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In this paper, we describe progress in via-formation and processing of thin glass substrates. An advanced temporary bonding approach enables easy handling of thin glass substrates through TGV fill, as well as aggressive downstream processes such as CMP. The formation of TGVs in both aluminoborosilicate and fused silica is discussed, and hermetic, filled vias are successfully demonstrated. Promising simulation results on fused silica validate the usefulness of glass structures in millimeter-wave-frequency antennas.

An integrated directional couplers manufactured in thin glass sheets by a field-assisted diffusion process is analyzed. The Coupler is designed for a simultaneous bidirectional chip-to-chip intercommunication in Electro-Optical Printed Circuit Boards (EOPCBs). A numerical investigation to optimize the designed coupler efficiency is presented using a geometrical optics algorithm. The results are verified by measurements to achieve an optimal coupler structure.

We report a simple and efficient glass microlens fabrication technique by thermally inflating the microcavities on the thin glass slide. Due to the joint effect of high-temperature and vacuum pressure, the microcavities are gradually formed into hollow, transparent, and biconvex microlens. Based on this method, we fabricated a wide range of biconvex glass microlens that diameters from 30 µm to 1 mm on the thickness of 100 µm glass slide at the single and arrays of distributions. We evaluated the microlens morphologies, optical imaging quality, and magnification power.

This work focuses on the development of a silkscreen printing process to be applied for the manufacturing of sensors based on ultra-thin glass substrates. The main target of this project consists in the development of technologies for mechanical flexible electronics and sensors to be used for high temperature fuel cells application. The challenges in this application case exist in harsh environmental conditions and a very low thickness of the sensor. Sensors are required to operate at harsh environmental conditions including chemically reactive ambient and use temperatures above 400 °C. To meet the spatial requirements in fuel cells, a sensor must be thinner than 250 µm. To transfer the deposition technology and the manufacturing on Roll-2-Roll processes is another request of this project. In a first step, a temperature-sensor was designed and tested under atmospheric conditions at 450 °C. The sensor was proven to sustain functional at temperatures of up to 450 °C for test durations of 60 h. Sensors which meet the described requirements and can be manufactured cost-effectively in Roll-2-Roll processes are certainly of interest for many other areas of application.

Microheaters have been extensively investigated for its wide application in designing a Metal Oxide Semiconductor based gas sensor. Indium Tin Oxide (ITO) deposited on a thin glass film can be made use to detect various Volatile Organic Compounds (VOCs) at different elevated temperatures. To achieve this higher temperature requirement, power management is also a very crucial part of gas sensor design. In this paper, four different structures of microheater are discussed. The simulation was carried out using Finite Element Method. The length and structure of the microheater were varied for optimization. From the simulated designs of microheater, the optimized one was calculated by considering two important aspects, power management and uniform temperature distribution over the gas sensitive layer of the gas sensor. Hence this kind of gas sensor design with an inbuilt temperature modulating part shows potential application towards VOC profiling in future work.

Glass substrates with through-glass vias for electronic packaging and radio-frequency substrate applications have been demonstrated in a variety of formats from wafers to panels, yet adoption has been hindered by difficulty in handling thin glass in the fab. In this paper we describe successful processing of glass wafers on silicon handles, using our polymer-free temporary bonding process. One preferred handle is silicon, so that the glass- on-silicon unit is rigid, opaque, and compatible with existing silicon-processing equipment. With the Mosaic bond approach, no adhesive wicks into the glass vias, allowing good via fill. Furthermore, no solvent is required for post-debond cleaning. In this paper, we demonstrate fundamental process capability for implementation of this technology for volume manufacture of glass solutions.

Glass integrated single-mode waveguides were fabricated by ion-exchange in large panel-size low-cost display glass. Propagation losses of 0.059 dB/cm (at 1550 nm) were achieved and a high process homogeneity across a panel was shown by comparison of 25 waveguides. For the first time, 12 spiral-shaped single-mode waveguides with a length of more than 2 meter were integrated in glass. Furthermore, in-plane evanescent field coupling tests were conducted to achieve first optical functions on large sized glass. To achieve higher integration density and more flexible routing, this work presents a layout-based approach to reduce bend radii without increasing propagation losses. Also without changing process parameters, selectively buried waveguides were manufactured to enable localized areas for out-of-plane coupling from EOCB to flip-chip PIC. These results provide a basis for a novel coupling concept - gradient index surface coupling (GISC).

