1. Etch process modules development and integration in 3D-SOC applications
- Author
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Gerald Beyer, Joeri De Vos, Lan Peng, Anne Jourdain, Daniele Piumi, Eric Beyne, Nina Tutunjyan, Andy Miller, Nouredine Rassoul, Stefaan Van Huylenbroeck, Fumihiro Inoue, and Stefano Sardo
- Subjects
Computer science ,Process (engineering) ,Hardware_PERFORMANCEANDRELIABILITY ,02 engineering and technology ,Dielectric ,Overlay ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Chip ,Atomic and Molecular Physics, and Optics ,020202 computer hardware & architecture ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Characterization (materials science) ,Development (topology) ,Hardware_INTEGRATEDCIRCUITS ,0202 electrical engineering, electronic engineering, information engineering ,Electronic engineering ,Wafer ,Electrical and Electronic Engineering ,0210 nano-technology ,Scaling - Abstract
Since the challenges of maintaining the Moore's law - through traditional dimensional scaling or exploiting new materials properties - are becoming increasingly difficult, 3D integration technologies are gaining more and more attention and importance. At system level 3D-SOC solutions are of great interest, in particular those obtained through Wafer-to-Wafer (W2W) bonding due to superior overlay performance. In this paper we present the development of etch process modules for fine pitch via last interconnects realized on wafers with dielectric bonding and their integration in a packaging test chip, followed by electrical characterization.
- Published
- 2018