1. Die attach using silver sintering. Practical implementation and analysis
- Author
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Wissam Sabbah, Cyril Buttay, Régis Meuret, Hervé Morel, Dominique Planson, Amandine Masson, Raphaël Riva, Stephane Azzopardi, Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Laboratoire de l'intégration, du matériau au système (IMS), Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Bordeaux-Université Sciences et Technologies - Bordeaux 1, SAFRAN, Grp Hispano Suiza, SAFRAN Group, FRAE projet EPAHT, and Université Sciences et Technologies - Bordeaux 1-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS)
- Subjects
010302 applied physics ,Materials science ,power electronics packaging ,silver sintering ,[SPI.NRJ]Engineering Sciences [physics]/Electric power ,020208 electrical & electronic engineering ,Metallurgy ,dBc ,Sintering ,02 engineering and technology ,Substrate (printing) ,01 natural sciences ,Silver nanoparticle ,Die (integrated circuit) ,high temperature ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,Melting point ,Electrical and Electronic Engineering ,Silver particles - Abstract
National audience; Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. Currently, several implementations of this technique are available, based on various silver particles sizes and sintering additives. This paper presents a review of the different implementations, and gives practical details about one of them, based on silver nanoparticles. One specific aspect is highlighted: the metal finish of the DBC substrate. It has a major impact on the quality of the sintered joint: with some finishes, the adhesion is excellent (more than 50 MPa), while it is poor with some others (lower than 10 MPa).
- Published
- 2013
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