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Excess heat capacity in a bolometric detector has the consequence of increasing or leading to multiple device time constants.  The Mo/Au bilayer transition edge sensor (TES) bolometric detectors initially fabricated for the high resolution mid-infrared spectrometer (HIRMES) exhibited two response thermalization scales, one of which is a few times longer than estimates based upon the properties of the bulk materials employed in the design. The relative contribution of this settling time to the overall time response of the detectors is roughly proportional to the pixel area, which ranges between ∼0.3 and 2.6 mm2.  Use of laser ablation to remove sections of the silicon membranes comprising the pixels results in a detector response with a smaller contribution from the secondary time constant.  Additional information about the nature of this excess heat capacity is gleaned from glancing incidence X-ray diffraction, which reveals the presence of molybdenum silicides near the silicon surface which is a consequence of the bi-layer deposition.  Quantitative analysis of the concentration of excess molybdenum, estimated with secondary ion mass spectroscopy, is commensurate to the additional heat capacity needed to explain the anomalous time response of the detectors. [ABSTRACT FROM AUTHOR]

Strategies are explored to reduce the electromagnetic simulation time of electrically large superconducting transmission line structures while retaining model accuracy. The complex surface reactance of an infinite thin-film superconducting sheet is evaluated with the BCS (Bardeen-Cooper-Schrieffer) theory and is used as an input to model the phase velocity and characteristic impedance of finite width transmission line structures. Commercially available electromagnetic simulation software packages are employed for the calculations, and the results are compared with limiting analytic forms from the literature. The influences of line width, metallization thickness, and substrate height on microstrip transmission line propagation are considered in detail, and a scaling approach is presented to compensate for the leading-order effect in numerical simulations. These findings are particularly important near the energy gap of the superconductor due to the influence of the kinetic inductance on the transmission line dispersion. [ABSTRACT FROM AUTHOR]

The fabrication of low-loss wide-bandwidth superconducting vacuum-gap crossovers for high performance millimeter wave applications is described. In order to reduce ohmic and parasitic losses at millimeter wavelengths a vacuum gap is preferred relative to dielectric spacer. Here, vacuum-gap crossovers were realized by using a sacrificial polymer layer followed by niobium sputter deposition optimized for coating coverage over an underlying niobium signal layer. Both coplanar waveguide and microstrip crossover topologies have been explored in detail. The resulting fabrication process is compatible with a bulk micromachining process for realizing waveguide coupled detectors, which includes sacrificial wax bonding, and wafer backside deep reactive ion etching for creation of leg isolated silicon membrane structures. Release of the vacuum-gap structures along with the wax bonded wafer after deep reactive ion etching is implemented in the same process step used to complete the detector fabrication. [ABSTRACT FROM AUTHOR]