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3. Behavior and analytical investigation of assembled connection between steel beam and concrete encased CFST column

7. Broadband inductance modeling of TXVs for 3D interconnection

11. Electromagnetic modeling and analysis of the tapered differential through glass vias

13. Design of compact LC lowpass filters based on coaxial through-silicon vias array

14. Fe3O4@Au SERS tags-based lateral flow assay for simultaneous detection of serum amyloid A and C-reactive protein in unprocessed blood sample

15. Physics based scalable inductance model for three-dimensional solenoid inductors

16. Experimental evaluation of seismic performance of unbonded prestressed reinforced concrete column

17. Crossover effects in dilute magnetic materials by finite-time dynamics method

18. Capacitance characterization of tapered through-silicon-via considering MOS effect

19. Facile fabrication of nanoporous platinum by alloying–dealloying process and its application in glucose sensing

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