Realizing integrated optical interconnect systems requires optical waveguide components. A promising approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by ion-exchange processes. In this work, constraints imposed by the multivariate manufacturing process for the realization of single-mode input and output structures in multimode-interference-based (MMI-based) optical splitters are elaborated. Corresponding correlations between these constraints and the modeling of the devices are established with respect to not only the modeling of the manufacturing process but also the practical realization of these components.

This work focuses on deposition technologies to be applied for the development and manufacturing of sensors based on ultra-thin glass substrates. The deposition technologies of interest are silkscreen printing, ink-jet printing and physical vapour phase deposition (PVD). In this project, the main target is to develop technologies for flexible sensors to be used for high temperature fuel cells applications. This application case demands for sensors which sustain harsh environmental conditions and which are of very low thickness. Use case conditions involve temperatures above 400 °C and a chemically reactive ambient. The stack design of a fuel cell demands for sensor with a thickness less than 250 μm. Such thin sensors may offer mechanically flexibility which would be of interest for other applications. Furthermore, the aim of the project is to develop manufacturing technologies which can be transferred to roll-to-roll (R2R) processes in future. Finally, not only the deposition of conductor materials but also resistor, insulator and eventually specifically sensitive materials and coatings are subsequent tasks. A use of sensors based on ultra-thin glasses technologies for the described use scenario is not known neither in the state of technology nor in literature. In case of a successful development, such sensor systems would enable an increased fuel cell efficiency due to the ability of in-situ measuring of process parameters. Additionally, ultra-thin flexible sensors which sustain harsh environmental conditions and cheap to produce will be useful in many other applications.

Integrated optical interconnect systems are getting higher attention due to continuously increasing data rates in computer systems. For the realization of these systems, optical waveguide components are needed. One possible approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by thermal diffusion processes. In this work, the constraints imposed by the manufacturing process for the realization of single-mode input and output structures in multimode-interference-based (MMI-based) optical splitters are elaborated. Fundamental correlations between these constraints and the corresponding modeling of the devices are established.

Electronics industry has been very successful in finding size and cost economic packaging forms and strategies. Such standardized packages have not been established for embedding optical or electrical-optical chips, yet. This short proceedings article summarizes some photonic and electronic-photonic assembly realizations and packaging concepts currently pursued at Fraunhofer IZM, in an collaboration with Technical University Berlin.

In this paper, we analyse waveguide bends in optical waveguides manufactured by an ion exchange process in thin glass sheets. The waveguides have large dimensions and are highly multimodal. We adapted concepts for single mode waveguides and improved the design for our application in bidirectional optical couplers. Efficiency calculations were carried out using a ray tracing technique.

In this article we propose integration of optics and electronics using thin panel glass. Several interfacing and integration levels of optical sub-assemblies in electronic systems realized in exemplary system assemblies or suggested conceptually will be described. They consist of proven or currently developed system components and assembly processes on panel level production machinery. Laser-cutting of panel glass enables for fast manufacturing of optical components with on-demand extensions, with complex beam paths and high stability as required e.g. in optical interferometers. Solutions are presented, demonstrating industrial thin glass parts processed from large glass panels to be a very versatile and efficient development and rapidproduction platform.

We propose a low loss graded-index optical splitter based on multimode interference effects (MMI). Even without further improvements of the manufacturing diffusion process, the derived excess and insertion loss suggest a theoretical feasibility for MMI-elements with a graded-index profile.

