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5. Multilayer edge SNS SQUIDs for digital circuits.

6. High-T/sub c/ SNS edge junctions with integrated YBa/sub 2/Cu/sub 3/O/sub x/ groundplanes.

11. Materials basis for a six level epitaxial HTS digital circuit process.

12. Multilayer HTS SFQ analog-to-digital converters.

13. Narrow-band HTS microstrip combiner technology.

14. High-T/sub c/ superconductor-normal-superconductor junctions with polyimide-passivated ambient-temperature edge formation.

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