1. Micron-to-Submicron Cu electroplating in view of Agile-X LSI Chips Fabrication using Open Facility
- Author
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Shimamoto, Naonobu, Mizushima, Ayako, Bourrier, David, Ota, Etsuko, Higo, Akio, Granier, Hugues, Kosuge, Atsutake, Ikeda, Makoto, Kuroda, Tadahiro, Mita, Yoshio, The University of Tokyo (UTokyo), Service Techniques et Équipements Appliqués à la Microélectronique (LAAS-TEAM), Laboratoire d'analyse et d'architecture des systèmes (LAAS), Université Toulouse Capitole (UT Capitole), Université de Toulouse (UT)-Université de Toulouse (UT)-Institut National des Sciences Appliquées - Toulouse (INSA Toulouse), Institut National des Sciences Appliquées (INSA)-Université de Toulouse (UT)-Institut National des Sciences Appliquées (INSA)-Université Toulouse - Jean Jaurès (UT2J), Université de Toulouse (UT)-Université Toulouse III - Paul Sabatier (UT3), Université de Toulouse (UT)-Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique (Toulouse) (Toulouse INP), Université de Toulouse (UT)-Université Toulouse Capitole (UT Capitole), Université de Toulouse (UT), and Renatech Euronanolab
- Subjects
[SPI]Engineering Sciences [physics] - Abstract
International audience; The goal of the Agile-X project at UTokyo d.lab, supported by MEXT X-nics, Japan, is to produce custom logic LSI devices (real silicon) in a very short turnaround time , ideally, in one week. To achieve the goal, d.lab deploys a "structured ASIC" approach. As shown in Fig.1, the transistors and functional building blocks (such as MPU and SRAMs) are prefabricated by a mega-foundry, and only adding a couple of metal wiring layers completes an LSI device. The key process is a chip-scale "back end of the line (BEOL)" fabrication with Q-TAT in Takeda Super Clean Room (SCR), Univ. of Tokyo. Both subtractive (etching) process for wider aluminum wirings and additive (electroplating) process for narrower copper (Cu) wirings are under development. This presentation will mainly focus on Cu wiring process optimization thanks to EU-JP international engineers' cooperation.
- Published
- 2023