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Purpose Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too much impact on the improvement of solders’ performance but were difficult to achieve satisfactory results. It is urgent to develop new soldering technology to avoid the bottleneck of lead-free solder. low-temperature-stirring soldering and ultrasonic-assisted soldering was developed in the authors’ early work, but slag inclusion and pore would gather and grow up to lead decreasing of the shear strength. In this paper, Cu/SAC0307 +Zn power/Cu joints with ultrasonic-assisted at low-temperature was successfully achieved. Design/methodology/approach 45um Zn-powder and SAC0307 No.4 solder powder were mixed to fill the Cu-Cu joint, and the content of Zn-powder were 0 and 5%, 7.5% and 10%, 12.5% and 15% respectively. During the soldering process under ambient atmosphere %252C the heating platform provided a constant 220%253 F and the ultrasonic vibrator applied a constant pressure of 4 MPa to the copper substrate. The soldering process was completed after holding 70 s at 300 W. Findings The Zn particles made the IMC at the joint interface and in the soldering seam from scallop-type Cu6Sn5 to flat-type Cu5Zn8. The shear strength of joints without Zn was only 12.43 MPa, the shear strength of joints with 10% Zn reached a peak of 34.25 MPa, and the shear strength of joints containing 10% Zn was 63.71% higher than that of joints without zinc particles, and then the shear strength decreased. In addition, with the increase of zinc content, the fracture mode of the joint changed from the brittle fracture of the original layered tears to the mixed tough and brittle fracture. Originality/value A new method that Zn micron-size powders and SAC0307 micron-size powders was mixed to fill the joint, and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted without flux at low-temperature.

Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes. Design/methodology/approach Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer. Findings It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation. Research limitations/implications However, detail composition of the fluxes was not further explored for the scope of this paper. Originality/value The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.

Purpose The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths. Design/methodology/approach Sn-Cu solder coatings were produced from a plating solution containing sodium stannate, copper stannate, sodium hydroxide and sorbitol additive on copper substrates. The pulse plating experiments were conducted in galvanostatic mode. The plating current density was varied from 5 to 25 mA/cm2, and the morphology of the coatings was studied. The solderability of the coatings was assessed by spread ratio measurement after reflowing the solder coatings at 250°C. Findings The composition control of eutectic solders is always a challenge in plating. The findings show that Sn-Cu coatings prepared by pulse plating are composed of tetragonal ß-Sn structure and Cu6Sn5 compounds irrespective of bath composition and conditions. The final coatings were very dense and smooth with nodular morphology. It was shown that a eutectic composition can be achieved if we apply a current density of ∼15-20 mA/cm2. The solderability studies suggest that solder coatings plated at and beyond 15 mA/cm2 are more suitable for solder finish applications. Originality/value The work presents key issues in pulse electroplating of Sn-Cu solder coatings from an alkaline bath. Possible strategies to control the eutectic Sn-Cu composition by plating process are recommended.

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.

Purpose This paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints. Design/methodology/approach The 01005 capacitors were mounted on OSP-coated pads, and the samples were fabricated in four different atmospheres, i.e. 200 ppm O2/N2, 1,000 ppm O2/N2, 3,000 ppm O2/N2 and air. After the reflow process, visual inspection and X-ray detection were carried out to examine the solder joint shapes and possible defects. Some of the samples fabricated in different conditions were cross-sectioned and the solder joint microstructures were analyzed. On the other hand, besides placing the components on their normal pad positions, a 50 per cent offset of the x-axis (long axis) or y-axis (short axis) was introduced into the chip mounter programs to evaluate the 01005 capacitor’s assembly sensitivity to placement accuracy. The process-induced defects were investigated. Findings Experimental results indicated that an N2-based protective atmosphere was necessary for 01005 type assembly, as it could obviously improve the 01005 solder joint quality, compared with the air condition. The protective atmosphere had little effect on the appearance, quality and microstructure of solder joints when the oxygen concentration was below 3,000 ppm. But a very low oxygen concentration could increase the risk of tombstoning defects for the assembly process. The N2-based protective atmosphere containing 1,000-2000 ppm O2 was acceptable and appropriate for the assembly of tiny components. Originality/value The results of this work provide a set of reflow process parameters and recommendations for 01005 size component assembly in manufacturing.

Purpose This study aims to synthesize polyethylene glycol (PEG)-rosin derivatives from rosin and PEG for the production of solid soldering fluxes. The PEG-rosin derivatives would be water soluble, and the resulting solid soldering fluxes would have reasonable wetting ability when combined with a low-halide-content activator. Design/methodology/approach This paper presents a synthetic process for PEG-rosin derivatives. The reaction conditions (including catalyst type, catalyst concentration, reaction temperature and PEG type) were optimized for the synthesis of PEG-rosin derivatives. The chemical and physical properties of PEG-rosin derivatives were characterized by Fourier transform infrared spectroscopy, carbon-13 nuclear magnetic resonance spectrometry, differential scanning calorimetry and gel permeation chromatography. The production and characteristics of water-soluble rosin fluxes (WSRFs) were studied according to the standards of the Japanese Industrial Standards (JIS) Committees. Findings WSRs were successfully synthesized from rosin and PEG using 2 per cent ZnO as a catalyst, with a 2:1 molar ratio of rosin:PEG at 250°C over 9 h. The resulting WSRs were completely soluble in water. As the PEG3000-rosin had the highest melting point (55.2°C), it was chosen for the preparation of the WSRFs. Activators such as succinic acid, glutaric acid, ethylamine hydrochloride and diethylamine hydrobromide were selected for use in the production of the fluxes. It was found that WSRF 09 and WSRF 04 gave the best performance with the lead-free Sn-0.7Cu solder alloy in terms of good solderability, low halide content (less than 1,500 ppm), high insulation resistance and low corrosion. These fluxes were applied to produce solder pastes with Sn-3.0Ag-0.5Cu alloy and they passed the performance tests as expected for solder paste. Research limitations/implications Further studies are necessary on large-scale production and to compare the performance of these fluxes to those from conventional water-soluble fluxes currently available in the market. Application of these fluxes on low-temperature solder alloys such as SnZn and SnBi (Ren et al., 2016) worth further study. Originality/value The classification of flux systems according to the JIS 3283 standard does not specify PEG-rosin derivatives in the flux; nevertheless, ranking of the flux systems based on the halide content and corrosion properties of activators would be useful information when selecting flux systems for electronics soldering in water-washable applications. The application of these fluxes in solder paste gave very promising results and is worth investigating into more detail, as well as field test.

