1. Defects’ Shape Influence on the Thermographic Control in Production of PCB
- Author
-
Borislav Bonev and Anna Stoynova
- Subjects
Modeling and simulation ,Printed circuit board ,Computer science ,Thermography ,Quantitative thermography ,Mechanical engineering ,Transient (oscillation) ,Test data - Abstract
Printed circuit board (PCB) hidden defect analysis from thermographic testing data during their quality control or production may help manufacturers investigate and understand why it actually failed. A significant problem, unexplored in depth is the impact of the shape of the hidden defects on the possibility of their correct quantitative characterization. This article examines the impact of the form of hidden manufacturing defects of PCBs on their detection and evaluation using flash, transient and lockin thermography. The influence of the defect shape on information characteristics of quantitative thermography has been studied through thermal modeling and simulation, as well as by real active thermography measurement.
- Published
- 2021
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