Multiplate continuum [1] (MPC) is a recent supercontinuum generation (SCG) technique for spectral broadening of ultrashort laser pulses. Compared to the well-established SCG of mJ-level pulses by self-phase modulation in gas-filled hollow-core fibers (HCFs) [2, 3], the MPC uses solid-state media (a set of thin glass plates) and has more relaxed beam alignment and stability requirements. An important advantage of MPC is that it effectively circumvents the limited input peak power of traditional SCG in bulk media, showing great promise for scaling to higher pulse energies and peak power compared to HCF-based compression.

Bidirectional optical transmission on one single waveguide saves space on the board level. Firstly, we propose an analytic model of the manufacturing process for our specific application, as numerical solutions lead to a huge demand of memory, which limits the modelling and analysis. Secondly, we describe a directional coupler, which separates received and transmitted signals and analyse it with ray tracing method, to find out important parameters, influencing the coupling efficiency. In a last step, we describe possibilities to improve the couplers properties by an analysis of the branching area.

Integrated optical interconnect systems are getting higher attention due to continuously increasing data rates in computer systems. For the realization of these systems, optical waveguide components are needed. One possible approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by thermal diffusion processes. In this work, MMI-based optical splitters are compared to corresponding Y-branch waveguides. The two splitter archetypes are compared with respect to excess loss. Furthermore, fundamental problems of graded-index MMI-based power splitters are presented and discussed.

Fraunhofer IZM and Technische Universitat Berlin in a collaboration show a versatile assembly platform for electro-optical and micro-optical components made from laser-structured thin glass with sizes of 18 × 24 inches (450 × 300 mm2) and larger for economical rapid prototyping as well as automated serial production.

This paper demonstrates, for the first time, 3D integrated passive device (IPD) diplexers on ultra-thin glass substrates for wireless local area network (WLAN) application in mobile devices. The designed LC-based diplexer was composed of a low-band filter and a high-band filter, built on ultra-thin glass substrates. The two filters were designed on each side of the glass substrate and interconnected by through-package-vias (TPVs) to form a 3D IPD. Ultra-thin and low-loss dryfilm dielectrics were utilized for improved electrical performance as well as to achieve high-density of passives integration. The demonstrated 3D IPD diplexer is 3-4X thinner than current LTCC devices, with lateral dimensions of 1.1mm x 1.3mm in a thickness of 200µm resulting in a low insertion loss of less than 1dB for pass bands and more than 24dB stop-band rejection.

This paper presents the modeling, design, and demonstration of an ultra-miniaturized 2.5D optical transceiver module using ultra-thin glass interposers with electrical and optical through vias. The 3D Glass Photonics (3DGP) technology with double sided attach of electrical and photonics ICs can achieve ultra-high bandwidth with improved power efficiency at lower cost than other photonic integration such as silicon photonics and organic boards. Thin glass substrates with 60um diameter through vias were fabricated with copper plated electrical vias and polymer-filled optical vias, formed simultaneously. Re-distribution layers were fabricated on top of these integrated vias for electrical interconnections. The 2.5D optical module produced this way features flip-chip bonded VCSEL and driver chips. Initial measurements of the optical vias showed 1.2 dB of loss.

This paper presents the first demonstration of an ultra-thin glass BGA package that is assembled on to mother board with standard SMT technology. Such a package has many new advances that include ultra-thin glass, high speed through via hole formation and copper metallization, double-side RDL wiring with advanced 3 micron ground rules, and Cu-SnAg microbump assembly of a 10mm silicon test die. Glass, as a package, overcomes the shortcomings of organic packages in bump pitch, CTE mismatch to Si and warpage and silicon interposers in electrical performance and cost. Glass packages are being developed to manufacture both as wafers for improved performance over Si and as panels to improve bump pitch over organic packages. Glass, therefore, is not just a high performance and low volume technology, like silicon interposers, but a pervasive package technology with lower cost, higher performance and thinner than silicon and organic packages. Glass has compelling benefits in thickness and I/O pitch reduction and reliability for one of the highest volume applications, namely, the packaging of high I/O logic devices for smart mobile systems. This paper represents a paradigm shift in ultra-thin packages using large glass panels for future smart mobile and high performance devices, and the first demonstration of 100um thin glass packages with 50-80um c hip-level I/O pitch and 18 mm × 18mm body size surface mount assembly at 400um pitch.

