1. Analytical solution of unsteady heat conduction in a two-layered material in imperfect contact subjected to a moving heat source
- Author
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J.C. Labbe, M. El Ganaoui, Hamid Belghazi, Science des Procédés Céramiques et de Traitements de Surface (SPCTS), Université de Limoges (UNILIM)-Ecole Nationale Supérieure de Céramique Industrielle (ENSCI)-Institut des Procédés Appliqués aux Matériaux (IPAM), Université de Limoges (UNILIM)-Université de Limoges (UNILIM)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), Axe 2 : procédés de traitements de surface, and Université de Limoges (UNILIM)-Université de Limoges (UNILIM)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Ecole Nationale Supérieure de Céramique Industrielle (ENSCI)-Institut des Procédés Appliqués aux Matériaux (IPAM)
- Subjects
Two-layered material ,Cladding (metalworking) ,Thermal contact conductance ,Work (thermodynamics) ,Materials science ,Unsteady ,020209 energy ,General Engineering ,Separation of variables ,Thermal contact ,02 engineering and technology ,Mechanics ,Analytical ,engineering.material ,Condensed Matter Physics ,Thermal conduction ,020303 mechanical engineering & transports ,0203 mechanical engineering ,Coating ,Contact ,0202 electrical engineering, electronic engineering, information engineering ,engineering ,Heat equation ,Heat conduction - Abstract
International audience; An analytical approach of transient heat conduction in two-layered material, of finite depth, with an imperfect thermal contact, subjected to a moving gaussian laser beam was developed. The method consists of deriving the solution of the homogeneous part of the heat equation by using the well known separation of variables method and expressing the source term in series form. The porous aspect of granular coating layer on substrate was also taken into account earlier in this modelling work. This model has been successfully applied on a practical system; laser cladding of electronic copper tracks on alumina substrates. This analytical model can be used also for estimation of the thermal contact resistance between layers.
- Published
- 2010
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