82 results on '"Chen, Chuantong"'
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2. Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
3. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
4. Effects of high temperature and high humidity on the reliability of copper/epoxy bond
5. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
6. Low-temperature copper sinter-joining technology for power electronics packaging: A review
7. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
8. Size effect of nickel-based single crystal superalloy revealed by nanoindentation with low strain rates
9. Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications
10. Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer
11. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
12. Effect of nanosecond pulsed laser parameters on texturing formation of metallic surface: Experiment and modelling
13. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
14. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
15. Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism
16. Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution
17. Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
18. Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6
19. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
20. Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies
21. Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation
22. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
23. Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating
24. Self-assembled layer as an effective way to block copper diffusion into epoxy
25. Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size
26. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
27. Copper diffusion into epoxy under high temperature
28. Effect of electroplated Au layer on bonding performance of Ag pastes
29. Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution
30. Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects
31. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation.
32. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging.
33. Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test.
34. Development of anti-oxidation Ag salt paste for large-area (35 [formula omitted] 35 mm2) Cu-Cu bonding with ultra-high bonding strength.
35. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations.
36. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste.
37. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate.
38. Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules.
39. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size.
40. Corrigendum to 'Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste': [Scripta Materialia, Volume 198, June 2021, 113833].
41. Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution.
42. Bonding technology based on solid porous Ag for large area chips.
43. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature.
44. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices.
45. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock.
46. Specimen size effect on elastic–plastic strength evaluation of interface between thin films.
47. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste.
48. Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions.
49. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro.
50. Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less.
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