PurposeThe purpose of this paper is to present an overview of the evolution of organic solderability preservatives (OSP) technology from a temporary anti‐tarnish to an approved process for the lead‐free assembly of high‐reliability printed circuit boards (PCBs).Design/methodology/approachAs this is an informational paper, the main approach was to compare and contrast various types of OSP molecules and their fitness for use.FindingsThe active ingredient of an OSP is one of the most important ingredients that can help to improve the heat resistance, which becomes much more important in conjunction with lead‐free solder. The latest OSP shows excellent stability, even at more than the peak reflow temperatures used with lead‐free solders. The success of any OSP process is highly correlated to process control and maintenance and OSP formulations are not created equal. The thickness of the film is only one difference. However, the key differentiators for OSP coatings are the overall ability of the organic film to resist oxygen penetration and humidity; and withstand the higher temperatures of lead‐free assembly. The author suggests that original equipment manufacturer (OEMs), contract manufacturers and PCB fabricators perform testing and qualification of OSPs using industry‐accepted reliability and solderability testing methods.Research limitations/implicationsThis work represents the author's extensive experience with OSP technology, as well as the results of a collective collaboration with Shikoku Chemical Corporation. The findings represent reliability and solderability testing carried out in various manufacturing sites including cooperation with certain OEMs that are users of circuits fabricated with OSP technology.Originality/valueThis paper details how critical advances in OSP technology have enabled improvements in solderability and reliability over earlier commercial generations and have further enhanced the solderability of lead‐free assemblies.

PurposeThe purpose of this paper is to present details of the plasma printing and packaging technology (P3T), a new reel‐to‐reel technology under development for the cost and resource efficient manufacture of flexible printed circuits (FPC).Design/methodology/approachThe first two process steps of P3T include reel‐to‐reel patterned activation of polymer film at ambient pressure in the so‐called plasma‐printing process and subsequent selective electroless plating of the plasma‐activated areas of the polymer film. The concept underlying the P3T project includes processing of flexible films with widths up to 400 mm.FindingsCopper, palladium and nickel metal structures with widths down to less than 100 μm were produced on various polymers. Peel strengths according to the German DIN Standard 53494 of copper on polyimide film reached values in the region of 1 N/mm, sufficient for electronic applications. Sufficient wetting of the solder on copper metallisations and solderability were found.Research limitations/implicationsP3T covers the whole manufacturing chain for FPCs from surface patterning of the dielectric carrier to component assembly and soldering. This paper focuses, however, essentially on the first two process steps including plasma activation and electroless plating.Originality/valueA unique feature of the flexible circuit manufacturing technology presented here is the combination of the additive‐technique, the absence of vacuum processes, the continuous production mode and the ability to process polymer carrier films with widths of 400 mm.

Purpose – The purpose of this paper is to evaluate the effect of nitrogen and air atmospheres on the solderability testing of plasma‐treated hot air solder level (HASL) finish printed circuit boards (PCBs).Design/methodology/approach – In this paper, the soldering performance of plasma‐treated HASL finish PCBs in nitrogen and air atmospheres have been evaluated using the wetting balance technique. The results were compared with the performance of conventionally flux‐treated samples soldered in air and nitrogen atmospheres and non‐flux treated samples soldered in air. Auger chemical analysis results were also compared with the solderability test results in order to obtain a complete profile of the plasma‐treated and non‐treated surfaces.Findings – The results of the auger chemical analysis show high organic (carbon) levels in the control samples and a significant drop in organic levels in the plasma‐treated samples. The significant drop in the level of carbon leads to a decrease in contact angle and an inc...

PurposeThe purpose of this paper is to present the optimisation of protocols for the immersion coating of silver onto copper‐track printed circuit board (PCB) assemblies, using a novel class of ionic liquid and to show the implementation of the scale up process.Design/methodology/approachVarious conditions (temperatures and silver concentrations) are studied individually under laboratory conditions and then optimised for a pilot scale demonstrator line that is used to process British Standard test coupons.FindingsThe use of these novel liquids for the immersion coating of silver produces silver dip coatings that are bright and even and which give solderability that is as good as the commercial aqueous, nitric acid based, electroless process without any solder‐mask interface etching.Research limitations/implicationsThe combined technology has been optimised for an immersion silver coating line. Further development work should be undertaken to tailor the technology for gold immersion coating of PCB assemblies.Originality/valueThe paper details a process in which no solder‐mask interface etching is observed; that does not require the use of strong inorganic acids or expensive catalysts to sustain deposition and which does not appear to be light sensitive in contrast to other processes.

