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1. Study of microvia filling process based on multi-physical coupling

Author

Yuanming Chen, Shidong Su, Wei He, Hexian Nie, Linxian Ji, and Ai Kehua

Subjects
Coupling, Microvia, Interconnection, Materials science, 020209 energy, Metals and Alloys, Process (computing), Mechanical engineering, 02 engineering and technology, Surfaces and Interfaces, Condensed Matter Physics, Surfaces, Coatings and Films, Printed circuit board, Mechanics of Materials, 0202 electrical engineering, electronic engineering, information engineering
Abstract

The microvia filling process used in the high-density interconnect printed circuit board manufacturing industry was investigated by multi-physical coupling technology. To achieve a perfect ...

Published
2018
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