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2. Optimization of the thermal distribution of multi-chip LED package

Author

Maussion, Pascal, Ben Abdelmlek, K., Araoud, Z., Charrada, K., Zissis, Georges, COmmande et DIAgnostic des Systèmes Electriques (LAPLACE-CODIASE), LAboratoire PLasma et Conversion d'Energie (LAPLACE), Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées-Université Fédérale Toulouse Midi-Pyrénées-Institut National Polytechnique (Toulouse) (Toulouse INP), Université Fédérale Toulouse Midi-Pyrénées-Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées, Unité d’Éude des Milieux Ionisés et Réactifs [Monastir] (EMIR), Institut Préparatoire aux Etudes d'Ingénieurs de Monastir (IPEIM), Université de Monastir - University of Monastir (UM)-Université de Monastir - University of Monastir (UM), and Lumière et Matière (LAPLACE-LM)

Subjects
Materials science, business.industry, 020209 energy, Thermal resistance, Energy Engineering and Power Technology, 02 engineering and technology, 021001 nanoscience & nanotechnology, Chip, 7. Clean energy, Industrial and Manufacturing Engineering, Thermal management of high-power LEDs, [SPI.TRON]Engineering Sciences [physics]/Electronics, law.invention, LED lamp, Interference (communication), law, [SPI.OPTI]Engineering Sciences [physics]/Optics / Photonic, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Junction temperature, 0210 nano-technology, business, Thermal analysis, ComputingMilieux_MISCELLANEOUS, Light-emitting diode
Abstract

Light emitting diodes (LEDs) are fascinating a thermal problem due to the increase of their junction temperature. Thermal management of LED module is the key to improve the performances of LED. In this paper, a three dimensional thermal analysis of 3.5 W multi-chip COB (chip-on-board) LED package was developed using COMSOL Multiphysics®. An optimization of the number of LED-chip and their disposition on different substrate was carried out. The results showed that the interference of heat spreading in substrate level, the junction temperature and the thermal resistance of the LED lamp decreased well with the increase of gaps between chips and reached an optimal value. A correlation of optimal pitch was determined as a function of chip number, chip size and substrate size. It was found that using the optimal multi-chip model instead of one LED-chip leads to a decrease of the junction temperature about 12.54%, 14.96% and 17.1% for AlN, Al2O3 and IMS substrates respectively.

Published
2017
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