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Taiwan’s flat panel display manufacturing is famous internationally. Its outstanding manufacturing capability can produce high quality panels in the shortest time. In the production process of flat panel displays, the process yield is the best indicator reflecting the good and bad of manufacturers. The yield is direct. The decision is to the company’s profit and reputation. Add to this, it is also the trust and acceptance of the company’s customers. When the products on the production line are abnormal in quality, the process and equipment engineers must immediately discuss the crux of the problem and improve it. For decomposition of analysis and process management to find out the method, it needs to carry out the problem in linear verification of confirmation whether the problem is a single problem or not. Furthermore, it will produce customer complaints, dissatisfaction with the company, causing the company’s losses. Therefore, using Knowledge Discovery from Data (KDD) to establish a process of big data analysis is core technology in our work. We proposed the improvement process that how to quickly find the variation factor and couple with machine learning. Hence the research is based on data pre-processing, modeling. The experiment shows that we find out the right parameters and optimze them. Finally, the yield improvement was increasing to 66%.

The paper reports on recent advances in heterogeneous material integration using advanced substrate technologies. In particular, direct wafer bonding process and its manufacturing capability are discussed. The results summarize close cooperation between circuit designers, device technologies and advanced substrate manufacturing.

As global markets become more competitive, companies are under pressures to find ways for cutting costs to survive and remain competitive in their respective markets. Therefore, good supplier selection is very important issue in production process and business for cost saving and quality improvement. Most supplier selection models take into account the buyer’s point of view and maximize the buyer’s profit. This does not lead to the best situation for all members of the supply chain. Thus, this study applies analytical hierarchy process (AHP) technique for supplier selection process. In this study, the authors chose 3 main criteria and 14 sub-criteria to evaluate importance level of each criterion in supplier selection process. Following the results, this study finds that product quality, price/cost, and manufacturing capability are the top three supplier selection criteria. Meanwhile, research & development, geographical location, and environment and safety are the least important issues.

Over the years, power semiconductor package evolved from normal density lead frame design to high density lead frame design. To catch up the package cost reduction while maintaining its manufacturing quality, tooling design related to lead frame stamping tool and molding tool become more challenging to semiconductor industry. The mismatch between lead frame and mold tool makers' capability has continuously impact to the unit package with various quality incidents; such as pinch copper (lead burr), package offset and etc. To overcome the quality impact, the manufacturing capability of lead frame supplier and mold tool maker has been pushed to the limit. In this paper, the pinch copper (lead burr) study has been done on the delta assessment between lead frame and mold tool capability limitation such as dimension and tolerances. Both lead frame and mold tool have manufacturing tolerance constraints in order for the package to be free from pinch copper and side lead mold flash occurrence. To understand the manufacturing tolerance capabilities, the measurement method on the mold tooling as well as lead frame has been studied and demonstrated prior to any solution imposed. In addition, dimensions and tolerances were identified and defined based on the coefficient of expansion (CTE) matching between lead frame and mold tool material. Based on the CTE chart, the minimum delta tolerance that is allowed between the two materials was illustrated. After confirming the minimum delta tolerance, this is converted into controllable dimension for both lead frame and mold cavity anti flash. Mold cavity positioning and antiflash dimension has been optimized. New lead frame sample with new control dimension has been manufactured for a feasibility assessment. The feasibility sample showed positive results on pinch copper and side lead mold flash elimination after following the newly defined control dimension. The result was further validated with high volume manufacturing run.

Thin gallium-arsenide solar cells manufactured through epitaxial liftoff can offer high-efficiency, reduced costs and high power to weight ratios. Alta Devices holds world records for terrestrial solar cell and module conversion efficiency for single junction cells. We present the status of Alta's technology and manufacturing capability, with comments on significance for aerospace and mobile applications.

With the continued scaling to emerging technology nodes, modern circuit designs in nanometer era introduce many strict or even unprecedented design constraints and challenges. On one hand, conventional 193i wavelength lithography has pushed to its resolution limit, and the gap between manufacturing capability and design expectation becomes more critical. On the other hand, new metal layer (e.g. middle-of-line layers) as well as new device layer rules become more complex and restricted. We argue that detailed placement is the appropriate stage to consider the emerging manufacturing and design rule constraints. In this paper, we discuss sophisticated design constraints and challenges in emerging technology nodes, and survey the state-of-the-art detailed placement solutions and methodologies to overcome these challenges.

Manufacturing outsourcing has been regarded as a strategic approach to enhance competitiveness of manufacturing enterprises. However, making an outsourcing decision based on historical data and subjective experience in one-of-a-kind production (OKP) is deficient and unpersuasive. Meanwhile, manufacturing capability (MC), comprised of processing capability and production capacity, is the most important factor for outsourcing decision-making (ODM). In this paper, a three-phase description, match and evaluation model of MC is proposed to provide outsourcing decision-making support for manufacturing enterprises. Firstly, a description model of MC is developed based on ontology; then, a four-step match method is put forward to match the processing capability; finally, the evaluation of production capacity is carried out by dealing with the dynamic flexible job-shop problem using the nondominated sorting genetic algorithm II (NSGA-II). A simulation study is analyzed to validate the proposed model.