PurposeThe purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.Design/methodology/approachThis new finish utilises nanotechnology and is based on a new formulation of the “organic metal” (OM).FindingsThe final surface finish is an approximately 50 nm thin permanent layer, consisting of a complex between the OM and silver (Ag). Panels finished with OrmeSTAR™ Ultra show excellent solderability in spite of a low‐layer thickness and therefore offer significant advantages over existing surface finishes.Originality/valueThis new finish has proven to be a competitive alternative to current final finishes with excellent properties for soldering applications. The new nanotechnology can also significantly improve the environmental and economical consequences of solderable surface finishing.

PurposeThe aim of this paper is to detail the changes needed to ensure compatibility of printed‐circuit board (PCB) surface finishes with the use of lead‐free solders and in lead‐free assembly processes.Design/methodology/approachThe paper describes the various popular solderable surface finishes that are currently available. It then reviews them in terms of the required adaptations necessary to meet the requirements of the Restriction of Hazardous Substance (RoHS) Directive and to ensure compliance, whilst meeting the performance needs of the product.FindingsSome of the available and popular finishes, such as organic solderability preservatives and tin require modifications while, others including silver, direct immersion gold and electroless nickel immersion gold are transitioning well into the world of lead‐free. Electroless nickel, electroless palladium, immersion gold is one finish that performs better with lead‐free assembly than it did with conventional eutectic solder‐based approaches.Originality/valueThe paper provides a concise overview of the implications for specific surface finishes when making choices for use with lead‐free and RoHS compliant PCB soldering and assembly.

PurposeThe purpose of this paper is to describe the board level reliability test results of four IC packages with lead‐free balls/platings, soldered with lead‐free solder paste, during thermal cycling. The board level reliability test results of tin‐lead balled/plated packages soldered with lead‐free solder paste have also been included for comparison.Design/methodology/approachFour different packages, i.e. ball grid array (BGA), chip scale package (CSP), quad flat package (QFP) and thin small outline package (TSOP), were assembled on a test printed circuit board (PCB) as the test vehicle. Lead‐free and tin‐lead BGA/CSP packages were equipped with Sn‐3.0Ag‐0.5Cu and Sn‐37Pb solder balls, respectively. The lead‐frames of lead‐free QFP/TSOP leaded‐packages were plated with Sn‐58Bi and those of tin‐lead QFP/TSOP leaded‐packages, Sn‐37Pb. The lead‐free solder paste used in this study was Sn‐3.0Ag‐0.5Cu. Two kinds of surface finishes, immersion gold over electroless nickel (Au/Ni) and organic solderability preservative, were used on the PCBs. The test PCBs were thermal cycled 5,000 times within the temperature range of −40 to 125°C and electrically monitored during the thermal cycling.FindingsIt was found that the tin‐lead balled/plated BGAs, CSPs, QFPs and TSOPs soldered with lead‐free solder paste showed serious board level reliability risks as their abilities to withstand thermal cycling stresses are much weaker than those of entirely lead‐free assemblies. Neither package nor surface finish was found to have any effects on the board level reliability of test vehicles with lead‐free balled/plated BGAs, CSPs, QFPs and TSOPs. Metallographic examinations were conducted to investigate the effect of thermal cycling on the failure modes of solder joints.Originality/valueThe paper is of value by contributing to research in the use of lead‐free solder paste with lead‐containing packages in the industry. Currently, there is a deficiency of knowledge in this area.

PurposeTo study the effect of Ag content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free Solders.Design/methodology/approachThe solder alloys used in the experiment were Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X‐ray, X‐ray diffraction and electron probe micro analysis.FindingsA small increase in Ag content in the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders, from 0.1 to 1.0 wt%, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi‐intermetallic layers of Cu‐Zn and Ag‐Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces.Research limitations/implicationsThe silver contents in the studied Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt%.Practical implicationsUseful literature for solder alloy designers and SMT engineers.Originality/valueThe paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders.

PurposeThis study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular immersion silver solutions.Design/methodology/approachThe paper describes in detail the necessary steps in the mildly alkaline immersion silver process.FindingsThe process can overcome the problems of conventional acidic immersion silvers, especially in thermal shock and stress testing. Also it does not affect soldering or aluminium wire bonding.Originality/valueThis is arguably a pioneering study in that it posits the benefits of mildly alkaline immersion silver as a final finish for solderability.

PurposeTo investigate the relationship between intermetallic compound (IMC) formation and solderability for immersion tin deposit under different number of reflows.Design/methodology/approachScanning Auger microscopy and X‐ray photoelectron spectrometer surface analysis techniques were used to study changes in immersion tin deposit layer when subjected to simulated solder reflow conditions.FindingsAuger analysis also showed that no three discrete uniform layers of pure tin, Cu6Sn5η‐phase and Cu3Sn ε‐phase can be observed after one reflow. Degradation in solderability performance after reflow was due to the formation of a Cu6Sn5 IMC at the surface. This IMC has inferior solder wetting properties compared to tin. As the number of reflow cycles increases the surface contains less tin rich regions and more IMC regions. Experiments showed that longer reflow times during the assembly process or use of a thicker tin layer can improve the solderability after three reflow cycles.Research limitations/implicationsThis work has shown that longer reflow times during the assembly process or use of a thicker tin layer can improve solderability after three reflow cycles. These two approaches are thus recommended when using immersion tin finishes on PCBs that require multiple lead‐free reflow cycles.Originality/valueThis paper provides valuable data that will assist PCB assemblers to optimise their solder reflow conditions when assembling boards that require multiple solder cycles.

