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Your search keyword '"Q.L. Wang"' showing total 2 results
Start Over Author "Q.L. Wang" Publisher institute of electrical and electronics engineers (ieee)
2 results on '"Q.L. Wang"'

1. Self-learning fuzzy neural networks for control of uncertain systems with time delays

Author

Shanben Chen, L. Wu, and Q.L. Wang

Subjects
Scheme (programming language), Artificial neural network, Neuro-fuzzy, Computer science, Process (computing), General Medicine, Fuzzy control system, Computer Science Applications, law.invention, Smith predictor, Human-Computer Interaction, Control and Systems Engineering, Control theory, law, Unsupervised learning, Arc welding, Electrical and Electronic Engineering, computer, Software, Information Systems, computer.programming_language
Abstract

We address the problem of control of uncertain systems with time delays. Using the fuzzy logic control and artificial neural network methodologies, we present a self-learning fuzzy neural control scheme for general uncertain processes. In this scheme, a neural network compensator is designed instead of the classical Smith predictor for attenuating the adverse effects of time delays of the uncertain systems. The scheme has been used in control of welding pool dynamics of the arc welding process, and the experiment results show the control scheme available.

Published
1997
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2. A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling

Author

Jihua Huang, Y.Y. Qian, H.Y. Lai, Q.L. Wang, and Y.H. Jiang

Subjects
Surface-mount technology, Interconnection, Materials science, business.industry, General Engineering, Electronic packaging, Fatigue damage, Temperature cycling, Structural engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Dwell time, Shear (geology), Soldering, Electrical and Electronic Engineering, business
Abstract

A damage model of low cycle shear fatigue has been developed in dislocation theory. On the basis of this model, a formula including the factors of thermal cycle temperature, dwell time, and atmospheric oxidation has been established to predict the life of surface mount technology (SMT) solder joints under thermal cycling. This formula has been verified by experiments on the specimens of actual SMT assemblies. The results show that the life formula established coincides with the experimental results. >

Published
1992
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