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Hard and brittle materials have excellent physical and mechanical properties and are widely used in the fields of microelectronics and optoelectronics. However, due to their high hardness and brittleness, the machining quality of a workpiece struggles to meet the requirements of practical applications. In order to improve the surface quality of deep-hole machining of hard and brittle materials, this article analyzes the formation mechanism of surface roughness and the exit-chipping width during the drilling machining of hard and brittle materials and establishes a mathematical prediction model for the surface roughness and the exit-chipping width of hard and brittle materials using a trepanning cutter. The experimental study on K9 optical glass machining shows that the surface roughness of the workpiece and the exit-chipping width increase with the increase in feed rate, and decrease with the increase in rotational speed. Through comparison and verification between theoretical and experimental values, the average errors of workpiece surface roughness and the exit-chipping width are 13.15% and 6.73%, respectively. This article analyzes the reasons for the errors. The results indicate that the theoretical model proposed in this article can be used to predict the surface roughness and the exit-chipping width of hard and brittle materials processed under the same conditions, providing a theoretical basis to optimize process parameters to improve the surface quality of the workpiece. [ABSTRACT FROM AUTHOR]

Hard and brittle materials have excellent physical and mechanical performance, which are widely applied in the fields of microelectronics and optoelectronics. However, deep-hole machining of hard and brittle materials is very difficult and inefficient due to the high hardness and brittleness of these materials. To improve the quality and efficiency of deep-hole machining of hard and brittle materials, according to the brittle crack fracture removal mechanism of hard and brittle materials and the cutting model of the trepanning cutter, an analytical cutting force prediction model of hard and brittle materials processed using a trepanning cutter is established. This experimental study of K9 optical glass machining shows that as the feeding rate increase, the cutting force increase, and as the spindle speed increase, the cutting force decrease. By comparing and verifying the theoretical and experimental values, the average errors of axial force and torque are 5.0% and 6.7%, respectively, and the maximum error is 14.9%. This paper analyzes the reasons for the errors. The results indicate that the cutting force theoretical model can be used to predict the axial force and torque of machining hard and brittle materials under the same conditions, which provides a theory for optimizing machining process parameters. [ABSTRACT FROM AUTHOR]

Muskmelon pedicel is the fruit stalk of muskmelon and one of the traditional Chinese medicines, which can be used to treat jaundice, diabetes and neuropathy. However, in recent years, agricultural soil heavy metal cadmium (Cd) pollution has become serious, coupled with the imperfect sales management of herbal medicine, increasing the potential health risk of contaminated herbal medicine in the human body. In this paper, the comprehensive quality of contaminated muskmelon was tested. The results showed that Cd stress significantly inhibited the growth of muskmelon plants, reduced the anthocyanin and chlorophyll contents, and increased the fruit size and sweetness of muskmelon. In addition, heavy metal Cd can also cause oxidative stress in plants, resulting in a series of changes in antioxidant enzyme activities. In the experimental group, the content of polyphenols and saponins increased by 27.02% and 23.92%, respectively, after high-concentration Cd treatment, which may be a mechanism of plant resistance to stress. This paper reveals that the content of bioactive substances in Chinese herbal medicine is high, but the harm in heavy metals cannot be underestimated, which should be paid attention to by relevant departments. [ABSTRACT FROM AUTHOR]