1. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film.
- Author
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Kim, Dongjin, Choe, Chanyang, Chen, Chuantong, Lee, Sangmin, Lee, Seung-Joon, Park, Semin, Noh, Seungjun, and Suganuma, Katsuaki
- Subjects
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FATIGUE life , *ELECTRON backscattering , *HIGH temperatures , *CRYSTAL grain boundaries , *ELECTRON diffraction , *CYCLIC fatigue - Abstract
[Display omitted] • Fatigue characteristics of high-purity Cu films from RT to 200 °C were investigated. • TMF characteristics of high-purity Cu were systematically and numerically revealed. • The change in the grain of Cu at high temperatures leads to a reduced fatigue life. • Ʃ3 fraction decreases and the LAGB fraction increases as the temperature increases. • Fatigue life is significantly changed even below the recrystallization temperature. This study conducts stress-controlled cyclic tension-tension tests from room temperature (RT) to 200 °C, at 50 °C intervals, on high-purity Cu films to comprehensively understand the temperature-dependent fatigue life and the related microstructural and fracture characteristics. As evidenced by the electron backscattering diffraction analysis, the Ʃ3 boundary fraction decreases and the low-angle grain boundary fraction increases as the temperature increases. The significant change in the grain structure at high temperatures leads to a reduced fatigue life. The fatigue striations are closely spaced at RT and the fracture surface develops into the typical fatigue striation and the void zones. [ABSTRACT FROM AUTHOR]
- Published
- 2021
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