PurposeTo evaluate the oxide formation characteristics of tin (Sn) as a function of conditioning treatment and define a conditioning methodology that rapidly produces a tin oxide thickness and oxide species morphology similar to those formed in ambient oxidation.Design/methodology/approachElectrochemical reduction analysis and scanning electron microscopy techniques were utilized to identify tin oxide species and oxide quantities on tin samples which were subjected to a variety of conditioning methodologies.FindingsTin oxide species were identified and oxide quantities measured. Comparisons of tin oxide species/quantities were completed for the different conditioning methodologies used and for other industry oxide investigations. The following conclusions were reached: all conditioning methodologies produced both SnO and SnO2 tin oxide species; steam conditioning produced the thickest oxides; the conditioning methodologies investigated were found to produce oxide thicknesses similar to those formed under ambient conditions.Research limitations/implicationsFurther investigation would be beneficial using this study as a foundation. Additional conditioning methodologies and a larger selection of various tin surfaces would provide a future understanding of the impact of oxide species and thickness on solderability.Practical implicationsThe electronics industry has attempted to “predict” a surface's susceptibility to oxidation by using accelerated conditioning techniques. An understanding of the formation of tin oxidation products created by accelerated conditioning techniques could be highly beneficial to the electronics industry. The standardization and use of a realistic accelerated conditioning technique would reduce testing cycle time, increase the predictability and consistency of test results, and lower testing costs.Originality/valueThis paper was incorporated into an original electronics manufacturer's solderability testing/analysis procedures, and the results are being utilized by the electronics industry solderability specification task groups/committees.

PurposeTo present a new tin plating process which provides deposits having a fine‐grained structure and stable crystal orientation with a combination of properties which are well suited for use as a lead‐free finish on semiconductor lead‐frames.Design/methodology/approachThe new process was designed to produce tin coatings with a deposit grain size ca 20 per cent that of a traditional matte pure tin finish to ensure that the deposit retains good solderability after steam ageing.FindingsThe enhanced solderability from the finer‐grained deposit has been demonstrated and other functionally important deposit properties have been confirmed. A stable single crystal orientation 〈220〉 indicates low whiskering propensity and measurements have confirmed the excellent whisker performance, even without specific whisker‐preventing countermeasures. The deposit has high ductility. Analytical methods are available for all key components to ensure optimum process control. The process has been tested in a continuous production environment for over 12 months with excellent results.Originality/valueThe novel process described in the paper provides tin deposits having a unique combination of properties and with production‐proven capability to be an ideal lead‐free solution as a solderable finish for electronic components.

PurposeTo report on research on the alternative surface finish “direct gold on copper”, including reaction mechanism, methods of deposition and end uses.Design/methodology/approachExamines the deposition reaction of the electroless flash gold plating bath, and the effects of the copper surface roughness and deposition time on the deposit and solderability characteristics.FindingsDirect immersion gold is only partially immersion and mostly electroless in deposition mode. The surface is applicable to soldering for both leaded solder and lead‐free solders. The surface is also wire bondable.Originality/valueThe paper offers details of a new alternative surface finish for use in printed circuit board fabrication as well as in packaging applications. The paper shows the electroless deposition mode of the process. The finish is ideally suited where Rf losses must be minimized. It is suitable for soldering as well as for wire bonding.

PurposeTo study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.Design/methodology/approachElectroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.FindingsIt was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.Research limitations/implicationsThe stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.Originality/valueThe value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

PurposeThe effects of thermal fatigue and printed circuit board (PCB) surface finish on the pull strength, failure modes and reliability of chip scale package (CSP) solder joints were investigated.Design/methodology/approachMechanical pull test, metallographic examination and electrical measurement were used. Tin lead (Sn‐Pb) and lead free (Sn‐Ag‐Cu) alloys were used with Au/Ni and organic solderability preservative (OSP) surface finishes.FindingsThe experimental results showed that the pull strength of the Sn‐Ag‐Cu/(Au/Ni) solder joint did not change noticeably with an increasing number of thermal cycles. However, the pull strength of the Sn‐Pb/(Au/Ni) solder joints drastically degraded and that of the Sn‐Ag‐Cu/OSP and Sn‐Pb/OSP solder joints slightly decreased during thermal cycling. For both Sn‐Ag‐Cu and Sn‐Pb alloys, the solder joint fracture of as‐soldered samples was the main failure mode when an Au/Ni surface finish was used. For the Sn‐Ag‐Cu/(Au/Ni) and Sn‐Ag‐Cu/OSP solder joints, the proportion of component trace tearing considerably decreased, whereas that of PCB trace tearing considerably increased, during thermal cycling. The Weibull lifetimes of the solder joints were increasingly longer in the order of Sn‐Pb/(Au/Ni), Sn‐Pb/OSP, Sn‐Ag‐Cu/OSP, and Sn‐Ag‐Cu/(Au/Ni).Research limitations/implicationsThis was not an exhaustive study and all of the findings are for lead free and tin lead CSP solder joints, which perhaps limits the usefulness of the results elsewhere.Practical implicationsA very useful source of information and impartial advice for engineers planning to conduct a switch from tin lead to lead free technology in their production lines.Originality/valueThis paper fulfils an identified information/resources need and offers practical help to an engineer starting out on an engineering development.

