67 results on '"Chen, Chuantong"'
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2. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: experiment validation and numerical simulation
3. Copper diffusion into epoxy under high temperature
4. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
5. Effect of thermal-mechanical conditions on strength of silanized Al alloy/CFRTP hybrid joint made by thinning-controlled hot pressing
6. Size effect of nickel-based single crystal superalloy revealed by nanoindentation with low strain rates
7. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
8. Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates
9. Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications
10. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
11. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations
12. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
13. Effect of Nanosecond Pulsed Laser Parameters on Texturing Formation of Metallic Surface: Experiment and Modelling
14. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
15. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
16. Corrigendum to ‘Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste’: [Scripta Materialia, Volume 198, June 2021, 113833]
17. Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
18. Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6
19. Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives
20. Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution
21. Improving bonding strength of Al/CFRTP hybrid joint through modifying friction spot joining tools
22. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
23. Unveiling the damage evolution of SAC305 during fatigue by entropy generation
24. Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling
25. Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies
26. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
27. Development of Micron-Sized Cu–Ag Composite Paste for Oxidation-Free Bare Cu Bonding in Air Condition and its Deterioration Mechanism During Aging and Power Cycling Tests
28. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
29. Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability
30. Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test
31. Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength
32. Influence of laser welding power on steel/CFRP lap joint fracture behaviors
33. Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure
34. Microstructural and interface geometrical influence on the mechanical fatigue property of aluminum/high-strength steel lap joints using resistance element welding for lightweight vehicles: experimental and computational investigation
35. Development of Robust Oxidation-Free Cu-Cu Direct Bonding with Micron-Sized Cu–Ag Salt Composite Paste and Deterioration Mechanism During Aging and Power Cycling
36. Development of Crack-Less and Deformation-Resistant Electroplated Ni/Electroless Ni/Pt/Ag Metallization Layers for Ag-Sintered Joint During a Harsh Thermal Shock
37. Chemical Bonding of Copper and Epoxy Through Thiol Based Self-Assembled Layer for Post 5g/6g Semiconductors
38. Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation
39. Development of 10µm-Sized Cu-Ag Composite Paste for Large Area and Robust Bare Cu Bonding in Low Temperature Low Pressure Air Conditions
40. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film
41. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste
42. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
43. Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions
44. Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding
45. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro
46. Reactive wafer bonding with nanoscale Ag/Cu multilayers
47. Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
48. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste
49. Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating
50. Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition
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