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β-Ga2O3 metal–semiconductor field-effect transistors are realized with superior reverse breakdown voltages (V BR) and ON currents (I DMAX). A sandwiched SiN x dielectric field plate design is utilized that prevents etching-related damage in the active region and a deep mesa-etching was used to reduce reverse leakage. The device with L GD = 34.5 μm exhibits an I DMAX of 56 mA mm−1, a high I ON/I OFF ratio >108 and a very low reverse leakage until catastrophic breakdown at ∼4.4 kV. A power figure of merit (PFOM) of 132 MW cm−2 was calculated for a V BR of ∼4.4 kV. The reported results are the first >4 kV class Ga2O3 transistors to surpass the theoretical unipolar FOM of silicon.

In this work, we use photoluminescence spectroscopy (PL) to monitor changes in the UV, blue, and green emission bands from n-type (010) Ga2O3 films grown by metalorganic vapor phase epitaxy induced by annealing at different temperatures under O2 ambient. Annealing at successively higher temperatures decreases the overall PL yield and UV intensity at nearly the same rates, indicating the increase in the formation of at least one non-radiative defect type. Simultaneously, the PL yield ratios of blue/UV and green/UV increase, suggesting that defects associated with these emissions increase in concentration with O2 annealing. Utilizing the different absorption coefficients of 240 and 266 nm polarization-dependent excitation, we find activation energy for the generation of non-radiative defects of 1.34 eV in the bulk but 2.53 eV near the surface. We also deduce activation energies for the green emission-related defects of 1.20 eV near the surface and 2.21 eV at low temperatures and 0.74 eV at high temperatures through the films, whereas the blue-related defects have activation energy in the range 0.72–0.77 eV for all depths. Lastly, we observe hillock surface morphologies and Cr diffusion from the substrate into the film for temperatures above 1050 °C. These observations are consistent with the formation and diffusion of V Ga and its complexes as a dominant process during O2 annealing, but further work will be necessary to determine which defects and complexes provide radiative and non-radiative recombination channels and the detailed kinetic processes occurring at surfaces and in bulk amongst defect populations.

We report on n-type degenerate doping in β-(Al0.26Ga0.74)2O3 epitaxial thin films grown by metalorganic vapor-phase epitaxy and modulation doping in β-(Al0.26Ga0.74)2O3/β-Ga2O3 heterostructures. Alloy composition is confirmed using high-resolution X-ray diffraction measurements. Carrier concentration in the thin films is proportional to the silane molar flow. Room-temperature Hall measurements showed a high carrier concentration of 6 × 1018 cm–3 to 7.3 × 1019 cm−3 with a corresponding electron mobility between 53–27 cm2 V–1 s–1 in uniformly doped β-(Al0.26Ga0.74)2O3 layers. Modulation doping is used to realize a total electron sheet charge of 2.3 × 1012 cm−2 in a β-(Al0.26Ga0.74)2O3/β-Ga2O3 heterostructure using a uniformly doped β-(Al0.26Ga0.74)2O3 barrier layer and a thin spacer layer.

Sn and Si are the typical dopants for achieving tunable n-type conductivity of β-Ga2O3 single crystals grown from the melt. Here, we explore Zr doping in β-Ga2O3 as assessed with UV–vis-NIR, Hall Effect, I–V, and CV measurements and hybrid functional calculations. Single crystals were grown from the melt with nominal Zr doping between 0.1 and 0.5 at% using Czochralski and vertical gradient freeze methods in Ar + O2. Our results suggest that ZrGa behaves as a shallow donor, with a measured activation energy of ~10 meV. Our samples show an electron mobility ~73–112 cm2 V−1 s−1, resistivity ~0.08–0.01 ohm cm, and carrier density of n = 6.5 × 1017−5 × 1018 cm3 at room temperature.

