15 results on '"Yang Fang-Zu"'
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2. 1-(2-Pyridylazo)-2-naphthol as a Synergistic Additive for Improving Throwing Power of Through Hole Copper Electronic Electroplating
3. Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection
4. A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
5. Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4− coordination ions
6. Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
7. Molecular plating of actinide compounds on wafer-scale aluminum substrate
8. Electro-reduction of Cr(III) ions under the effects of complexing agents and Fe(II) ions
9. Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complex
10. Phase transformation sequence of amorphous ferrochrome alloy electrodeposit
11. Novel fullerene-based ferrocene dyad and diferrocene triad: Synthesis and effects of introduction of fullerene[60] and phenyl linker on the thermodynamic stability, the magnetic properties and the band structure
12. Determination of adsorbed species of hypophosphite electrooxidation on Ni electrode by in situ infrared with shell-isolated nanoparticle-enhanced Raman spectroscopy
13. Phase transformation sequence of mixed-structural electroless Ni-19.7at.% P deposit
14. Fabrication and properties of macroporous tin–cobalt alloy film electrodes for lithium-ion batteries
15. Controllable nanogap fabrication on microchip by chronopotentiometry
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