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Current automatic colorization systems have many defects such as "contour blur", "color overflow"and "color miscellaneous", especially when they are coloring the images with hollowed-out structure. We propose a model based on triple conditional generative adversarial networks, for generator we provide contour image, colored icon and colorization mask as inputs, our network has three discriminators, structure discriminator is trained to judge if the generated icon has similar contour to the input icon, color discriminator anticipates generated icon and the input icon has the similar color style, the function of mask discriminator is to distinguish whether the output has the similar colorization area to the input mask. For the evaluation, we compared with some existing colorization models, also we made a questionnaire to obtain the evaluation of generated icons from different models. The results showed that our colorization model obtain better results comparing to the other models both in generating hollowed-out and solid structure icons.

To provide energy savings and ecological benefits, dimming control is a crucial factor in indoor visible light communication (VLC) system where desired brightness levels can be achieved. General dimming control methods have an adverse effect on communication, e.g., limiting the achievable data rate or degrading the error performance. In this paper, we propose a code-based method weight threshold check code (WTCC), which can achieve dimming control as well as improve spectral efficiency further. Moreover, the proposed WTCC has a low implementation complexity with a simple encoding/decoding structure. Finally, simulations have been carried out in terms of normalized power requirement, spectral efficiency, and error performance, which prove WTCC can provide a balance between the two basic functions of VLC: illumination and communication.

In this study we assessed the impact of adhesive configurations on package-on-package (POP) interface solder joint reliability (SJR). This problem has not been previously well understood and we applied both experimental evaluation and computational mechanics modeling to develop insights into the underlying physics. We found that certain adhesive configurations can degrade POP shock performance very significantly - so significantly that the overall package shock performance with adhesive is lower than one without. This is contrary to prevalent expectation of impact of adhesives on shock capability. These shock degrading underfill and corner glue configurations are where the overall height of the adhesive is low, such that adhesive does not contact POP interface. The reason for this loss in POP shock capability is due to overall stiffening of board-package interface and higher transfer of shock stresses to the POP interface. Further, it was found that, POP shock risk can be reduced with appropriate adhesive configuration, in particular by using a high glue height such that the glue covers the POP interface. The impact of low coefficient of thermal expansion adhesive configuration on POP temperature cycling (TC) was also studied; similar impact of glue height was found.

In order to analyze the performance of surrounding-gate Nanowire (SG-NW) junctionless (JL) FET under various temperatures, this paper introduces the incomplete ionization to modify the original model and presents a new precise model considering temperature effect. By solving surface potential based model, the electronic characteristics are compared with the results of the numerical simulation from three-dimensional device simulation software ISE TCAD.

In this paper, we proposed a novel approach of applying Knowledge-based Qualification (KBQ) to calculate temperature cycle (TC) requirements for Ball Grid Array (BGA)s in a given automotive electronics module. Realistic use (UC) condition temperature profiles were constructed by combining weather data, driver cabin environment, user behavior statistical data, and component thermal behavior. Individual package geometry, solder ball pin map and material properties were incorporated through Finite Element Analysis (FEA) modeling. Direct translation from use condition to KBQ test condition requirement was achieved by using a physics based damage metric - inelastic strain energy density (ISED). We compared KBQ results to Standard-based Qualification (SBQ) results for In Vehicle Infotainment (IVI) and Advanced Driver Assistance Systems (ADAS) automotive modules to demonstrate and explain why KBQ and SBQ differ and why SBQ requirements can be misleading. We also demonstrate how package geometry and material properties impact KBQ, while they are generally ignored by SBQ.

