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1. Thermo-mechanical modeling of a 3D flip chip fully populated BGA package

Author

Stephan Stoeckl, Tan Ai Min, Foo Mun Yee, Chee Meng Chai, and Heinz Pape

Subjects
Thermal copper pillar bump, Materials science, Semiconductor device modeling, Mechanical engineering, Hardware_PERFORMANCEANDRELIABILITY, Solid modeling, Integrated circuit, law.invention, Stress (mechanics), Reliability (semiconductor), law, Ball grid array, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Flip chip
Abstract

In a flip chip package (FCBGA), the presence of stress arising from the thermal mismatch between different materials is inevitable. It is a challenge for the packaging community to manage these stresses via careful selection of materials and design to achieve optimal performance and reliability of the integrated circuit.

Published
2010

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