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Your search keyword '"Wong, Ching‐Ping"' showing total 203 results

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203 results on '"Wong, Ching‐Ping"'

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12. Transposable, highly thermal conductive silicone rubber/boron nitride composites with enhanced orientation of BN by multilayer stacked hot pressing according to rheological control

16. A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging

24. Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

41. Thermo-managing and flame-retardant scaffolds suppressing dendritic growth and polysulfide shuttling toward high-safety lithium–sulfur batteries

42. Electrically conductive gradient structure design of thermoplastic polyurethane composite foams for efficient electromagnetic interference shielding and ultra-low microwave reflectivity

43. The tunable sensing behaviors of flexible conductive PDMS/NCG composites via regulation of filler size prepared by a facile sedimentation method

48. Lightweight thermal interface materials based on hierarchically structured graphene paper with superior through-plane thermal conductivity

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