1. Development and Application of 3D Digital Image Correlation (3D DIC) in Deformation Measurement of Materials
- Author
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CHEN Yajun, SUN Shengjie, and JI Chunming
- Subjects
3D digital image correlation ,deformation measurement ,high temperature environment ,multi-camera DIC ,Motor vehicles. Aeronautics. Astronautics ,TL1-4050 - Abstract
As a non-conduct and whole field measurement method,3D DIC (3D digital image correlation) is widely used in mechanical properties test of many types of materials in varies fields. Compared with other optical measurement methods, it has advantages as automation, simple optical path, strong universality and anti-interference and so on. But it has some problems in the process of application, i.e. the measurement accuracy is uncertain, the high temperature test condition seriously affects the experimental results, and the measurable area of large curvature specimen is limited. This paper gives a general introduction to the application of 3D DIC in the conventional mechanical property test of different types of materials, and verifies its accuracy by comparing with the traditional extensometer measurement results and the finite element simulation results. It focuses on some latest technological progress, such as the high-temperature speckle preparation and multi-camera DIC, as the application of 3D DIC in the high temperature and large deformation measurement is mostly studied. Moreover, it is pointed out that 3D DIC should be further studied for the influence of speckle on measurement precision,the effect of environmental factors, the measurement of micro strain scale and the application in fields of military and biomedical materials.
- Published
- 2017
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