Search

This chapter contains sections titled: Introduction to Component ?>Lead-Free ?> Issues Moisture/Reflow Impact on Packaged Integrated Circuits Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings Impact of Increased Solder Peak Reflow Temperatures Observations on Profiling for the Lead-Free Reflow Processes IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures Frequency Control Products ?>Lead-Free ?> Cost Impact on Components Packaging Identification of Lead-free Packaged ICs Conclusions Acknowledgments References ]]>

This chapter contains sections titled: Introduction Printability of Lead-Free Solder Pastes Soak Versus Ramp Temperature Profiles Effect of Peak Temperature Versus Reflow Performance Effect of Reflow Atmosphere on Solderability of Lead-Free Solder Convection Versus IR Reflow Ovens Reflow Temperature Delta on Boards and Components Visual Inspection of Lead-Free Soldered Joints Automated Optical Inspection (AOI) X-ray Inspection of Lead-Free Soldered Joints Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow Lead-Free Rework of BGA/CSP Soldered Joints Lead-Free Hand-Soldering Rework In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints Yield Data Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints Conclusions Future Work Acknowledgments References

This chapter contains sections titled: Introduction Tin-Lead Properties and Models Tin-Silver Properties and Creep Data Tin-Silver-Copper Properties and Creep Data Alloy Comparisons General Conclusions/Recommendations Appendix A: Tin-Silver Creep Data Appendix B: Tin-Silver-Copper Creep Data Acknowledgments References ]]>