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10 results on '"Fu, Jianyu"'

5. An on-chip test structure to measure the Seebeck coefficient of thermopile sensors

Author

Fu Jianyu, Jinbiao Liu, Yihong Lu, Jian Zhang, Huang Peng, and Dapeng Chen

Subjects
Materials science, Mechanics of Materials, business.industry, Test structure, Mechanical Engineering, Seebeck coefficient, Measure (physics), Optoelectronics, Electrical and Electronic Engineering, business, Thermopile, Electronic, Optical and Magnetic Materials
Abstract

Thermopile sensors have a wide range of applications in consumer and industry. Seebeck coefficient is a basic thermal parameter of thermopile sensors. Extracting the Seebeck coefficient of both materials and thermocouple in thermopile sensors is of great importance. In this work, an on-chip test structure is designed. It consists of a substrate, a framework, supporting legs and a sensitive region which has a resistor serving as both heater and temperature detector. A set of on-chip test structures are fabricated along with a thermopile sensor. Its measurement results are analyzed and compared with apparatus measurement results. These results are consistent with each other, and the validity of structure is verified.

Published
2021

7. Fabricating metal structures with taper angles and smooth sidewalls

Author

Chao Zhao, Junjie Li, Xiaobin He, Jiahan Yu, Junfeng Li, Qifeng Jiang, Fu Jianyu, Na Zhou, and Weibing Wang

Subjects
010302 applied physics, Materials science, Mechanical Engineering, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Electronic, Optical and Magnetic Materials, Metal, Mechanics of Materials, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, 0210 nano-technology
Published
2017

10. Design optimization and performance analysis of deformed optical readout focal plane array

Author

Zhigang Li, Dapeng Chen, Fu Jianyu, Qingchuan Zhang, Haitao Shi, Haiping Shang, and Ou Yi

Subjects
Materials science, Cantilever, Pixel, Physics::Instrumentation and Detectors, business.industry, Mechanical Engineering, Bent molecular geometry, Radius, Deformation (meteorology), Curvature, Electronic, Optical and Magnetic Materials, Cardinal point, Optics, Mechanics of Materials, Sensitivity (control systems), Electrical and Electronic Engineering, business
Abstract

An optical readout focal plane array (FPA) usually has a bent cantilever due to the micro-machining techniques. This bent morphology has a strong negative impact on optical sensitivity, which is a key factor that affects the imaging performance. In this study, an optical readout FPA with a stiffener-supported pixel is presented in order to reduce the deformation. The theoretical analysis has been developed to optimize the structure. Based on this, an FPA with a stiffener-supported pixel is fabricated. It is demonstrated that the curvature radius and optical sensitivity can increase by 5 times and 5.74 times respectively with respect to that without a stiffener. Better thermal imaging has been achieved.

Published
2015

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