Mödlinger, Marianne, Provino, Alessia, Solokha, Pavlo, De Negri, Serena, Caglieris, Federico, Ceccardi, Michele, Bernini, Cristina, and Manfrinetti, Pietro
During the investigation of the Cu-As-Sb ternary system, we identified the ternary intermetallic Cu 3−x (As,Sb) compound. Its crystal structure was solved and refined by single crystal and powder X-ray diffraction. While the binary Cu 3−x As and Cu 3−x Sb phases crystallize in the hexagonal Cu 3 P-type (hP 24, P 6 3 cm) and cubic anti-BiF 3 -type (cF 16, Fm 3 ¯ m), respectively, Cu 3−x (As,Sb) adopts the cubic Cu 6 AsSb prototype (cP 32, Pm 3 ‾ n). Crystallochemical reasons lead to the exclusion that its structure could be of the UH 3 -type. Cu 3−x (As,Sb) is isotypic with Cu 12−x TeSb 3 ; their crystal structure is a stuffed ternary derivative of the Cr 3 Si-type. SEM-EDX analyses reveal very large compositional ranges for this compound, mostly concerning the Sb/As ratio: 71.1−73.9 at.% Cu, 4.0−24.5 at.% As and 2.5−23.5 at.% Sb, corresponding to about Cu 2.5-2.8 As 0.23-0.98 Sb 0.23-0.92 (x = 0.2−0.5). The lattice parameter and, consequently, the unit cell volume regularly expand while increasing the Sb/As compositional ratio: a ≈ 7.47 Å for Cu 3−x As 0.75 Sb 0.25 , a ≈ 7.65 Å for Cu 3−x As 0.25 Sb 0.75 (averaged values). Cu 3−x (As,Sb) forms either by a peritectic reaction for As-rich compositions, or congruently for the equiatomic Sb/As and Sb-rich compositions. The decomposition- or melting-temperature values decrease as a function of the Sb/As compositional ratio [ e.g. peritectic at 710 °C for Cu 3−x As 0.75 Sb 0.25 (Cu 72 As 21 Sb 7), congruent melting at 690 °C for Cu 3−x As 0.50 Sb 0.50 (Cu 72 As 14 Sb 14), and at 675 °C for Cu 3−x As 0.25 Sb 0.75 (Cu 72 As 7 Sb 21)]. Physical properties (electrical resistivity and magnetic susceptibility) indicate that Cu 3−x (As,Sb) behaves as a good metal with electrical resistivity decreasing as the Sb/As compositional ratio increases; a peculiar anomaly in the electrical resistivity behavior (heavy-fermions like) was observed at low temperature, the origin of which needs further investigation. The compound is a standard diamagnet. • new ternary intermetallic Cu 3−x (As,Sb) compound identified. • first isotypic intermetallic compound crystallizing with the ternary Cu 9.1 TeSb 3 aristotype. • electrical resistivity indicate a good metal. • peculiar anomaly in electrical resistivity behavior observed at low temperature. • the intermetallic Cu 3−x (As,Sb) compound is a standard diamagnet. [ABSTRACT FROM AUTHOR]