1. Low-cost TSH (through-silicon hole) interposers for 3D IC integration
- Author
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John H. Lau, Chau-Jie Zhan, Chun-Hsien Chien, Ming-Ji Dai, Ra-Min Tain, Ming-Jer Kao, Yu-Mei Cheng, Pai-Cheng Chang, W. L. Tsai, Sheng-Tsai Wu, Yu-Lin Chao, Ren-Shin Cheng, Heng-Chieh Chien, Li-Ling Liao, Zhi-Cheng Hsiao, Yuan-Chang Lee, Ching-Kuan Lee, Yu-Wei Huang, Wei-Chung Lo, and Huan-Chun Fu
- Subjects
Materials science ,Fabrication ,Silicon ,business.industry ,Emphasis (telecommunications) ,chemistry.chemical_element ,Three-dimensional integrated circuit ,Hardware_PERFORMANCEANDRELIABILITY ,Temperature cycling ,Shock (mechanics) ,chemistry ,Chip-scale package ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,Interposer ,Optoelectronics ,business - Abstract
In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure.
- Published
- 2014
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