32 results on '"Jalar, Azman"'
Search Results
2. Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope
3. Voltage Bias Enhancement for Leakage Test on Discrete Products to Detect Low Contact
4. Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
5. Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
6. The Effect of Electrolytic Deflash Current on Delamination of Epoxy Mold Compound During Tin Plating Process
7. Elucidation of Metal Etching Defects Through the Experimental Design Process Characterization at Encapsulation and Electro-deflashing Processes
8. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages.
9. Incorporation of Big Data in Methodology of Identifying Corrosion Factors in the Semiconductor Package
10. Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package.
11. Zinc Oxide Nanorod Electrolyte–Insulator– Semiconductor Sensor for Enhanced 2-Methoxyethanol Selectivity.
12. Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds.
13. FDTD numerical analysis of SPR sensing using graphene-based photonic crystal
14. Copper-graphene SPR-based biosensor for urea detection
15. Performance on optical properties of AWG based on SOI demultiplexer and receiver sensitivity in CWDM system
16. Dependency of electrical characteristics on nano gap variation in pinch off lateral gate transistors
17. Effects of thermal cycling on the mechanical properties of gold wire bonding
18. A simulation study of thickness effect in performance of double lateral gate junctionless transistors
19. Numerical investigation of channel width variation in junctionless transistors performance
20. A Study on the UV Photoresponse of Hydrothermally Grown Zinc Oxide Nanorods With Different Aspect Ratios.
21. Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization.
22. Optical properties of zinc oxide films growth on Si substrate via aqueous chemical growth
23. Structural, morphological and photoluminescence studies of SnO2 microparticles
24. Charge collection efficiency measurement system based on Field Programmable Gate Array multipurpose card
25. Radiation exposure induced failure on semiconductor package material
26. Nanoindentation creep analysis of gold ball bond
27. Surface defect on SiC ohmic contact during thermal annealing
28. The re-evaluation of mechanical properties of wire bonding
29. Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
30. Pb-free BGA Solder Joint Reliability Improvement with Sn3.5Ag Solder Alloy on Ni/Au Finish
31. The Effect of Ni Thickness on Mechanical Strength of Pb-free BGA Spheres on Selectively Plated Ni/Au Finish
32. Solder Joint Strength Of Lead Free Solders under Multiple Reflow and High Temperature Storage Condition
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.