Conference Code:98366; International audience; This paper addresses the issue of producing localized tactile stimuli on a transparent surface. An approach based on time reversal of acoustic waves is presented and implemented on a thin glass surface actuated by piezoelectric transducers located at the periphery. The physical performance measurement, completed by a user study demonstrates the ability to provide localised and perceivable tactile stimulation.

Through silicon via (TSV) containing interposers have been widely discussed and applied to Three-Dimensional Stacked Integrated Circuit (3D-IC) integration. Advanced silicon interposers could be derived from three essential technologies: frontside multi-level-metallization, through-substrate-via and backside metallization. The approaches used for these technologies depend upon the application requirements, especially for the TSV technology. Process development, optimization, and cost still remain as the main issue to the industry.

We present the design, simulation, fabrication, and characterization of a novel flexible optrode for deep brain light delivery and collection. The optrode has an annular cross-section for light guiding consisting of a transparent polymer in combination with ultra thin glass, and is fabricated by a unique process we developed: V-groove guided capillary assembly. The optrode design addresses a major limitation on the length-to-diameter ratio. In addition, the optrode can provide crack-free operation during tissue insertion and/or prolonged studies.

After the establishing of lapping trace equation with planet mechanism, based on the simulated trace distribution state, the problems about the lapping trace density were analyzed, and the machining parameters were chosen by the method of numeric calculation, then the objective of lapping the work-piece such as: silicon slice, thin glass sheet etc. uniformly and with high speed can be obtained.

The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.

The concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented. An ion-exchange process was developed to manufacture the graded index waveguides in thin-glass sheets. Besides of their excellent optical properties no mechanical structuring is necessary for the waveguides. Their properties were simulated and experimentally validated. The circuit board assembly is presented, as well as the concept developed for the optical coupling in the module-to-board and board-to- backplane coupling, and the assembly of the pluggable electrical-optical module itself is described.

The implementation of waveguides in thin glass foils results in graded index multimode waveguides. The paper presents two numerical approaches for modeling signal propagation within such waveguides.

A new optical reading system that can read the fluorescent signals of microarrays on glass slides with large detection area and high sensitivity is proposed. This system uses gratings (1200 g/mm) with several micron thick PDMS film on surface. Normally incident laser was coupled into a thin glass slide by grating coupling and confined in the slide due to the total internal reflection (TIR). The TIR generates evanescent planar wave on the glass surface. The evanescent wave was employed to excite the fluorescent signals in the microarrays. The method takes the advantages of low excitation background, large and uniform detection area.

A dynamic focusing lens having a completely new mechanism that can be miniaturized and allow for a quick response has been developed. This lens is structured to directly transform tie lens shape as crystalline lens of human eyes. The lens comprises two thin glass diaphragms as a refracting surface, transparent working fluid sealed between them, and a micro actuator. When the actuator is driven to push or pull the glass diaphragm at the actuator side, the other glass diaphragm is transformed into the lens shape (convex lens or concave lens) having various curvatures. The dynamic focusing lens shows quick response up to 150 Hz, because the lens does not have rotating nor sliding mechanism which are usually used in conventional focusing mechanism.

Summary form only given. Recently, there has been increasing interest in chalcogenide glasses (ChG) due to their possible applications in optical telecommunications. For example, ChG have been used to make Bragg gratings and optical switching devices. In this paper, we report the first demonstration to our knowledge of the creation of a large second-order nonlinear susceptibility /spl chi//sup (2)/ in As/sub 2/S/sub 3/ chalcogenide glasses.

While the electrical insulation industry has been fortunate in the number and quality of new material developments over the past several decades, (epoxies, silicones and polyimides to name a few) most material and product improvements have been a series of minor changes. One of the more recent steps in this evolution has been the development and commercial adoption of “GEMAT,”* a composite of a bonded and relatively thin glass mat with reinforcement of glass yarns, cloth or organic film. The glass mat alone is of limited value, but can be readily incorporated into a wide variety of composite structures used in the electrical industry.