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37 results on '"Palazzari, V."'

7. A low-cost 24GHz doppler radar sensor for traffic monitoring implemented in standard discrete-component technology

Author

Alimenti, F., primary, Placentino, F., additional, Battistini, A., additional, Tasselli, G., additional, Bernardini, W., additional, Mezzanotte, P., additional, Rascio, D., additional, Palazzari, V., additional, Leone, S., additional, Scarponi, A., additional, Porzi, N., additional, Comez, M., additional, and Roselli, L., additional

Published
2007
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23. Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology.

Author

Alimenti, F., Mezzanotte, P., Tasselli, G., Battistini, A., Palazzari, V., and Roselli, L.

Subjects
SYSTEM-in-a-package, INTEGRATED circuit packaging, MULTICHIP modules (Microelectronics), SYSTEM-on-package, ELECTRONIC systems, ELECTRONIC equipment
Abstract

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package built utilizing a 0.3-mm thick fiber-glass substrate with 3.38 relative permittivity. The contacts between the substrate and the mother board are realized along the package perimeter exploiting 0.6-mm via-hole metalization and half halo shield soldering pad. First, the developed package is simulated and optimized by means of commercial electromagnetic software. Then a prototype is fabricated and measured. The obtained results show that the whole frequency band from DC to 30 GHz can be covered. A packaged 26.5-mm straight microstrip line exhibits an |S11| value better than -12 dB and an |S21| value of about -1.4 dB at 24 GHz. This value is only 0.6-dB worse than that of the unpackaged line. A single-balanced diode mixer and a low-noise amplifier (LNA) for industrial, scientific, and medical applications are then designed. The integration of these building blocks within the PCB package is finally demonstrated and experimentally verified. The packaged mixer shows a 6.8-dB conversion loss. The packaged LNA, instead, features a 9.1-dB gain with a 3.4-dB noise figure. [ABSTRACT FROM PUBLISHER]

Published
2012
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24. 3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology.

Author

Tentzeris, Manos M., Laskar, Joy, Papapolymerou, John, Pinel, Stéphane, Palazzari, V., Li, R., DeJean, G., Papageorgiou, N., Thompson, D., Bairavasubramanian, R., Sarkar, S., and Lee, J.-H.

Subjects
MILLIMETER waves, ELECTRONIC packaging, SYSTEMS on a chip, MICROWAVES, EMBEDDED computer systems, POLYMER liquid crystals, LIQUID crystals
Abstract

Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and μBGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2×1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75 × 35 × 0.2 mm³) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-lntegrated RF and mm wave functions and modules. [ABSTRACT FROM AUTHOR]

Published
2004
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30. Design of an asymmetrical dual-band WLAN filter in liquid crystal polymer (LCP) system-on-package technology.

Author

Palazzari, V., Pinel, S., Laskar, J., Roselli, L., and Tentzeris, M.M.

Abstract

A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5GHz and UNII 5.15-5.85GHz frequency bands, using the novel "dual behavior resonators" technique has been developed. Exploiting the strong second resonant frequency of resonators to realize the filtering response, allows for achieving the asymmetric shape and the good rejection between the two bands. The insertion loss and return loss at the central frequency are -2.4 dB and -15 dB for the 2.4-GHz band, respectively, and -1.8 dB and -10 dB for the 5-GHz band, respectively. The filter has been fabricated using the novel liquid crystal polymer (LCP) based multilayer packaging technology, enabling a low cost SOP implementation. [ABSTRACT FROM PUBLISHER]

Published
2005
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32. Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

Author

Palazzari, V., primary, Thompson, D., additional, Papageorgiou, N., additional, Pinel, S., additional, Lee, J.H., additional, Sarkar, S., additional, Pratap, R., additional, DeJean, G., additional, Bairavasubramanian, R., additional, Li, R.-L., additional, Tentzeris, M., additional, Laskar, J., additional, Papapolymerou, J., additional, and Roselli, L., additional

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