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101 results on '"Li, Jinhui"'

36. A learning based 3D reconstruction method for point cloud

Author

Guo Qi and Li Jinhui

Subjects
Computer science, business.industry, Perspective (graphical), 3D reconstruction, ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, Process (computing), Point cloud, 020207 software engineering, 02 engineering and technology, Field (computer science), Feature (computer vision), 0202 electrical engineering, electronic engineering, information engineering, Structure from motion, 020201 artificial intelligence & image processing, Computer vision, Artificial intelligence, business, Computer technology
Abstract

In recent years, with the rapid development of computer technology, 3D reconstruction technology has gradually entered people’s lives. 3D reconstruction is one of the more popular research directions in the field of computer vision. Three-dimensional reconstruction mainly studies the process of how to obtain three-dimensional information based on single-view or multi-view reconstruction. With the growing demand for computers to automatically obtain three-dimensional information of the surrounding environment, the practical application requirements for three-dimensional reconstruction technology are also getting higher and higher. Therefore, how to quickly and efficiently reconstruct 3D models has become an important research topic in the field of computer vision. In view of this practical application problem, this paper starts from the perspective such as Structure from Motion,Clustering Multi-view Stereo,Patch-based Multi-View Stereo and other aspects, and use the learning-based method to match the sift feature points. In this paper, we mainly research on several key technologies in the 3D reconstruction process.

Published
2020

37. Correction of the Relationship between Opticalelectrical Signal and Charge Quantity in Partial Discharge Combined Detection

Author

Li Jinhui, Xie Rui, Chen Jian, Ge Xinyuan, and Junpeng Zhu

Subjects
Imagination, Materials science, Approximation error, media_common.quotation_subject, Electrical equipment, Partial discharge, Particle size, Fiber, Fault (power engineering), Signal, Molecular physics, media_common
Abstract

The internal insulation defects of gas insulated electrical equipment will cause partial discharge (PD). The accurate and effective PD detection has important significance for fault assessment. Using the fluorescent fiber as the PD sensor, the PD of the four typical defects was tested. The relationship between the UHF signal and the discharge amount at different pressures, the relationship between optical signal and the discharge amount at different size defects were corrected. The results show that under different pressures, the UHF signal energy and the discharge square can always maintain a good linear relationship. For different defects, the UHF signal energy-discharge amount increases with the gas pressure. Whether there are defects of different types or different sizes of the same type, there is a good linear relationship between the integral value of the optical signal and the discharge amount. For the free metal particle defect, it is difficult to summarize the law between the particle size and the discharge amount. When the pressure in the simulated cavity is 0.3 MPa, the correction value is compared with the measured value, the relative error of the free metal particles defect is 14.4%, and the relative error of other defects is less than 5%. Taking the smallest size defect in the experiment, the calculated value of the slope k is also compared with the measured value, and the relative error obtained is less than 10%.

Published
2019

45. Monolithic Fully Decoupled Tri-Axis Gyroscope With Lateral-Comb and Low Cross-Coupling.

Author

Xia, Dunzhu, Zhang, Bing, Fu, Bo, and Li, Jinhui

Abstract

Multi-axis integration is important for micro-electromechanical system(MEMS) gyroscopes in the future. In this paper, a monolithic integrated tri-axis gyroscope and interface circuit are designed and implemented. The presented tri-axis gyroscope with single drive and multi sense axes is fully decoupled in structure among the drive and sense modes. Quadrature coupling can also be further reduced by the in-plane and out-of-plane correction electrodes. The pitch(roll) structure is designed as a unilateral unequal height comb, which reduces the damping and improves the Q value of pitch and roll modes and simplifies the fabrication process. In addition, the interface circuit adopts a closed-loop drive and open-loop sense circuit, an additional decoupling module that effectively reduces the cross axis sensitivity. Finally, a gyroscope prototype was tested to evaluate its performance. The designed tri-axis gyroscope has low bias instability(1.2821°/h) and good noise performance(0.1635°/ $\surd \text{h}$). The coupling coefficient is even below 1% after adding decoupling modules. Meanwhile, the bandwidth can meet the needs of the gyroscope working in a low-frequency environment. [ABSTRACT FROM AUTHOR]

Published
2021
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46. Shearing strength of temporary bonding adhesive applied to different substrates

Author

Huang Mingqi, Zhang Guopingi, Li Jinhui, Liu Qiang, and Xia Jianwen

Subjects
Solvent, Materials science, Silicon, chemistry, Shear force, chemistry.chemical_element, Gravimetric analysis, Wafer, Thermal stability, Adhesive, Composite material, Shearing (manufacturing)
Abstract

with the development of semiconductor industry, temporary bonding materials become more and more widely used in various process applications, such as wafer thinning, ultra-thin device preparation, thin wafers handing and so on. Different process applications may need different requirements for the application performance of materials. For example, the temporary bonding adhesive may be bonded with different surface of device wafer like gold layer, silicon and glass, which may also show different adhesive property. What needs to be emphasized is that the bonding wafers are easily peeling off with lower bonding strength, which may lead to low yield. And the bonding wafers with higher bonding strength may difficult to be released and cleaned. Therefore, the bonding strength of temporary bonding adhesive applied to different substrates should be considered as a crucial factor for application. There are several methods to release the wafers when de-bonding such as thermal sliding, mechanical peeling, solvent release and laser irradiation. In this paper, UV laser release systems with release layer and adhesive layer was focused. We studied several adhesive materials (both Adhesive B and Adhesive C were modified by Adhesive A) which showed different shearing strength with different substrates such as gold, silicon and glass. The shearing strength was studied by thrust force shearing force tester (DAGE 4000, USA). The chip with the size of 1mm ×1 mm was bonded on the substrates by the same pressure. The study showed that Adhesive C has higher shearing strength on different substrate. In addition, thermal stability was investigated by thermal gravimetric analyzer (TGA/DSC 2, Germany).

Published
2018

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