Search

The implementation of backhauling links poses several challenges to the designers which are requested to limit the hardware costs in the framework of complex millimeter wave radio systems. This work presents a monolithically integrated E-band I/Q receiver covering the whole bandwidth from 71 to 86 GHz. The chip was implemented in a 55 nm SiGe BiCMOS technology which allows reaching a high level of integration. The receiver is based on a Low Noise Amplifier (LNA) stage and a Variable-Gain Amplifier (VGA) which provide a −11 dBm IP1dB. A double balanced mixer provides I/Q baseband outputs through a reduced-size differential phase shifter which allows to contain the chip size to 1.8 mm2.

This work proposes an 8×8 D-band antenna array constructed from 64 stepped horns. The structure is designed to be machined from single metallic block adhered with an additional bottom metallic cover. The proposed design can be realized using low-cost commercially accessible milling tools. The configuration at hand is composed of three building blocks: transition, power divider and horn radiator. The array footprint has a volume of 30×30×8 mm3 while a 29.5% fractional bandwidth is achieved from 130 till 175 GHz where reflection coefficient is lower than 7.8 dB. Radiation characteristics are investigated for both single horn radiator and 8×8 antenna arrays where the obtained average gain values are 15.25 and 32 dBi, respectively. Directive pencil beam, required for 5G backhauling communication, has been confirmed for 8×8 antenna array where the half power beam width is 1.5° for both E and H-planes while grating lobes appear at 28°.

This paper presents a summary of the project: “Q/V band earth segment Link for Future high Throughput space systems” (QV-LIFT), recently funded in the framework of the EU program Horizon 2020. The project aims at developing up to date hardware and software technologies for the Ground Segment of the future Q/V band terabit Satcom infrastructure.