PurposeThis paper describes the different thickness measurement techniques that enable reliable thickness assessments, and the determination of the recommended immersion tin thickness for lead‐free soldering.Design/methodology/approachImmersion tin layers were prepared with systematically varying layer thicknesses. The samples were annealed at different reflow profiles, used in assembly for tin/silver/copper (SAC‐alloy) soldering. The layers were characterized with X‐ray fluorescence, electrochemical stripping coulometry, and by examining the cross sections using a scanning electron microscope. The solderability of the samples was determined with a solder balance (Solderability Tester Menisco ST60) using a SAC‐alloy (melting point 217°C) with T(max) at ΔT=28°C and ΔT=43°C above melting.FindingsIf all pure tin is converted into the Sn/Cu IMC, so that no pure tin is left as solderable layer, the wetting behaviour will decrease dramatically. Especially for multiple soldering processes, two times reflow followed by wave soldering, it is essential to have a pure tin layer covering the Sn/Cu IMC before going to the final soldering process. The required amount of residual pure tin over the Sn/Cu IMC is detailed in several papers. It is stated that a minimum of 0.2 μm of pure tin over the Sn/Cu IMC is absolutely necessary to ensure reliable wetting and solder joint formation. With the current immersion tin thickness recommendation of 1 μm, based on the needs of lead containing solder pastes, a residual pure tin layer will not be evident or thick enough to ensure reliable assembly for multiple soldering with lead‐free temperature profiles.Originality/valueHelps to enable reliable thickness assessments, and the determination of the recommended immersion tin thickness for lead‐free soldering.

This paper describes a state‐of‐the‐art process for immersion tin plating of PCBs which is used to preserve solderability prior to assembly. The process sequence is described and preventive measures for handling the final surface finish is documented. A solderability test method and basic requirements for fluxes and soldering parameters are also described. Quantitative results on the formation of intermetallic tin‐copper phases are shown and their influence on the formation of tin whiskers explained. A problem in production is the precise measurement of the tin thickness, therefore different measuring methods are also detailed. Finally, the mechanism of tin deposition and the formation of tetravalent tin and the relationship with bath age and deposit quality are discussed.

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

Printed circuit boards (PCBs) requiring component attachment, whether leaded or surface mount technology, must have the exposed copper land areas coated with a protective finish. This protective coating must not inhibit solderability and at the same time must act as a barrier for preventing the copper from oxidizing and the inevitable assembly problems that would ensue for the end‐user. Globally, the predominant surface finish in the PCB industry is hot air solder levelling (HASL). Driven by the adoption of solder mask over bare copper, HASL was developed as a reliable method of applying solder to the copper surfaces after solder mask. During HASL, a thin layer of solder is deposited onto the exposed copper by passing the boards through a hot, molten wave (or pot) of solder and subsequently blowing the excess solder from the boards using high velocity hot air. This process has been increasingly under scrutiny due to environmental and safety issues (hazardous waste, lead exposure, etc.), technological limitations (fine‐pitch device assembly) and equipment maintenance cost. This paper reviews the major alternative surface finishes being currently deployed and additionally seeks to give an overall assessment of the broader environmental aspects of such finishes.

It was observed that “no solder” or “skipped solder” defects occurred on a particular printed circuit board assembly product during wave soldering. Investigations were carried out to find out the cause of this defect and to recommend an optimal hot air level coating thickness. To evaluate whether thicker plating helps to produce better solderability, new printed circuit boards with an average plating thickness of 4.27 μm were sent for solderability testing. This increase in plating thickness resulted in no defects in the solderability test. This is in contrast to the current printed circuit board that had a no/skipped solder defect rate of 1,433 ppm due to the thinner plating thickness which was in the region of 2.26 μm. In summary, the investigations made have revealed imperfections in the pad plating, and it is recommended that a thicker or more even plating is achieved during the hot air levelling process at the printed circuit board manufacturing site so as to eliminate no/skipped solder defects that are induced by this printed circuit board deficiency.

This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finishes will show the advantages and superior performance for PCB manufacturer, assemblers and OEMs.

A challenge in selecting and applying lead‐free solders lies in separating the influences of materials' properties, fluxes and processes to obtain robust assembly conditions that are compatible with PCB finishes and all component terminations. This paper discusses simple steps towards establishing a lead‐free assembly process. With reference to results of solder paste spread and wetting tests and component solderability tests, some of the current limitations in applying standard test methods to lead‐free evaluations are highlighted.

A new high performance immersion tin incorporating a co‐deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability data after accelerated aging and extended processing. Studies of SIR, metallic dendritic growth and ionic contamination are included. A final section shows the benefits for fine pitch assembly, including the yield improvements seen at reflow, ICT and final inspection. The reliability questions are answered and conclude that the flat solderable tin process provides a cost‐effective and yield‐enhancing planar alternative to Nickel‐Gold, HASL and OSPs.

A study was performed to develop a different experimental methodology to assess wettabilities of solders on various printed wiring board (PWB) finishes, based on a modified spreading test in which solder pastes were heated following temperature reflow profiles representative of those used in surface mount technology (SMT) instead of using a fixed rate temperature ramp. Three solder alloys (Sn63‐Pb37, Sn96.5‐Ag3.5, and CASTINTM: Sn96.2‐Ag2.5‐Cu0.8‐Sb0.5), two fluxes (rosin, mildly activated, RMA, and no‐clean, NC), and seven PWB finishes (Pd, Au/Ni, Ni, Ag, Sn, and organic solderability preservatives: OSP), and bare copper were involved in the study. Better wettabilities were observed in the current study than the results reported in the literature for conventional tests on the same combination of solder alloy, flux, and substrate. The different results in measurement of wettabilities obtained in the current study were attributed to the more adequate heating process allowing flux activation, which reduced reoxidation of solder powders and substrates during the reflow process and thus improved wettabilities of solders. Compared to the results obtained from the popular wetting balance test, the current study demonstrated a more realistic simulation of, and approach to, assessing the wettability of solder for SMT.