Tip-enhanced Raman scattering (TERS) spectroscopy is a technique that employs near-field enhancement from a metallic nanotip to obtain Raman spectra with spatial resolution surpassing the diffraction limit. It is a useful nondestructive way to investigate the nanoscaled semiconductor films. In this paper, TERS technique is used to study the structural and functional properties of nitrogen doped 4H-SiC films. From the same TERS first-order Raman spectra obtained at several locations in 4H-SiC, we were able to reveal a good and uniform crystalline properties in nitrogen doped 4H-SiC. The spectra from tip-on experiments are nearly consistent with that from tip-off experiments. However, by the true near-field component obtained by subtracted tip-off experiment spectra from tip-on experiment spectra, we can see that not all Raman modes have the tip-enhanced effect. In TERS first-order spectra, E2(TO), A1(LO) and E1(TO) modes were enhanced and confined; in TERS electronic Raman scattering from nitrogen in 4H-SiC, Nc and Nd modes were enhanced; in second-order Raman spectra, the overtone modes b, c, d and e were enhanced. But the reason of enhanced effect of these modes is not very clear yet.

In this paper, we present a technique to remove the noise of a depth map while fill the missing regions of the depth map. Generally, the depth map is degraded during the sensing process, thermal noise, the condition of the atmosphere, and the occlusion by the objects. Different to the previous works which only adopt the joint image filters directly, we propose an automatic multi-resolution approach with a probabilistic Bayesian model to remove the noise of the depth map while fill the missing regions. Our model is based on the joint guided filtering and cascaded with a messing-passing technique called belief propagation. As compared to the state-of-art joint image filtering and image smoothing, the experimental results demonstrate that our proposed approach is promising.

This paper introduces a new preliminary solder joint fatigue model based on thermo-mechanical finite element analysis (FEA) simulation results and the use of extensive solder joint reliability (SJR) experimental data for ball grid array (BGA) packages. A comprehensive FEA modeling method for temperature cycling (TC) loading was defined based on thorough and detailed convergence studies on modeling approaches, mesh sensitivities, analysis parameters, material parameters, boundary conditions and thermal loading conditions. Extensive reliability data was collected for various package designs, form factors, board thicknesses and testing conditions to demonstrate feasibility. The result is a solder joint fatigue model derived from FEA thermal mechanical modeling results and empirical reliability data regression fitting. Next, this FEA modeling method was coupled with a transient heat transfer method to integrate thermal gradients that exist in actual product use condition (UC) duty cycles. A new UC method is demonstrated based on a common physical damage metric calculated from numerical simulations for UC (with real user behavior data and temperature gradient) and TC (uniform temperature) conditions. The derived SJR fatigue model was combined with the newly developed UC method to establish new TC test requirements based on the actual use condition duty cycling.

In this paper, a user behavior based solder joint reliability modeling approach has been proposed to estimate the design and test requirements for the second level interconnect (SLI) reliability prediction. This approach uses a numerical tool to integrate solder joint creep damage during the actual use condition that was collected from a large user sample size. The resultant damage per time period was then input to the solder joint fatigue model to estimate equivalent damage to testing duration. The is a physics based approach and is expected to provide more accurate product life prediction and reliability performance demand for BGA package designs.

It is well known that corner glue (CG) applied at the corner of BGA packages can mitigate shock and vibration risk in solder joints at the package corners. With certain materials, CG may improve solder joint temperature cycling performance. Based on finite element modeling studies, the effect of CG on package solder joint damage in temperature cycle testing is categorized into two aspects out of plane (OOP) deformation and shear deformation. Corner solder joint OOP deformation is related to the coefficient of thermal expansion (CTE) of the CG. CG also serves to reduce shear deformation in solder joints at package corners. Mechanical models with different complexities were analyzed to demonstrate these two effects.

The device characteristics of Cylindrical surrounding-gate (CSG) 6H-SiC NW FET is investigated in this paper. The results indicate that the surface potential, threshold voltage and the electric characteristics (transfer characteristics and output characteristics) is very sensitive to 6H-SiC nanowire radius, channel length, oxide thickness and temperature. The temperature dependence of CSG 6H-SiC NW FET is also discussed in this paper. When the nanowire radius is decreased, the minimum potential is lowered, the locations of minimum potential moves to the source side and the threshold voltage is increased. When the oxide thickness is increased, the locations of minimum potentials are not changed, but the minimum potentials themselves become larger and the threshold voltage become smaller. The minimum potential increases as the gate length decreases, but the threshold voltage decreased as the gate length decreases. With increasing temperature, the surface potential decreases and the location of minimum potential moves to the source side. The threshold voltage decreases monotonically with temperature. At strong inversion region, the drain current decrease as nanowire radius decreases, but increases as temperature decreases.

