are conducted by mounting the system vertically over a heat source situated inside a rectangular tunnel, and force convection is facilitated by means of a blower. The total thermal resistance (Rt ) and heat transfer coefficient are estimated for both natural and forced convection modes under steady state condition, by varying the heat input from 4W to 24W, and the air velocity from 1m/s to 4m/s. The coolant velocity and heat input to achieve minimum Rt are found out and the corresponding effective thermal conductivity is calculated. The transient temperature distribution in the finned heat pipe is also observed. The experimental observations are verified by simulation using ANSYS 10. The results show that the air velocity, power input and heat pipe orientation have significant effects on the performance of finned heat pipes. As the heat input and air velocity increase, total thermal resistance decreases. The lowest value of the total thermal resistance obtained is 0.181°C/W when heat input is 24W and air velocity 3m/s. The experimental and simulation results are found in good agreement. [Copyright &y& Elsevier]

Abstract: In this paper, the finite volume method (FVM) based numerical simulation is used for the flow visualization of capillary driven underfill process for different solder bump arrangements of flip chip packages is presented. Three different 3D flip chip package models are developed and simulated using computational fluid dynamic (CFD) code, FLUENT 6.3. Capillary action and cross viscosity model are taken into account in the simulation. One-line dispensing method is applied in the analysis and the volume of fluid (VOF) technique is used to track the flow front. The effect of solder balls arrangement on flow behavior and filling time is studied and the solder balls arrangement is found to affect the flow behavior and filling time. The flow patterns of simulation are observed for three flip chip packages and compared. The ability of the proposed model and FLUENT in handling flip chip underfill problems is proved to be excellent. [Copyright &y& Elsevier]