Small and low cost unencapsulated SMD plastic film capacitors were manufactured with different terminal metal compositions and dielectric materials. Capacitors made with a polyethylene naphthalate film dielectric were produced using a winding method. The terminals were metallized using the flame spraying process. The terminals of the test capacitors consisted of three different metal layers. The base metal layer, which was aluminum, was coated with brass or copper. The top layer was a sprayed lead‐free, tin‐based solder to ensure the solderability of the terminals. The reliability of the unencapsulated test capacitors was evaluated using standard temperature cycling, humidity storage, and high temperature environmental tests. Solderability and resistance to soldering heat were tested by mounting the test capacitors using the reflow soldering technique. The electrical properties including capacitance, insulation resistance, and dissipation factors at 1kHz and 100kHz were verified.

As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise and reproducible surface finish formation offers reliable solderability, economic and technical advantages for all kinds of PCBs, even for those with the most modern miniaturized structures. The deposition chemistry and ageing properties of the new Organic Metal/tin surface is discussed, based on electrochemical, wet chemical and electron microscopy studies. The results culminate in an almost complete basic understanding of the tin chemistry and the surface finish performance.

This paper presents the defects that occur during the assembly and manufacturing of solder joints in single‐sided insertion‐mount printed wiring boards (PWBs). Each type of defect is discussed, with particular focus on how these defects are related to solderability issues, the mechanisms of failure due to defect‐induced failure accelerators, and the effect of the defect on solder joint reliability.

An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.

A novel tin electrodeposition chemistry and process has been developed at Bell Laboratories, Lucent Technologies, New Jersey, USA. This process produces smooth, satin bright tin deposits which have stable, large grain structures. The deposits contain very low organic content and, as a consequence, exhibit excellent ductility, solderability and reflowability. The chemistry is capable of operating at elevated temperatures over a wide range of current densities, and is, thus, applicable to rack, barrel and reel‐to‐reel operations. All chemical components, including breakdown products are fully analyzable with conventional analytical methods. Extensive bath life studies show that the deposit appearance and material properties, including grain structures, are stable in relation to the age of the electroplating chemistry. In addition, the grain refiners used are highly stable, and have few breakdown products as the chemistry ages. All these features imply a robust process which has been confirmed in various manufacturing environments. This tin electroplating process has been utilized in plating coatings for connectors, solder bumps, PWBs and components for semiconductor applications.

In this paper we present recent studies on the electrochemical migration processes in Ag thin film parallel microstrip lines in MCM(D) structures. The basic concept is applying accelerated local drop‐test of water solutions onto the surface of two adjacent lines, under a given voltage potential. These operational conditions are often met in the interconnection line buses, placed in the top assembly level of multilayered hybrid structures. The subject of investigations are MCM(D) developed on Al‐sheet carrier with internal conducting and isolating layers, produced through unique selective electrochemical anodization of Al and Ta. This technology process also enables the creation of embedded R and C passive components on the base of TaOxN1‐x and Ta2O5 (or Al2O3) respectively. We propose an electrochemical deposition of Ag/Sb alloys on the surface of Al interconnection lines and contact pads to ease the bondability and solderability in chip mounting procedures. The artificially created silver migrated defects and partial shorts are investigated through the high frequency method of coupled transmission lines in order to eliminate the errors and insufficient validity of DC direct measurements.

There is a continuing desire to obtain sacrificial plated coatings that provide ever higher standards of protection. This paper looks at alternatives to cadmium dye to its toxic and carcinogenic characteristics. Alloy combinations with zinc are considered. It concludes that tin‐zinc alloy plating gives excellent corrosion resistance and solderability.

Organic and immersion metallic coatings are being used as a replacement for the hot air solder level (HASL) process. Use of these coatings provides advantages for both the fabricator and assembler. Advantages to assemblers include flatter pads (0.25‐0.5 micron thickness), no limitations on fine pitch or small hole cleaning, and greater solder joint strength. Advantages to the fabricator include lower operating costs, little or no rejects/rework, reduced safety hazard and a more environmentally friendly process. Current problems associated with the organic and immersion coatings include the inability to assess the solderability of the bare copper or the integrity of the coating (organic). These coatings also present a critical concern due to their reduced shelf life and potential inability to survive mishandling in manufacturing. Real time, non‐destructive methods of rapidly assessing the integrity these coatings are currently not available to the electronics industry. Surface Spectroscopy measurement techniques have the potential to measure the structure and characteristics of the organic and metallic coatings, and surface oxides that develop with time and temperature. The measurement techniques are rapid, non‐contact, and relatively inexpensive to make when compared to existing methods. Surface Spectroscopy can also provide critical surface information that is needed to troubleshoot solderability problems. The American Competitiveness Institute in association with the Navy EMPF program is working with several industry partners to develop a usable surface spectroscopy tool that will assess the quality and integrity of the coatings and correlate that reading with a solderability evaluation.

The industry trend towards higher density interconnect on PWBs has caused board fabricators to explore alternatives to the traditional hot air solder levelling (HASL) technology. Problems with pad planarity in the assembly of fine pitch devices with high I/O counts are well documented. Organic finishes based on substituted imidazoles address some of the assembly requirements, as do precious metal finishes such as gold and palladium. However, both types of solderable finish have limitations or undesirable characteristics. This paper discusses and compares other non‐precious metal systems as alternative solderable finishes. Immersion plating processes based upon bismuth and silver have been developed, and the data presented demonstrate that the solderability of these systems is superior to that of organic and palladium finishes. Test results on hole‐fill, solder‐spread and meniscograph (wetting balance) are extensively discussed in this study. Potential concerns over joint reliability and diffusion are addressed. The chemistry of these non‐precious metal systems also affords benefits to the PWB fabricator. These include increased yields, reduced costs and the elimination of soldermask compatibility issues. Considering possible future industry trends, a significant advantage of these materials is their full compatibility with lead‐free solders. Data on compatibility with solder replacements and wire‐bonding technology are also presented.