This paper developed a novel power harmonic analyzer system based on ARM and FPGA, aiming at reducing the spectrum leakage caused by fixed-frequency sampling. It focused on the design of system architecture, preprocessing circuit, digital multiplier circuit based on FPGA. The comparison of harmonics analysis by using fixed-frequency and frequency tracking samples show that the latter can reduce spectrum leakage error sharply and has higher precision.

[Purpose] We attempted to explore the unique feature of volunteers' motivation in emergency events. [Method] Firstly, the reliability and validity of Volunteer Functions Inventory (VFI) was tested to confirm its applicability in Chinese participants. Secondly, the differences of motivation between Sichuan earthquake volunteers and other three kinds of volunteers (Beijing Olympic Game volunteers, volunteer teacher candidates and Beijing Paralympic Game volunteers) were found using ANOVA. [Results] The results showed that the most important motivation for volunteers in the emergency events was value. They also had relatively higher motivation in the understanding dimension compared with other kinds of volunteers. [Conclusion] The findings suggested the existence of multi-motivation in volunteers of emergency events and the organizations should pay more attention to volunteers' value and understanding motivation during the process of management. The organizer should provide the opportunity to express volunteers' personal value and to learn and exercise their knowledge, skills, and abilities through their volunteering experience.

We investigated phosphorus (P) adsorption-desorption behaviors on the airborne dust (Y1，collected during a sandstorm in Hohhot) and the desert particles (Y2、Y3 and Y4，collected from the deserts in western Inner Mongolia，source of the sandstorm) in their affected waters (Yellow River and Bohai Sea) in phosphorus cycle. The fitted experimental data using the improved Langmuir isotherm adsorption models show that the maximum P adsorption capacity Qmax are in the range of 68.493 ~ 357.143 mg•kg-1, with the largest value observed on Y3 (Juyanhai Lake particulate). The Qmax is remarkably correlated with organic matter of the particulates; The zero equilibrium phosphorus concentration EPC0 of P adsorption on Y1 in Yellow River is lower than P concentration in the overlying water (0.028mg•L-1 < 0.0469mg•L-1), while the EPC0 of particulates （Y1～Y4） in Bohai Sea water are higher than the P concentration in their corresponding water. This shows that airborne dust Y1, as a sink, adsorb P at Qingshuihe segment of Yellow River; Meanwhile, it is also as a source to releases P to Bohai Sea. There is a desorption phenomenon in P exchange between the particulates (Y1 ~ Y4) and Bohai Sea.

The aim of this study is to investigate erectile response to injection administration of Epimedium brevicornum Maxim (EbM) and its power spectral analysis in rats. Adult male Sprague-Dawley (SD) rats were used in this study. Under pentobarbital sodium anesthesia, the penile Intracavernous pressure (ICP) was monitored. Intracavernous administration of doses 3000 mug/0.1 mL of EbM extract was done. Continuous power spectral analysis of electrocardiogram (ECG), blood pressure (BP) signals .Frequency-domain analysis of the stationary RR interval, systolic pressure variation was performed to quantify the high-frequency power (HF), low-frequency power (LF)-to-HF ratio (LF/HF), and normalized LF (LF%) of Heart Rate Variability (HRV), Blood Pressure Variability (BPV). The results of this study suggest that intracavernous administration of EbM extract may elicit penile erection in terms of a significant increase in ICP in the rat. These results suggest that EbM extract may facilitate decrease sympathovagal balance or to reflect sympathetic modulations activities of the heart and activities penile erection function. But have no significant differences in BPV parameters.