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Hybrid DC-DC converters for space applications should be designed for operation at full rated power within the military specification for temperature range of -55 to +125 °C. Hence, the thermal design is a crucial step in the design process of converter, ensuring that no component of the converter exceeds its rated maximum operating temperature. One of the objectives of this work is to guarantee that all electronic components operate below their maximum allowable temperature. For this purpose, a three dimensional model of a converter based on the finite element method was developed. Results based on numerical simulation were validated by experimental data from infrared camera. The total amount of dissipated power in every component was determined experimentally based on a prototype converter. In the case of a component with high power consumption, such as the field effect transistor, the increase in temperature was minimized by applying designed heat sink with a high-thermal-conductivity material. [ABSTRACT FROM AUTHOR]

The overall power of an outdoor-exposed photovoltaic (PV) module decreases as a result of thermal cycling (TC) stress, due to the formation of cracks between the solder and metal. In this study, the thermal fatigue life of solder (62Sn36Pb2Ag) interconnection between copper and silver metallization in PV module was studied. This paper describes in detail the degradation rate (RD) prediction model of solder interconnection for crystalline PV module. The RD prediction model is developed which based on published constitutive equations for solder and TC test results on actual PV module. The finite element method was employed to study the creep strain energy density of solder interconnections in TC conditions. Three types of accelerated tests were conducted to determine the prediction model parameters. RD in benchmark condition is predicted and compared with those of TC conditions. [ABSTRACT FROM AUTHOR]