This paper describes the process integration between pre-clean and poly-silicon (poly) chemical mechanical polishing (CMP) processes that result in the most cost effective manufacturing capability. It is shown how the choice of pre-clean and dryer variables can influence the throughput of the poly CMP process. This indirectly takes away redundant process steps and reduces manufacturing cost. It was observed that different pre-clean process variables result in various surface potential charges and conditions that can influence the polish rate of the poly-silicon during the CMP process.

In recent years, hybrid manufacturing technologies that combine different processes (e.g. additive and subtractive processes) together have gained significant attention. This is due to their ability to capitalise on the advantages of each individual process, whilst minimising their disadvantages. However, there are limited process planning methods that are able to effectively utilise manufacturing resources for hybrid processes. In this paper, a hybrid process entitled iAtractive, combining additive, subtractive and inspection processes, along with part specific process planning is proposed, aiming to provide the designer with greater manufacturing capability and flexibility. This novel process planning approach enables a plastic part to be manufactured in a proper way in terms of process capabilities, production time and material consumption. This approach can be also adopted to remanufacture and reincarnate exiting parts or legacy products into other products. In this paper, the principle and framework of this process planning approach is presented and a test part was manufactured to validate this innovative approach.

According to the characteristics of the equipment manufacturing industry innovation capability, innovation capability to establish the equipment manufacturing industry evaluation index system, using the 2007 National Bureau of Statistics released the seven sub-sectors of China's equipment manufacturing industry, the relevant statistical data to construct a factor analysis evaluation model, of 31 provinces, municipalities, the innovative capability of the equipment manufacturing industry to conduct a comparative analysis of various regions to obtain equipment manufacturing innovation capability comprehensive evaluation and sorting order of precedence of the situation, then the analysis results of the corresponding conclusions. Finally, according to China's equipment manufacturing capability of independent innovation and strong performance in a targeted manner proposed to increase the innovation capability of China's equipment manufacturing industry recommendations.

The reservoir with crack and low permeability always has obvious stress sensibility, by introducing the concept of permeable module, the mathematical model of transient seepage flow about vertical fracturing well of limited stream guidance in the reservoir with crack and low permeability has been established with considering the influence of stress sensibility by using the method of mass conservation and elliptical flow, and the curve of productivity trend has been drawn. The characteristic of the curve of productivity trend has been analyzed, at the same time, the influence that the deformation of media, elastic accumulated energy ratio, interporosity flow coefficient, the ability of crack stream guidance and skin effect make on the curve of productivity trend has been analyzed. The mathematical model of transient seepage flow can be applied in the analysis of test borehole and manufacturing capability of interstitial reservoir with stress sensibility.

Harmony theory summarizes and abstracts the mechanism of social economic development. Using harmony theory to analyze the harmoniousness of virtual enterprise, it can realize the co-adaptation degree more between enterprises which compose to a virtual enterprise set and improve its success probability. Based on the methods in manufacturing information theory, taking regional small and medium-sized enterprises as application background, the author studies modeling and application of networked manufacturing system, designs the evaluation index system of dynamic alliance, proposes a new kind of evaluation index system based on the fuzzy comprehensive evaluation algorithm, implements the algorithm and synthetic evaluation model of dynamic alliance manufacturing resource based on fuzzy algorithm, studies and evaluates the harmoniousness of dynamic alliance combined with harmony theory and constructs a harmonious, steady dynamic alliance enterprises set. The experiment proves the method in this article has some advantages such as small codes in programming, high precision in evaluation, and so on.

This paper is devoted to set up a measuring module of manufacturing system flexibility with fuzzy set theory via the method of template method. Starting with the hierarchic analysis on the different types of flexibility lie in a unified manufacturing system, with a further analysis on the interrelationship between input and output of the manufacturing system, a module based on the function of degree of membership is built up, and methodology for practical application has been provided. Proofs have been provided to identify the extremum and the monotone descent property of the module. Method of defining the optimized output of manufacturing system as per various levels of its flexibility is also presented. With the help of flexibility-output surplus, it is illustrated that any pursuit of flexibility is based on increasing costs and waste of manufacturing capability.

This paper explores the challenge faced by semiconductor manufacturing facilities to reduce their environmental footprint and avoid regulatory constraints. Wafer fabs continue to increase in size and complexity, while regulatory emissions limits continue to shrink. Focus is on volatile organic compound emissions (VOCs), which pose the most likely constraining air permit limit. Areas covered include common air permit limits and requirements, analysis of VOC sources at a typical semiconductor facility and examples of wins from Intel's VOC reduction toolbox including improved waste management procedures. Finally attention is given to remaining emissions problems and what must be done to ensure future manufacturing capability.