We demonstrate zero-bias spectral responsivity in MBE-grown β-Ga2O3 planar UV-C detector with good linearity up to optical power density of 4.6 mW cm−2. Devices with asymmetrical metal contacts were realized on 150 nm thick β-Ga2O3 films on sapphire. The device exhibited a spectral responsivity of 1.4 mA W−1 at 255 nm under zero-bias condition, dark current

We report (010)-oriented β-Ga2O3 bevel-field-plated mesa Schottky barrier diodes grown by low-pressure chemical vapor deposition (LPCVD) using a solid Ga precursor and O2 and SiCl4 sources. Schottky diodes with good ideality and low reverse leakage were realized on the epitaxial material. Edge termination using beveled field plates yielded a breakdown voltage of −190 V, and maximum vertical electric fields of 4.2 MV/cm in the center and 5.9 MV/cm at the edge were estimated, with extrinsic R ON of 3.9 mΩcm2 and extracted intrinsic R ON of 0.023 mΩcm2. The reported results demonstrate the high quality of homoepitaxial LPCVD-grown β-Ga2O3 thin films for vertical power electronics applications, and show that this growth method is promising for future β-Ga2O3 technology.

We report a combination of highly doped layers and polarization engineering that achieves highly efficient blue-transparent GaN/InGaN/GaN tunnel junctions (In content = 12%). NPN diode structures with a low voltage drop of 4.04 V at 5 kA/cm2 and a differential resistance of 6.51 × 10−5 Ωcm2 at 3 kA/cm2 were obtained. The tunnel junction design with n++-GaN (Si: 5 × 1020 cm−3)/3 nm p++-In0.12Ga0.88N (Mg: 1.5 × 1020 cm−3)/p++-GaN (Mg: 5 × 1020 cm−3) showed the best device performance. Device simulations agree well with the experimentally determined optimal design. The combination of low In composition and high doping can facilitate lower tunneling resistance for blue-transparent light-emitting diodes.

We report silicon delta doping in Gallium Oxide (\b{eta}-Ga2O3) grown by plasma assisted molecular beam epitaxy using a shutter pulsing technique. We describe growth procedures that can be used to realize high Si incorporation in an oxidizing oxygen plasma environment. Delta doping was used to realize thin (12 nm) low-resistance layers with sheet resistance of 320 Ohm/square (mobility of 83 cm^2/Vs, integrated sheet charge of 2.4x10^14 cm^-2). A single delta-doped sheet of carriers was employed as a channel to realize a field effect transistor with current ID,MAX =292 mA/mm and transconductance gM = 27 mS/mm., Comment: 5 figures

We report controlled layer-by-layer removal of large-area, sulfurized, single-crystal molybdenum disulfide (MoS2) films using a digital etching technique, which utilizes oxidation and removal of the oxidized layer. We demonstrate a self-limiting oxidation process where Mo oxide covered the surface of MoS2. A constant etching rate of one monolayer/cycle and the uniformity of the etching process were also verified. We show that the etching of an integer number of MoS2 layers can be precisely controlled. No noticeable film quality degradation was observed after multiple cycles of digital etching, as confirmed by Raman mapping of the ratio of the and A1g peak intensities.

We report on the cascading of blue light-emitting diodes (LEDs) up to three junctions using low-resistance InGaN tunnel junctions (TJs). At a forward current density of 10 A/cm2, triple- and dual-junction LEDs operated at 9.09 and 6.07 V with total differential resistances of 6.31 × 10−2 and 4.16 × 10−2 Ω cm2, respectively. A significant increase in output power was observed from the triple-junction LED compared to the dual one, showing that all LED layers contribute to the luminescence output. Enabling high brightness at low current, cascaded LEDs can circumvent efficiency droop mechanism.

The utilization of gallium nitride (GaN) in the area of microelectronics continues to increase due to the advantages it offers over other semiconductors. This paper presents GaN as a candidate material well suited for novel microelectromechanical systems (MEMS). The potential of GaN for MEMS is demonstrated via the design, analysis, fabrication, testing and characterization of an optical microswitch device actuated by piezoelectric and electrostrictive means. The piezoelectric and electrostrictive properties of GaN and its differences from common piezoelectrics are briefly discussed before touching upon the device configuration used to implement the microswitch device. Subsequently, the development of two recent fabrication technologies, photoelectrochemical etching and bias-enabled dark electrochemical etching, used to realize the three-dimensional device structure in GaN are described in detail. Lastly, an ultra-low-cost, laser-based, non-contact approach to test and characterize the microswitch device is described, followed by the device testing results.