In recent years, electronic devices have increasingly employed printed circuits produced using electrically conductive adhesives, commonly known as polymer thick films. This method is much more cost‐effective and efficient than other methods of wiring, including those using chemical etching or plating. In the past, the use of metal‐filled polymers as conductors in printed circuit fabrication has suffered from several limitations such as poor solderability, conductivity and adhesion. A new electrically conductive metal‐filled polymer formulation has been developed which overcomes these problems inherent in typical polymer thick film inks. This new product is based on transient liquid‐phase sintering wherein the metallic components of the formulation sinter at a relatively low temperature, resulting in a highly conductive continuous metal network. The sintering is achieved through the interaction of several metallic components with an adhesive‐flux component. The final product is highly conductive, solderab...

A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders on copper and gold ‐nickel plated Kovar ™ using a rosin ‐based, mildly activated (RMA) flux, a water soluble organic acid flux (WS ),and a low residue (LR) flux. The quantitative metric was the contact angle, θc, measured by the meniscometer /wetting balance technique. The first part of the study (Part 1) examined wetting performance following continuous exposure to 25°C prior to testing. Then, a preheating step was introduced into the experimental procedure after flux application, but preceding the actual wettability test in order to simulate a factory reflow process; these results are presented in Part II of this study. Contact angles for the 63Sn‐37Pb solder (215°C) on copper were 22±2° with the RMA flux, 12±5° for the WS flux, and 31±6° for the LR flux. Increasing the 63Sn‐37Pb solder temperature to 245°C improved wettability with the RMA and LR fluxes, but no change was observed with the WS fulx. Theii 96.5Sn‐3.5Ag lead ‐free solder exhibited poorer wettability on copper compared with the 63Sn‐37Pb alloy, with contact angles of 41±2° (RMA), 63±15°(WS) and 39±4°(LR). For the gold ‐nickel plated Kovar™ substrates, the 63Sn‐37Pb solder at 215° had contact angles of 15±3°, 35±6° and 29±6° for the RMA, WS and LR fluxes, respectively. The values were reduced at the higher test temperature (245°). The 96.5Sn‐3.5Ag solder also exhibited good wetting performance on the gold ‐nickel plated Kovar™ specimens compared with copper. Analysis of the interfacial tension parameters, γSF‐γSLand γLF ,exemplified the importance of γLF as well as the condition of the surfaces (γSF ) on wettability performance. A so ‐called ‘combined analysis’ of the 63Sn‐37Pb and 96.5Sn‐3.5Ag wettability data on either copper or gold ‐ nickel plated Kovar™ substrates was used to predict the solder temperature dependence of wettability for the three fluxes and two base materials.

The development and characterisation of a prototype solderability reference standard based on a gold‐plated nickel sample has been described previously. This material has now been tested in an intercomparison with several European laboratories. The results presented here show that a high degree of repeatability is achievable. These results substantiate earlier ones and confirm this material's applicability as a solderability reference material.

Reflow soldering in a controlled O2 atmosphere will lead to practical benefits in the wetting behaviour of solder pastes. The required O2 level and its control depend on the solder paste used and the solderability of the materials to be joined. For a typical application with either fine‐pitch technology, multiple soldering or low residue solder paste, a lack of O2 control can cause soldering problems. Fine‐pitch solder pastes today still do not show an optimum slump behaviour, which is absolutely necessary to avoid bridging between IC leads and to reduce the formation of solder balls during reflow. Using a low O2 atmosphere to reduce these defects can make a difference, but an improved slump behaviour through predrying of the applied solder paste at 50°C or in a low pressure environment will be more effective. Spread of solder is in general better at lower O2 levels, but substantial improvements are only achieved if low residue pastes with low activation levels are reflowed. Even when the low residue paste is compatible with reflow in air, there is still a significant difference found between 20 and 200 ppm O2. Reflow systems which show variations up to 500 ppm in the preheat zones during loading, while maintaining 50ppm in the peak zone, will show non‐wetting or dewetting when a 100 ppm O2 solder paste is used. The visual cleanliness of solder joints is significantly improved at lower O2 levels because the flux residue will be distributed differently over the solder joints. Bridging is initially determined by the slump behaviour of the paste and the alignment of the paste pattern to the pads and the leads, but when the paste of adjacent pads slumps together before reflow, the tendency for the solder to pull back is influenced by the oxygen level. Wetting and spread of the solder on the lands are then an essential factor. All the proven benefits of a low O2 level are not worth the money spent on nitrogen if the consumption necessary to obtain the properly controlled O2 level is very high. When solderability or the solder defect level not an issue the benefits may not represent a value higher than the cost of the nitrogen consumed.

A gold plated nickel solderability reference material has been developed. The as‐plated material has very good solderability, which can be degraded in a controlled manner by heat treatment to form a poorly solderable surface containing nickel oxide. Three heat treatments were used to give four different sample conditions. This allows testing of the wetting balance over a wide range with various IEC fluxes. The material has a shelf life of at least two years which confers two major advantages compared with existing reference material types. First, since no sample preparation is required the material is easy to use and secondly a large batch can be made, so ensuring that reproducibility between various machines and operators is maximised.

The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow atmosphere and the condition of the surfaces to be joined. While these parameters might be expected to influence solder paste reflow behaviour, more subtle effects related to the physical characteristics of the resin/solvent solution have also been observed.

