1. Ca-Doped CuO Diffusion Barrier for High-Performance a-IGZO Transistors With Cu-Based Source/Drain Material.
- Author
-
Chang Kyu Lee, Da Young In, Dong Ju Oh, Sang Ho Lee, Ji Won Lee, and Jae Kyeong Jeong
- Subjects
THIN film transistors ,COPPER films ,SEMICONDUCTORS ,MASS spectrometry ,MICROSTRUCTURE - Abstract
A thermally stable Ca-doped CuO
x (CuCaOx ) diffusion barrier to prevent the migration of Cu to amorphous InGaZnO (a-IGZO) was developed by reactive sputtering and subsequent annealing. Insertion of a 5-nm-thick CaCuOx between the Ca-dopedCu (CuCa) and a-IGZO channel films in the source/drain contact regions provided the resulting transistors with superior charge transport and lower trap density compared to the diffusion barrier-free CuCa/a-IGZO transistors. The fabricated a-IGZO transistors with the CuCa/CuCaOx stack contact exhibited a high mobility of 20.8 cm²/V ⋅ s and an Ion/off ratio of 108. Simultaneously, very stable behavior against the external positive/negate gate bias stress was observed for the a-IGZO thin-film transistors with the CuCa/CuCaOx stack contact. This was attributed to suppression of Cu-related acceptor-like traps due to the conformal formation of CuCaOx film with excellent barrier properties. [ABSTRACT FROM AUTHOR]- Published
- 2018
- Full Text
- View/download PDF