Search

Ti-6Al-4V alloy is well known for its difficulty in machining due to its ultimate hardness. The temperature generated at the tool-chip interface is typically high which results in poor surface finish and rapid tool wear. The current focus of work was to analyze the influence of response parameters such as cutting speed, feed rate and depth of cut on the surface roughness on the non-textured and textured cutting inserts. Response Surface Methodology (RSM) was utilized to generate the analytical relation between the process parameters and their interaction with the responses namely surface roughness. Analysis of Variance (ANOVA) was implemented to correlate with the significant factors and the correctness of the model. The machining was done experimentally using the textured and non-textured tools and the surface roughness was measured to analyze the influence of process parameters. It was found that the surface roughness was immensely reduced while using microtextured cutting tools.

Copper Zinc Tin Selenide (CZTSe) absorber films were obtained by growing CZT films with simultaneous RF and DC magnetron sputtering followed by thermal evaporation of Selenium. The deposition of CZTSe films was performed with different sputter powers with in-situ and post annealing of the deposited films at 400 °C in order to get uniformity and phase purity. Detailed GIXRD analysis concluded that a phase pure CZTSe film was obtained for in-situ annealed sample with Cu-Sn deposited through RF sputter power of 250W and Zn deposited through pulsed DC power of 200W. In conclusion from Raman scattering measurements, phase pure Raman active A mode of Kesterite CZTSe was observed for the same sample. Compositional analysis by EDS and XPS clearly showed that the CZTSe films are having Cu poor and Zn rich composition, favoring shallow Cu-vacancy which is highly desirable as p-type absorber layers for solar cells. The optical bandgaps (Eg) of the films calculated using Tauc plots were within the reported bandgap value of 1.0–1.35eV. The present deposition approach using hybrid PVD tool helps to control individual fluxes (Cu-Sn, Zn, Se), more precisely without the need of extra selenization step, leading to one step reduction in production process.