1. A simple analytic, slug–deposited liquid film thermal resistance/conductance model for oscillating heat pipe.
- Author
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Krippner, K., Daimaru, T., and Kaviany, M.
- Subjects
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THERMAL resistance , *LAMINAR flow , *CHECK valves , *HEAT transfer , *TURBULENT flow , *HEAT pipes , *LIQUID films - Abstract
• Using a single-loop, unidirectional slug flow oscillating (pulsating) heat pipe model with the heat transfer controlled by conduction through the slug-deposited liquid film and a simple evaporation rate model relating the slug velocity and heat flux, the overall thermal resistance/conductance is predicted with an analytic expression. • The results are also compared and validated with a more complete, statistical 1-D heat, mass, momentum transport simulation results. • The prediction offers an upper bound on conductance for the available experiments with R134a, butane, acetone, and water. A simple analytic model for the thermal resistance of the oscillating (pulsating) heat pipe (OHP or PHP) is proposed and verified. It is based on the Taylor liquid film formed by moving liquid slugs, film heat conduction, and interfacial evaporation/condensation. It uses a unidirectional flow (characteristic of use of check valves) in a horizontal (no gravity effect) single-loop OHP to derive a relationship between the slug velocity and heat flux. The model predictions are verified with experiments. In addition, the CFD results for the slug-deposited liquid film thickness δ l support that the transition from laminar flow (at Reynolds number, Re D = 2000, D is the diameter) tends toward a constant film thickness regime, previously observed (experimentally) and correlated. Prior direct 1-D simulations also show that at yet higher Re D (3700), a constant slug velocity regime is reached. The evaporator specific thermal resistance, A e R e = A e /G e = δ l /k l , (k l is liquid thermal conductivity) and the total OHP thermal resistance R, is predicted and compared with the current and available related experimental results (for R134a and butane) with good agreement. The suggested ideal high heat flux (constant film thickness δ l , c limit for Re D > 2000) dimensional total ideal resistance is R = 1 G = δ l , c k l (1 A e + 1 A c ) , with δ l , c = 120 D La − 2 / 3 , providing a lower limit on R (upper limit on G). The filling ratio, flooding, and local dryout effects causing deviation from the ideal conductance are addressed. This analytical model can be extended to non-circular channels by using the hydraulic diameter. [Display omitted] [ABSTRACT FROM AUTHOR]
- Published
- 2024
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