1. Evaluating Interconnection Schemes for Semi-transparent Perovskite Mini-modules
- Author
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Maikel F.A.M. van Hest, Rosemary C. Bramante, Colin D. Bailie, Chris Eberspacher, and Timothy S. Gehan
- Subjects
Interconnection ,Materials science ,Equivalent series resistance ,business.industry ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,Semi transparent ,01 natural sciences ,0104 chemical sciences ,Indium tin oxide ,Electrode ,Optoelectronics ,Degradation (geology) ,0210 nano-technology ,business ,Perovskite (structure) - Abstract
This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.
- Published
- 2019
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