A novel gap fill approach, Integrated Profile Modulation (IPM), with repeating deposition and etch cycles is developed to extend HDP for complete gap fill to 45 nm node and beyond, with established HDP CVD film properties and integration. In this paper, the key aspects of the IPM process, deposition, etch, in-film fluorine and aluminum control are discussed to provide better understanding on gap fill optimization and manufacturing capability.

Reasonably accurate reliability predictions can be made using the procedure contained in MIL-HDBK-217 if enough is known about such variables as the operational environment, equipment design, vendor manufacturing capability, and delivery schedule. There are times, however, when management or others need a more rapid, less costly procedure to assess either vendor-claimed reliability levels or estimate the probable reliability level of a piece of equipment. For more than a decade the author has compared operational performance of aircraft electronic equipment with equipment part count, and the results have been consolidated into a simplified prediction chart. This chart, though perhaps not as accurate as MIL-HDBK-217, can be very useful early in a program to assist in deciding whether additional efforts - such as part screening, failure-free burn-in, thermal imaging, reliability growth tests, or other reliability enhancement techniques - are necessary to achieve desired reliability levels. The chart is also useful in assessing the credibility of a prospective vendor's claim for unusually high reliability in equipment not yet proven in the operational environment.

Over 25 years ago, American Electric Power (AEP) purchased for the John E. Amos Plant, Unit 3, the first of six new 1300 MW units. With a highly coordinated effort utilizing AEP's experience and the manufacturer's design and manufacturing capability, extraordinarily reliable generators were produced which have run for all these years with very little trouble. This paper shows the advantages to be achieved by careful consideration of all aspects of stator winding design in large powerful turbine generators: conductors, wedging, and end winding support. It is shown that when these issues are addressed correctly, 25 years and longer life is a reasonable expectation.

In order to achieve world-class competitive manufacturing capability, the concept of supplier partnerships was developed, with a win-win approach. Total equipment performance, which included process and manufacturing capability, strong vendor relationships, vendor contract maintenance, training, field service support, and continuous improvement methodology, was emphasized. An off-site, nonproduction facility was set up to help develop manufacturable solutions. The equipment set was exercised in the facility to simulate a volume production environment. The purpose of the exercise was to prove that the equipment can meet the intended need. Process and hardware capability of the equipment set was evaluated and documented over a large wafer volume. The result of this methodology was qualified production at high volume. >

Partitioning considerations for systems that contain digital, analog, and memory components are discussed. Optimal partitioning requires consideration of the product features and performance, market size and share of that market, the product life cycle, system price, system cost, and manufacturing capability. The system specification should quantify each of these items. The system specification is a guide for partitioning the system. The optimal partitioning meets all system specifications at the lowest total system cost. >

Microvia technology can allow lower manufacturing cost while offering higher interconnect density. Critical hurdles in actually achieving lower cost depend on design and manufacturing capability. With regard to designs, the degree to which PWB designers take advantage of microvia technology directly translates into cost savings particularly if area reduction can be maximized. Manufacturing capability also impacts the likelihood of cost reduction. Specifically, how panel size is traded off with manufacturing yield has great influence on board cost. This article shows a design case study to show how the tradeoff can be made.

Knowing how well a manufacturing process will fit a new location prior to its transfer is a necessary, but not sufficient, condition for predicting transfer problems. This paper argues that firms must also consider how easy a manufacturing process is to transfer. A pre-transfer tool, tested here in multiple case studies, uses the dimensions of location fit and ease of transfer to provide a means of measuring the fitness for transfer of a firm's manufacturing processes.

While no-clean technologies do reduce adverse environmental impact, their effect on product reliability must be considered. Manufacturers who choose to convert to no-clean materials and processes need assurance that product performance is not adversely affected. Environmental effect, manufacturing capability, and product reliability are all valid criteria for a materials and process selection method.

Entering the era of deep sub-micron, Singapore has put a lot of effort into the development of design and manufacturing capability in the microelectronics industry. The Institute of High Performance Computing has invested in manpower, high-performance computing hardware, and state-of-the-art EDA CAD tools to assist and support local microelectronics industry in applications such as 3D parameter extraction and hard IP migration.

Microprocessor development has evolved from low volume specialty products to high volume process drivers. The requirements of microprocessor technology are unique from other high volume semiconductor products (multilevel metal, high pin count, power requirements, design tools, compatibility, etc.). These requirements have necessitated new and different techniques for technology development and manufacturing capability. This presentation will trace the history of microprocessor development, stress the current differences between microprocessor and other volume semiconductor products and project future trends for this important product.