Organic solderability preservative (OSP) coatings are not new. They have been used successfully with aggressive water soluble flux for assembly of through‐hole only PWBs. However, the multiple heating cycles required for mixed technology assembly and use of no‐clean low solids flux (LSF) for wave solder assembly have placed a greater demand on the solderability protection provided by OSPs. Wetting balance and float testing were used to evaluate numerous OSPs as well as the potential for these surface finishes to be used for ‘No‐Clean’ assembly. Although these laboratory evaluations revealed that OSPs are not as robust as SnPb, they did indicate the assembly processes and materials which could work with OSPs. Additional simulated assembly trials with test vehicles confirmed that thick OSP pre‐flux coatings interfere with soldering and that the solderability of surfaces with thin OSPs degrades when heated in an air environment. Since none of the OSPs evaluated outperformed the imidazole currently in use at AT&T, a no‐clean LSF assembly production trial with a mixed technology telecommunication circuit pack was conducted to compare imidazole with hot air solder levelled surfaces. The production trial and laboratory evaluations resulted in the development of an application model. The elements of the application model are not complicated: (1) use thin OSPs, (2) avoid baking, (3) use as aggressive a flux as possible, (4) apply as much flux as possible, (5) apply the flux where you want solder to wet, and (6) use nitrogen inerted processes whenever possible. Combination of these elements has led to the successful implementation of OSPs for no‐clean assembly. Funding for this effort was obtained through the National Center for Manufacturing Sciences (NCMS) Printed Wiring Board Interconnect Program.

Substitution of lead‐free solders in electronic assemblies requires changes in the conventional Sn:Pb finishes on substrates and component leads to prevent contamination of the candidate solder. Options for solderability preservative coatings on the printed wiring board include organic (azole or rosin/resin based) films and tin‐based plated metallic coatings. This paper compares the solderability performance of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal cycling conditions. It is shown that the solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn‐Cu intermetallic phases as long as the intermetallic phase is protected by a surface Sn layer. For a nominal tin thickness of 60 ?inches, the typical thermal excursions associated with assembly were not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to elevated temperatures, in the presence of humidity, promoted heavy tin oxide formation which led to solderability loss. In contrast, thin azole films were shown to be more robust to humidity exposure; however, upon heating in the presence of oxygen, they decomposed and led to severe solderability degradation. Evaluations of lead‐free solder pastes for surface mount assembly applications indicated that immersion tin significantly improved the spreading of Sn:Ag and Sn:Bi alloys compared with azole surface finishes.

Several effects of the atmosphere in the soldering oven on both the soldering process itself and the soldering results are discussed. Experiments have been undertaken to compare the results of soldering in air and in nitrogen containing 10,100 and 1000 ppm oxygen, in which, e.g., discolouration, wettability, solderability after reflow, solder bridging and solder‐ball formation were investigated. Unmounted FR‐4 testboards with both an RMA solder paste of known high quality and a low‐residue paste were used. Mounted test boards were used to analyse the self‐alignment of components and to compare the levels of soldering defects obtained in air and in nitrogen. The test results show that a nitrogen atmosphere containing 1000 ppm of oxygen or less is sufficiently pure to realise improved soldering conditions for most types of components. For the low‐residue paste tested, 1000 ppm is too high, but 100 ppm is sufficiently low. All effects on the soldering process will depend on the amount of oxygen in the gas. To produce an oven atmosphere of nitrogen with a very low amount of O2 (e.g.

Solderability testing, according to Military Standard 883, has evolved through four sets of different test conditions during the past ten years. These relate to the duration of artificial steam ageing and the utilisation of either mildly activated or pure rosin flux. The European Space Agency (ESA) has experienced few solderability problems with leadless ceramic chip carriers (LCCCs) supporting tin‐lead finished castellations. However, similar packages having gold on nickel plated finishes will only produce satisfactory solderability results when activated flux is applied to samples exposed to steam ageing for eight hours. A reason for poor solderability is given, based on an evaluation of test samples and metallography. It is concluded that tin‐lead finished devices should be subjected to eight hours of steam ageing followed by solderability testing with pure rosin flux. An ESA prerequisite for soldering is that all gold finishes must be removed, possibly with the aid of RA type fluxes. For this reason it is recommended that RA flux is permitted (when necessary) during the standard solderability test.

The emergence of new interconnection technologies involving double‐sided surface mounted components has put stronger restrictions on the method of preserving the solderable finish on printed circuit (PC) boards. The popular Sn/Pb coatings have come under strong scrutiny due to environmental hazards of lead and also because they do not provide flat, planar surfaces for SM assembly. Organic solderability preservative coatings (OSP) are emerging as strong contenders for replacing Sn/Pb surface finishes. Benzotriazole based organic coatings have been successfully used in the past by several electronics manufacturers. However, assembly technologies involving multiple thermal operations have necessitated a fundamental understanding of the thermal stabilities and the mechanism of corrosion protection provided by the OSPs. This paper reports the results of an investigation of the thermal stabilities of two organic corrosion protection coatings. Although both are organic azole based, they operate in two distinct regimes: one forming thin films (∼100 Å) and the other forming thick films (∼5000 Å). The mechanism of surface protection has been studied using direct surface analytical techniques such as X‐ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), scanning transmission electron microscopy (SEM/TEM) and Fourier transform infrared spectroscopy (FT‐IR). The solderability of the copper was measured by wetting balance techniques and correlated to the amount of copper oxidation. The results indicate that, although the thin films provide excellent protection for storage and handling operations, they decompose under heat, thereby causing oxidation of the copper. The thick films appear to withstand multiple thermal cycling. However, the underlying copper substrate can still be oxidised by oxygen diffusion through pores or cracks, or the film may undergo chemical changes that render the copper unsolderable.